TW200424025A - Method and device for processing surface of flat substrate - Google Patents

Abstract

In the application of the device in accordance with the present invention comprising an air ionization device, an electrode, and an opposite electrode spaced from the electrode, a circuit board is positioned between the electrodes. The circuit board has the accommodating holes or through holes. The electrode generates high voltage of high frequency and the opposite electrode is grounded, whereby electric discharge occurs between them to generate plasma by which the surface of the circuit board is treated, especially cleaning of the receiving hole or through hole of the circuit board.

Description

200424025 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a method for surface treatment of a planar substrate having the characteristics described in the scope of the patent application 丨 the preface part of the invention- The characteristics of the planar substrate surface treatment device, and the application of the surface treatment of planar substrates by air ionization shock _> to produce hair shoulder; _. '': ... [prior art] flat substrates, especially The glass substrate or circuit board must be decontaminated before the coating process or other processing, especially the pollution source must be removed from its surface. The source of the contamination may be residue or grease. In the circuit board, it is necessary to remove the resin surface or the resin pollution source, or remove the pollution source from the through hole or the groove. 2 In addition, the hygroscopicity of the surface of the circuit board, the through hole and the glass base hole, especially Next, before the coating process is performed, improvement is particularly required. [Summary of the Invention] Therefore, the object of the present invention is to create a surface treatment method for a flat substrate having the features described in the preamble of the scope of patent application 1, and a flat surface having the features described in the preamble of scope 4, Substrate surface treatment device, and / or an application method for planar substrate surface treatment by air ionization device 'is solved by the problems faced by this creative technique, especially substrates such as circuit boards or glass substrates It needs to be ordered for surface treatment, decontamination or adjustment, and the above hole can also achieve the above

Page 5 ~ 丨 I 丨, 200424025 V. Effect of Invention (2). The above-mentioned object is achieved by the advantageous and better design of the present invention described in the scope of the patent application, which is attached to the patent application. And detailed in: column. And the measures in the scope of patent application :: perimeter Ming, read the content in this specification. To rephrase, please refer to the present invention. According to the present invention, a flat substrate surface, in particular, is processed by air ionization or plasma discharge to generate a high frequency between an electrode and at least one counter electrode. This air ionization or = 0 discharge is formed at least near the surface of the substrate, because. In addition, a high frequency is applied between the electrode and the counter electrode, when the discharge phenomenon exceeds a certain voltage value (the voltage value is subject to different = tone chalk.) The air gap or air humidity between high electricity varies ), At 1, 'like an electrode, and the voltage will drop sharply. In the continuous discharge of J ::: e, the air between the conductive electrodes will produce ionization phenomenon and form = :, the ions will be rapidly transmitted by the voltage between the electrodes, and at least the surface of the substrate will be generated. "Induction phenomenon" and its surface is impaired: roughened or removed. This kind of plasma treatment is also called halo = treatment). Therefore, it can be reached in the grooves and through holes. In addition, ozone can be emitted from the air through the discharge effect, and the inter-molecular, especially organic molecular links can be broken. The separated constituents then atomize with the highly reactive oxygen species of ozone. Therefore, the pollution source can be gasified and eliminated. Furthermore, the surface of the substrate is transparent, and it is made hydrophilic by ionized air. ^

Page 6 200424025 V. Description of the invention (3) (wettability) is improved, so the adhesiveness. In the present invention, the coating can be improved on the other side, especially the electrode, and the process of the present invention requires continuous ionization to continuously pass through the ionization zone. With the present invention, the above-mentioned purpose generator and a high treatment) can be solved. The present invention also has a position of a flat-type conveying plate, and the counter electrode has a long shape or a conveying direction, and therefore has a duty. On the one hand, it is fixed-point rotation or it is set in the patent application of Jiming. The advantage of the high frequency required by the frequency transformer of the present invention is that it is better to arrange it at the base through the present invention. The rod-like shape allows the electrodes to be connected. At least this is the case. The counter electrode is, for example, a plate conveying device. The continuous discharge characteristic of the electrode is also considered as one of the advantages. Finish processing on a surface or a substrate. In addition, the air ionization device produces the substrate device of the present invention and the air ionization device having the characteristics described in the range 4 almost or continuously. The air ionization device has a high frequency to generate a special plasma treatment (plasma voltage. When the substrate ' Especially the extremely thin circuit board device. The electrode and counter electrode are opposite to the substrate. The electrode is electrically isolated from the outside. The electrode can be disposed across the substrate in a continuous operation process (continuous has the width of the substrate In order to achieve a uniform equal edge position, moderate treatment can be performed. To be fixed, on the other hand, it can be a roller. In addition, 'it can be flat, below or between. The conveying device is used to convey

Page 7 200424025 V. Description of the invention (4) The roller is better, and the substrate must be carried on it, and. A fixed counter electrode is technically designed to be rotated more than the J-wheel in Rongxian County. In a variant embodiment, ‘at least -anti: =. Furthermore, the movable type, especially a rotary type conveying roller, is good, so the conveying roller is used to convey the substrate through the device except for the two electrodes serving as the counter electrode. In addition, according to another embodiment of the present invention, the counter electrode is provided on the substrate, and a rotating roller is preferred, which is electrically abutted against the substrate and passes through the conveying roller of the device of the present invention. Because: = 疋 —used for transportation If it has a conductive #, a surface for the discharge can be formed, except the counter electrode. It can be used for electricity and can be grounded. (In addition, according to different embodiments of the present invention, w is processed, and continuous operation is the best service. ”Different combinations of double-sided into the counter electrode device are achieved. ^^^^^ Further explanation will be made in the following. In the following discussion, the following figures are not used. In addition, the present invention uses an air ion generator and a high-frequency transformer to generate two: ::: frequency dream set # = Γ voltage to process a flat substrate. The surface is the one described in patent scope 12. By the air ionization, through the plasma or electricity, the surface of the circuit board, the property = the wall surface of the through hole, the valley hole or the groove Improvements can be made in the area. Especially in the process required for the through-hole plating of the circuit board (through hole 1st technology and micro-drilling technology), it can be carried out by a corona. The invention can not only deal with the outer plane Flat surface, also

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The wall surface of the deep part of the substrate can be improved. According to one aspect of the present invention, the surface of the circuit board or the resin pollution source can be roughened or removed. On the other hand, in addition to resin, other non-conductive coatings may be used. This procedure is also performed before the wet chemical process, especially before the desmear process that etches the surface and / or the resin with a permanganat. Similarly, such a two-gas ionization process can also be provided to other non-conductive interposers in the overall technology of the entire circuit board. ^ In addition, for example, the surface of the circuit board can be decontaminated by air ionization, so that the hygroscopicity and adhesion of the coating layer can be changed later. The same applies to the so-called chemical copper coating or Direct electrical & process or direct metallization process. The application of the present invention can be performed before the desmear process and / or the conductive process. Furthermore, the base copper, the palladium (paUadium) thin layer or the copper thin layer in the through hole or the groove The application of the present invention can be carried out before the circuit board is subjected to the electroplating process. Therefore, the hygroscopicity of the circuit board with electricity and degradation can be improved during the electroplating process. In addition, the adhesion of the electroplated layer to the base copper layer or the conductive layer The above and other features of the stomach, apart from the scope of patent application, are also obtained from the following detailed description and illustrations, and individual features can be implemented in the embodiment of the single or multiple combinations of the present invention, especially It is the embodiment described in the scope of patent application in this case. This case is divided into individual paragraphs and intermediaries = this does not limit its general claim for claims because of the scope of patent application in this case.

200424025 V. Description of the invention (6) [Embodiment] 1 pr | and i are a schematic diagram of the air ionization device 11 of the present invention, whose poles 1 to 6 isolators 14 are arranged outside the ring. Electrode 13. Talking about the electrode 13, the anti-plane and the roller 18 should extend through the full width of the base plate 20 "= H f 2 2 on the electrode 1 3 is supplied with a high frequency high voltage 2 3, this is-" A frequency generator and a high-frequency transformer are used to generate it. A grounded counter electrode 16 is provided below the + electrode 13. At the electrodes Rs # of the electrode 13 and the counter electrode 16, Λ a substrate 20 moves from right to left through the conveying roller 18, and the counter electrode simultaneously serves as an additional conveying roller 18, and the substrate 20 is abutted on the counterelectrode 16 'And the supporting force is provided by the counter electrode 16 and is forwarded. In addition, the rotating counter electrode 16 and the conveying roller 18 need to achieve synchronous rotation. The substrate 20 may be a circuit board or a glass substrate, and the substrate 20 is preferably an electrical-circuit board ', especially because in many cases it is necessary to have perforations. One side of the base plate facing the electrode will be processed, and this is also a single-sided processing method. FIG. 2 is a schematic diagram of a modified embodiment of an air ionization device 11 1 ′, which includes a fixed electrode 丨 丨 3 surrounded by an isolator 1 丨 4. A fixed and grounded counter electrode 116 is also provided below the electrode 113. Both sides of the substrate can be discharged, so that both sides can be processed. In addition, there is also provided a driven conveying roller 118, and a substrate 1 20 is abutted against it and is forwarded by the wheel. This substrate 丨 2 is also passed through between the electrode 11 3 and the counter electrode 116 as shown in FIG. 1. ‘Figure 3 is a partially enlarged view of Figure 2, and the substrate 12 has

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The valley hole 124 and the through hole 126. This is a well-known technique in the field of circuit boards, and is particularly applied to through-hole plating where substrates are stacked on top of each other. The accommodating holes 124 and the through holes 26 can be disposed on the upper and lower sides of the substrate 20. Moreover, they can also be straight, inclined, opposite or extended design. The receiving hole 124 and the through hole 126 each have a side wall 28, and the receiving hole 24 is additionally provided with a bottom of the hole surface which is also a wall surface 30. The side wall 128 and the hole bottom 130 must be sources of pollution. Since the accommodating hole 124 and the through hole 126 often have only a small diameter, it is particularly suitable for the method of the present invention to be applied to the cleaning effect. In the receiving holes 24 and the through holes 26, an ionization or plasma discharge effect is formed. Therefore, especially after they are gasified, the pollution source can be driven out. FIG. 4 is another modified embodiment of the air ionization device 2 1 1. Electrodes 2 13 are provided on the upper and lower sides of the substrate 22 0. In principle, the structure is the same as that described above, and a predetermined high frequency and high voltage 223 is applied. The counter electrode is a transmission roller 21 6 and is grounded. Through contact with the surface of the circuit board 22, the surface of the circuit board can also be grounded and used as a counter electrode. A plasma cloud is formed between the electrode 213 and the surface of the circuit board 220, respectively. Therefore, during substrate passing, both the upper and lower sides have a processing effect, so it is a double-sided processing type. Function According to the embodiment shown in Fig. 1, only one side of the substrate can be processed. In the embodiment of FIGS. 2 and 4, the substrate has a double-sided processing effect.

Page 11 200424025 V. Description of the invention (8) By applying high frequency and high voltage 2 3 to the electrode 3 in the conventional technology, 'formed between the electrode 3 and the counter electrode 6 on the top side of the substrate 6 An air ionization or plasma discharge 22 effect. The plasma discharge 22 occurs or acts on the upper surface of the substrate 20. The same applies to the grooves on the surface of the receiving hole 24 or the through hole 126. Therefore, the above-mentioned single-sided processing effect can be achieved on the surface or the substrate. In the embodiment of FIG. 2 and FIG. 4, a corona discharge is formed between the bottom side of the electrode 3 and the bottom surface of the substrate 120, and then ir causes air ions therebetween. The plasma cloud is formed and formed, so the effect of double-sided processing can be achieved. This plasma cloud can achieve the purpose of the substrate surface and groove treatment described in the invention. Regardless of the grounded counter electrode 16 and other types of movement, its work can even be abutted on the surface of the circuit board. It can be used as a counter electrode or directly connected. 116, 216 are fixed or rotating or can not be affected. . The surface of the counter electrode or the surface of the circuit board itself is also 0, but the above is only used to limit the scope of the present invention. The equivalent changes and modifications are only the preferred embodiments of the present invention, and are not all covered by the patent scope of the present invention made according to the scope of patent application of the present invention. 200424025 Brief description of the drawings [Illustration of the drawings] Fig. 1 is a circuit board processing device that implements air ionization and has a rotating counter electrode in the present invention; Fig. 2 is a modified embodiment of Fig. 1 which shows A circuit board processing device with a fixed counter electrode; FIG. 3 is an enlarged view of a portion of FIG. 2 and shows that a receiving hole and a through hole are provided in the circuit board; and FIG. 4 is the present invention Another modified embodiment shows a circuit board processing device having two fixed electrodes and a grounded counter electrode having a function of a transport roller. [Illustration of drawing number] 11 Air ionization device 1 3 Electrode 14 Isolator 1 6 Counter electrode 1 8 Conveyor roller 20 Substrate 2 2 Air ionization 23 South frequency south voltage inlet 1 1 1 Air ionization device 1 1 3 Electrode 1 1 4 isolator

Page 13 200424025 Brief description of the diagram 11 6 Counter electrode 11 8 Conveyor roller 1 2 0 Substrate 1 2 2 Air ionization 123 High frequency high voltage 1 2 4 Receiving hole 1 2 6 Through hole 1 2 8 Side wall 1 3 0 Hole surface bottom 2 1 1 Air ionization device Lu 2 1 3 Electrode 21 4 Isolator 2 1 6 Transport roller 22 0 Substrate 222 Air ionization 223 Directional voltage in frequency

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Claims (1)

200424025 1. A kind of method for surface treatment of flat substrate, especially IHIM ^ circuit board surface impurities or improve its appearance ^ removal; characterized by passing through at least one electrode and a high voltage discharge, and by the gas V electrode between Surface treatment is carried out by means of ionization of industrial nymphs and industrial lice. It is characterized in that the high surface or a substrate, and the discharge process can continue β 7 · As in the method described in the scope of patent application 1, the American Electric system is continuous, and is provided to at least one table, especially for processing before and after Many substrates in succession, performers. The method described in the lightning range 1 or 2 is characterized in that it is carried out in a humid air atmosphere and has high active oxygen atoms on the surface of the substrate to oxidize the components of impurities on the substrate. And gasified. Therefore, the device for treating the surface of the main substrate is especially used to eliminate surface impurities or improve the wettability of the surface of the substrate (Wettabiii ty). One of the methods described in the above-mentioned patent applications is characterized by ^ An air ionization device having an electrode and a counter electrode, the substrate is disposed in the range of a pole and a counter electrode, and in addition, the air ionization device has a south frequency generator and a high frequency transformer to generate-the electrode High frequency and high voltage required for high voltage discharge between the two counter electrodes. The device according to claim 4 is characterized by a flat sticker Page 15 200424025 Sixth, the scope of the application for patents one by one ----- The substrates that are guilty of η ▲ are transported through the device, and the% is placed on a plane of the substrate, and the counter electrode is provided on the substrate The upper electrode, in particular, the electrode is located on one of the planes on which the substrate is to be processed, and the reverse electrode is located below the substrate or abuts on the bottom side of the substrate. —6. The device according to claim 4 or 5, wherein the counter electrode is disposed below the substrate at a constant distance, so the bottom side of the substrate is also processed by discharging. 7 The device according to one of the patent application scopes 4 to 6, characterized in that j = i, the counter electrode system is a fixed type, which is preferably in a flat style, especially for the transportation of the " Hai device " The rollers are below or between and are used to transport the substrate through the device. 8 The device according to any one of claims 4 to 6, which is characterized in that 'the counter electrode is a movable type, which is preferably a rotating type conveying roller' and is used to convey the substrate through the device. 9 The device according to claim 8 is characterized in that the counter electrode is abutted against the substrate, and therefore the treatment is performed by a discharge effect between the electrode and the surface of the substrate. 1 0 · The device according to the scope of application patent 9 or 丨 〇, characterized in that the counter electrode is abutted on the substrate in an electrical contact manner, so the counter electrode system Page 16 200424025 = ;; ί 佳 ', especially a device for conveying the substrate to pass through the device 11 as described in the patent application scope 9 or 10, characterized in that an electrode and a counter electrode are arranged on the same side of the substrate, and That is, it can be set on the top side of the substrate and the bottom side of the substrate to achieve the effect of double-sided processing of the substrate. 1 2 · Application of air ionization device, especially according to the one described in the patent application IS 4 -1 1 JL tb ^ "flat, for surface treatment of flat substrates, especially circuit boards', and To exclude impurities on the surface of the circuit board or to improve the hygroscopicity of the surface. 1 3 · The application described in the scope of patent application 12 is characterized by the treatment of the conductive plane of a circuit board, especially the copper plane, And before the circuit board or its surface is electroplated. 1 4 · The application as described in the patent application scope 12 or 13 is characterized in that the application of substrate processing is in the coating process (coat i ng) pr〇Cess) then 'especially before the direct copper metallization process and before the desmear process.' 1 5 · Applications as described in one of the scope of the patent application 2-1 4 It is characterized in that the resin or other non-conductive interposer on the surface of a substrate is roughened or removed. Page 17 200424025 VI. Scope of patent application 16 · The application described in one of the scope of patent applications 1 2-1 5 is characterized in that the substrate has recessed holes on one or both sides, so the recessed holes must be The side wall and / or the bottom surface contact the discharge area to remove the pollution source thereon. 17 · The application as described in the scope of patent application 16, characterized in that the recessed hole is a receiving hole or a through hole, especially a cylindrical or linear shape. Page 18