TW200420618A - Polyimide film, manufacturing method of same, and usage of same - Google Patents

Polyimide film, manufacturing method of same, and usage of same

Info

Publication number
TW200420618A
TW200420618A TW092125231A TW92125231A TW200420618A TW 200420618 A TW200420618 A TW 200420618A TW 092125231 A TW092125231 A TW 092125231A TW 92125231 A TW92125231 A TW 92125231A TW 200420618 A TW200420618 A TW 200420618A
Authority
TW
Taiwan
Prior art keywords
same
polyimide film
ppm
usage
manufacturing
Prior art date
Application number
TW092125231A
Other languages
Chinese (zh)
Other versions
TWI243186B (en
Inventor
Hisayasu Kaneshiro
Takaaki Matsuwaki
Kiyokazu Akahori
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of TW200420618A publication Critical patent/TW200420618A/en
Application granted granted Critical
Publication of TWI243186B publication Critical patent/TWI243186B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
    • B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C41/12—Spreading-out the material on a substrate, e.g. on the surface of a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)

Abstract

This invention relates to a kind of polyimide film, which comprises 3,3',4,4'-benzophenonetetracarboxylic dianhydride and can satisfy physical properties such as mean linear expansion coefficient between 100 and 200 DEG C being above 18 ppm/DEG C and below 28 ppm/DEG C, elastic modulus being greater than 4.5 GPa, and coefficient of expansion caused by moisture absorption being below 13 ppm. Due to fulfilling all of the three physical property requirements, the polyimide film which prevents warping or curling from occurring in the TAB tape and flexile printed circuit board processing steps can be realized.
TW092125231A 2002-09-13 2003-09-12 Polyimide film, manufacturing method of same, and usage of same TWI243186B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002268870 2002-09-13

Publications (2)

Publication Number Publication Date
TW200420618A true TW200420618A (en) 2004-10-16
TWI243186B TWI243186B (en) 2005-11-11

Family

ID=34260173

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092125231A TWI243186B (en) 2002-09-13 2003-09-12 Polyimide film, manufacturing method of same, and usage of same

Country Status (3)

Country Link
KR (1) KR100710099B1 (en)
CN (1) CN1238428C (en)
TW (1) TWI243186B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI377224B (en) * 2004-07-27 2012-11-21 Kaneka Corp Polyimide film having high adhesiveness and production method therefor
CN101506283A (en) * 2006-06-26 2009-08-12 沙伯基础创新塑料知识产权有限公司 Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
WO2008133182A1 (en) * 2007-04-18 2008-11-06 Asahi Kasei E-Materials Corporation Metal-resin laminate
KR101757498B1 (en) * 2010-01-26 2017-07-12 우베 고산 가부시키가이샤 Process and equipment for production of polyimide film
KR101646283B1 (en) * 2011-12-27 2016-08-08 코오롱인더스트리 주식회사 Polyamic acid solution
KR101338328B1 (en) * 2011-12-28 2013-12-09 웅진케미칼 주식회사 Manufacturing Method Of Polyamic acid Composition, Polyamic acid Composition, Polyimide Film And Substrateused For Display Device Using The Same
JP6102918B2 (en) * 2012-04-20 2017-03-29 株式会社カネカ Method for producing conductive polyimide film
CN103374130B (en) * 2012-04-20 2016-01-20 达迈科技股份有限公司 Aromatic polyimide film, preparation method and application thereof
TWI577764B (en) * 2016-06-30 2017-04-11 Low dielectric polyimide insulation coating and enameled wire
CN109486189A (en) * 2018-11-09 2019-03-19 李梅 A kind of TPI film and preparation method thereof for FPC industry
KR102013534B1 (en) * 2018-12-24 2019-08-22 에스케이씨코오롱피아이 주식회사 Polyamic Acid Composition for Display Substrate and Method for Manufacturing Display Substrate by Using the Same
KR102202472B1 (en) * 2019-06-11 2021-01-13 피아이첨단소재 주식회사 Polyimide film and manufacturing method thereof

Also Published As

Publication number Publication date
KR100710099B1 (en) 2007-04-20
CN1502661A (en) 2004-06-09
KR20040024498A (en) 2004-03-20
CN1238428C (en) 2006-01-25
TWI243186B (en) 2005-11-11

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent