TW200416349A - Micro-fabricated electrokinectic pump - Google Patents

Abstract

An electrokinetic pump for pumping a liquid includes a pumping body having a plurality of narrow, short and straight pore apertures for channeling the liquid through the body. A pair of electrodes for applying a voltage differential are formed on opposing surfaces of the pumping body at opposite ends of the pore apertures. The pumping body is formed on a support structure to maintain a mechanical integrity of the pumping body. The pump can be fabricated using conventional semiconductor processing steps. The pores are preferably formed using plasma etching. The structure is oxidized to insulate the structure and also narrow the pores. A support structure is formed by etching a substrate and removing an interface oxide layer. Electrodes are formed to apply a voltage potential across the pumping body. Another method of fabricating an electrokinetic pump includes providing etch stop alignment marks so that the etch step self-terminates.

Description

200416349 V. Description of the invention (1) Related applications This patent application was filed in the Common U.S. Provisional Patent Application No. 6 0/4 1 3, 1 9 4, 2 0 0 2, 9, 2 3 and the title is Micromanufacturing Electric Energy Pump ", Priority is announced under 3 5 USC 11 9 (e). Provisional US Patent Application No. 6 0/4 1 3, 1 94, 2 0 0 2, 9, 2 3 Incorporated here by reference. Scope of the invention The present invention relates to devices and methods for cooling. The device is particularly concerned with an improved electric energy pump having straight and very small micropores and lengths. The pump is manufactured using semiconductor processing technology. BACKGROUND OF THE INVENTION High density integrated circuits have recently progressed to include the ability to increase transistor density and clock speed. The result of this trend is an increase in the power density of modern microprocessors and the need for emerging cooling technologies. In Stanford, two-phase liquid cooling has been studied in 1988, showing that a closed loop system can remove 130 W of heat. The main component of this system is an electric energy pump, which has the ability to flow liquid at a pressure of more than ten m 1 / min below a pressure head of 100 V above an atmospheric pressure. This demonstration is implemented as a liquid vapor mixer in a microchannel heat exchanger, as the insufficient liquid stream therein can capture the heat generated without boiling. The conversion of a small portion of liquid to vapor requires high pressure work. And increase the demand for pump pressure operation. In addition, two-phase flow is less stable during operation of the

Page 8 200416349 V. Description of the invention (2) Causes instantaneous fluctuations and difficult to control the temperature of the wafer. The chestnut in this exhibition is based on a porous glass filter having a thickness of several mm. The disadvantages of these structures are that the micropore density, structure, and average diameter are not uniform, and it is not easy to regenerate in low-cost manufacturing methods. In addition, the liquid path in this structure is curved, resulting in a low flow rate with a fixed pump thickness. Porous porcelain structures with the same characteristics show a large variety of pumping characteristics. Therefore, what is needed is an electric energy pump element that can provide a relatively large flow and pressure in a compact structure, and can provide better uniformity of pump characteristics. The present invention is better than this. Straight relative to the system and the package through for oxygen coupling. Overview Overview The pumped liquid channel is 10 micrometers in diameter and its diameter is relatively large. The pump body is formed on the surface to maintain the pump body. In order to make the liquid to make a motorized plate. The plurality of etched electric energy pumps include a pump body having a predetermined thickness and 1 mm. The pump body includes a plurality of micropores for liquid communication, and each micropore extends from the first outer surface to the second outer surface, preferably from 0.1 to 2.0 microns. The micropores are preferably narrow, short and preferably oxidized. A pair of electrodes with a potential difference applied is at the opposite end of the pump body from the micropores. The pump body is mechanically integrated in its support structure. The energy-efficient method preferably utilizes a conventional semiconductor method technique. The first material of the pump body has a first surface and a second surface. A plurality of micropores are formed. An electrode is formed on one and the second surface of the pump body including the inside of the micropores. A potential flows across the micropores across the electrodes. Another method of pumping includes providing a base stop correction mark having a first surface formed on the first surface. One pump

Page 9 200416349 V. Description of the invention (3): Material f is formed on the first surface. A plurality of microporous support structures are formed in the shape of a material under each etch stop mark. The final structure consists of oxidizing the two remaining materials inside the micropores, and the potential difference applied by the element drives the liquid through the plurality of capillaries. /, Medium% pump Other features and advantages of the present invention will be more apparent from better implementation. Detailed Explanation of Car Father Jiaguan's Example

Consider the best of this matter and the details of each embodiment, and its schematic description. The present invention will be described together with the preferred embodiments, and should be considered as a limitation to these embodiments of the present invention. On the contrary, the present invention intends to describe the embodiments, modifications, and equivalents within the scope of the patent application of the present invention: urgently, the following detailed description and special details of the present invention are disclosed below to understand the present invention. However, it should be noted that the present invention can be implemented without such details. In other cases, well-known methods, steps, components, and circuits are not described, so as not to hinder the characteristics of the present invention. ^ ^ The basic performance of electric energy pumps or osmotic pumps has the following relationship: Q Ψ Γ ε VA / τ μ L (1-2 λ I 1 (a / λ d) / a I 〇 (a / λ d) (1) Δ Ρ-8ε ζ V / a2 (l-2A IKa / λ d / aIo (a / A d)) (2,)

As shown in formulas (1) and (2), Q is the flow velocity of the liquid flowing through the pump, Δρ is the pressure drop of Jiuri, and a is the micropore diameter. In addition, the variable ψ is the fresh porosity of the micropores, Γ is the zeta potential, ε is the permittivity of the liquid, and v is the cross-pore sequence.

Page 10 200416349 V. Description of the invention (4) Voltage, A is the total area of the chestnut, τ is the bending degree, // is the viscosity, and L is the thickness of the component. In the formula (1) and (2), the items in parentheses are when the pore diameter reaches the charging layer, that is, the D e b y e layer; the correction number when the size of L d is only a few nanometers. When the diameter of the aperture is 0.1 mm, these formulas can be simplified as: Q = ¥ ζ / τ. Ε Vk / β L (3) Δ P- 8Γ V / a2 (4) As shown in formulas (3) and (4 ) Shows that the amount of flow and pressure is proportional to the amount that appears, but other parameters can affect the performance of the pump when it appears. For example, the tortuosity τ indicates the length related to the thickness of the pump, and has a non-parallel channel for large pumps. The length L is the thickness ν of the pump element as shown in formulas (3) and (4). The bending degree r and thickness L of the pump element are inversely proportional to the fluid formula (4), and do not appear in formula (4). The diameter of the micropore diameter is inversely proportional to the pressure formula (4) and does not appear in formula (3). Compared with the conventional technology, the pump of the present invention can operate with a greatly reduced voltage, but can still produce the same or greater flow rate without a significant pressure drop. Existing pumps have an average pore diameter of 0.8-1.2 microns. In addition, the existing ceramic pump element has a thickness of 3-4mm and a camber of 1.4-2. 0. A typical conventional electric energy pump has a thickness of 2.5 mm, and can generate a flow rate of 25 ml / min at a voltage of 100 V and a maximum pressure of 1. 00 Atm. In comparison, the thickness of the pump element is reduced by 100 times; the degree of curvature is improved by more than 3 factors; and the micropore diameter is reduced by three times. The reduction of these three factors enables the millet device of the present invention to be operated at a voltage that is ten times lower, and still generates a flow that is ten times larger. The pump element of the present invention can be operated under the following reduced conditions: the diameter of the micro-aperture; the thickness of the pump element; and the curvature of the pump element.

200416349 V. Description of the invention (5) Figure 1A illustrates a preferred embodiment of the pump 100 of the present invention. The pump 100 includes a pump element or a pump body 102 and a support element 104. The pump element 102 preferably comprises a dense array of thin layers of silicon with cylindrical holes, represented by micropores 110. Or, 'the micropores are made of other suitable metals. The thickness of the pump element is preferably in the range of 0 nm to 1 mm, and the diameter of the micro-aperture 1 in the range of 0 nm to 2 nm. As shown in Figs. 1 and 2, the pump element 102 is supported by a support element 104, which has a smaller density array of larger holes, or supports 108. The support element 104 provides mechanical support for the pump element 102 and has a thickness of at least 300 nanometers. The supporting element 104 preferably has a thickness of 400 nm, and the supporting aperture j 08 is at least 100 μm in thickness, and other thicknesses can also be considered. The description of the supporting structure 108 in Fig. 1A is only one configuration, and other geometries can also be used to balance mechanical forces that are easy to manufacture. Such alternative structures include beehives of materials, square grids of materials, square grids of spider webs, or other structures that can balance the mechanical forces of manufacture. FIG. 1B illustrates a square lattice structure, one example. Fig. 2 illustrates a sectional view of the pump 100 in the present invention. As shown in FIG. 2, the pump element 102 includes a dense array of micropores 110 and supporting elements 10 and is connected to the pump element 102, and the supporting element 104 includes an array of supporting structures. The micropores pass from the bottom surface 114 through the pump element 102 to its top surface U2. The micropores 110 pass the liquid from the bottom surface 114 to the top surface 112 of the pump element 102, as shown in Fig. 2. The liquid used in the pump 100 of the present invention is preferably water, and an ionizer is used to control the pH and the conductivity of the liquid. Other liquids can also be used, including: limited to propyl I, 6 af, methanol, alcohol, ethanol, and other additives: water, and mixtures thereof. Other suitable liquids are also contemplated according to the present invention. ^

Page 12 200416349 V. Description of the invention (6) The supporting structure 106 is connected to the bottom surface i04 of the pump element 102 at a predetermined position. This predetermined position is related to the pressure difference of the pump 100 and the liquid flow rate through the pump element 102. Between each support element 102, there is a support aperture 108, and the liquid passes through the aperture 108 and enters the aperture 11 in the bottom surface 104 of the pump element 102 '. The liquid flowing out from the bottom hole 110 is passed through the passage of each hole and discharged through the opening of the top surface 112 of the pump element 102. Although the liquid flows from the bottom surface 1 1 4 to the top surface 1 12 of the pump element 102, it should be understood that a reverse voltage may cause the liquid to flow in the other direction. The liquid passes through the pump element 102 under the electroosmosis method, and the pump element 102 is subjected to an electric field having a potential difference. The electrode 3 1 6 (step 6 in FIG. 3) is placed on the top surface 1 1 2 and the bottom surface 1 1 4 of the pump element 10, so the potential difference between the top surface 1 1 2 and the bottom surface 1 1 4 can be driven The self-supporting structure 108 flows through the micropores 11 and flows out from the top surface 11 of the pump element 102. Alternatively, the electrode 3 1 6 is at a predetermined distance from the top surface 1 12 and the bottom surface 1 1 4 of the pump element 102. Although the electroosmosis method has been explained a little ', this method is well known in the art, so it will not be described in detail. Referring to Figure 2, the micropores in the pump element are very short (丨 0-20 nm), straight and narrow (0 · 2-0 · 5 nm). Alternatively, the micropores are not parallel and #straight, as shown in Figure 5B. The microporous 1 1 0 configuration allows the pump of the present invention to produce a relatively large flow rate and a lower required pressure than conventional electric energy pumps. Theoretically, the increase in the flow velocity and pressure difference is due to the decrease in the diameter of the microhole a, the curvature r, and the thickness of the pump element 102. This is shown in equations (3), (4). As shown in formula (3), a decrease in the curvature ^ in the micropores 110 can increase the flow velocity of the liquid through the micropores 110. In addition, the decrease in the thickness L of the pump element 102 also increases the flow velocity of the liquid through the micropore π 0 according to formula (3).

Page 13 200416349 V. Description of the invention (7) In addition, as shown in the formula (4), τ 'micropores a & are reduced, and the pressure flowing through the pump element 102 is reduced. In the end, the increase of liquid i is within the range of the knife. Although the flow rate is increased by the invention's configuration of the pump 100, the flow rate and the pressure difference, the force difference ΔP, are reduced by the amount of the cost, which reduces the voltage required to operate the pump 100. Keeping in place The pump of the present invention can be manufactured in different ways. The preferred embodiment of record 3 0 is shown in Fig. 3. The brother = Bei Ming system is manufactured by the invention shadowing / etching process. The pump is made of a series of micro-soils and warriors for traditional integrated circuits. 、、 生. In the example of the car shell, there is a base—a fork and a fork. In Chu Xi Cheng Xi-', or Japanese and Japanese yen made of standard Shi Xi substrate and ancient pre-formed lice and polycrystalline silicon layer. Defects made by the combination of compounds or nitrides as discussed in the following, using the lightning resistance of different steps of oxygen engraving + * J; the surface layer can provide ^ ^ ^ known encapsulation. In this case, in the rest of the step, vr does not need to focus on the timing, so Er Li Shan 4 knows what can be done, and it is necessary to terminate it, resulting in an easily accessible size household. As shown in the figure 3, the interface of the born shield m ^ The driver of the clothes pump 3 0 0 ^ The soil method in the support element 3 0 4 ^ Λ engraved features to form the structure 3 06 and the support aperture 308 began , As shown by I _ ^. The patterning step 2 preferably uses a conventional photoresist exposure and patterning step. Since the predetermined pattern is formed by using the photoresistance | insecticide, this step is no longer discussed. In step 3, a nitrogen acid etching is performed on the wafer 301 to remove the oxide 303 between the support structure 3 06 and the bottom surface 3 1 2 of the pump element 3 02. The HF surname engraving step must be properly timed so that there is sufficient exposure on the surface of the pump element adjacent to the supporting structure 3 06, but not too long to prevent the pump element 3 0 2 from being separated from the supporting element 3 6. In step 4, as shown in FIG. 3, the micropores 3 and 0 and the corresponding channels are formed by the plasma 1 insect engraving technique. The micropores 3 10 formed by the plasma should be parallel and straight.

Page 14 200416349 V. Description of the invention (8) Once the micro pores 3 1 0 are formed, the diffusion oxidation step is performed on the pump 3 0. Therefore, the surfaces of all pumps 3 0 0 include the pump element 3 2 and the support element 3 2. The surface of 4 is oxidized with an oxide layer 3 1 8. The oxide layer 3 丨 8 is preferably s 丨 〇2, which forms a purified oxide ’, which can prevent the electric current osmotic pump effect from bypassing the electric current due to the different potential difference between the openings of the micropores 3 丨 〇. In addition, the growth step of the oxide layer 3 丨 8 can narrow the channels of the micropores 31 0 because s 2 0 2 is formed by silicon oxide at 02 at a high temperature, as shown in step 6. Therefore, very narrow micropores can be shaped using this oxidation step, which is better than etching lithography using plasma etching. In one embodiment, after oxidation. The micropore diameter is less than 0. Therefore, the pump element 3G2 has -high porosity, because the dense micropores 31 () are in the middle.

The supporting element 3 0 4 has a large supporting hole 3 08, which provides a liquid flow through the pump body 3 2 2 but still provides a proper structural support. 〇25nm reduces the hole diameter by 0.5nm. This method can be implemented under the system of + XJ. The growth of silicon gate oxide is very good in this technology & thickness control. As the final Step, forming on the pump element 102 has "characteristics" and "discussions" will be discussed later. ^ Forming an electrode. Figure 4 of the electrode details another method of manufacturing the electric energy pump 400 of the present invention. The design can make the urn step from one method to another. The fourth method can terminate itself. This method can eliminate the termination of the connection to branch node 2. Therefore, the timing of the steps. This other method provides a standard ^ j 0 6 to the pump. The component starts from 0 2, as shown in step 10. The next step includes depositing θ9 ^ or substrate 4 0 1 4 4 3, such as silicon nitride of 0.5 nm on the board 4 疋 amount of bonding material Layer, as shown in step 12. Or use any joint to form a joint σ material instead of silicon nitride 200416349 Description of the invention (9). The silicon nitride layer is then patterned and etched from the top surface of the substrate 401 at a predetermined position 'depending on the required structural specifications of the pump 400. After a while, the bonding material is The remaining part is used as a correction mark 4 0 5 to correct the supporting structure 4 05 and its appropriate position, as shown in step 14. In addition, a chemical mechanical polishing (CMP) method is performed to photo-bond the surface of the material 40 3. As shown in Figure 4 As shown in step 16 of the above, 'an oxide layer 407 is added on the top surface 4 1 4 of the substrate 4 〇1, and the oxide layer 407 is grown on the calibration mark 405. Or' the oxide layer 4 0 7 is not added to the correction mark 405. The polystone layer 4 09 is formed on the surface oxide layer 4 07, as shown in steps 18 and 20. The polystone layer 4 009 is preferably Stupid growth method. The thickness of the polysilicon layer 409 is preferably 10-20 nm. It is formed by several micropores 4 1 0 in the polysilicon layer 409, as shown in FIG. 4. Step 20 is shown. The micro-pores 4 1 0 can be formed by plasma etching mentioned in the first method. Once the micro-pores 4 10 have been formed in the rocky layer 4 0 9, the plasma is used; The insect-engraved support structure 4 06 and the holes 4 0 8 are outside the base plate 4 0 1, and the method continues to form the supporting holes 4 0 8 and the supporting structure 4 0 6. Since step 22, the supporting structure 4 0 6 has been Each correction mark 4 0 5 is formed in the bonding layer. Alternatively, the support structure 4 ◦ 6 and the pores 4 0 8 are formed before the formation of the micro pores 4 1 0. Once the micro pores 4 1 0 and the support structure 4 0 6 have been formed, all The pump 400 is preferably immersed in HF to remove all oxides between the stone layer 409 and the top surface of the substrate 401. As shown in step 24. This Hm engraving step 24 also opens the interface between the micro-pores 41 0 and the supporting holes 408. As mentioned above, the advantage of the method is that the HF money-cutting step terminates on its own since the bonding material is not attacked during the HF method. Therefore, the support structure 406 can be guaranteed to be connected to the pump element 402 regardless of how long the pump 400 is exposed to the HF.

16th page 200416349 V. Description of the invention (ίο) ~ —- Secondly, the structure is oxidized to form an oxide layer 3 丨 8 in the pump element = structure 404 ... to passivate the surface and reduce micropores = 2 Figure 5 illustrates this Invented another method of manufacturing a pump. In this method, a standard silicon wafer substrate 501 is shown in step 30. In addition, if the cow 2 =, the glass material 502 is adhered to one side of the wafer 501, preferably the top side of the wafer. In this embodiment, the glass material 502 is preferably a material that is insulated from current. This material preferably includes == or borosilicate glass. Other types of glass or ceramics can also be used. The glass material 5 is adhered to the wafer 50 by a temperature melting method. Other methods can also be used. 'Chemical mechanical polishing (CMP) or other methods can be used on the glass material. ≫ The surface to a predetermined thickness, about 100 nm. Alternatively, the glass material 502 can be polished and smoothed to other degrees. 'As shown in step 34 of FIG. 5A, the support structure 506 is etched on the wafer 50 by etching, such as electricity. Alternatively, other methods can be used to form the branch structure. The supporting structure 506 forms the substrate 5 () 1 and the glass material 502 downwardly, so as to form the substrate 501 so that the substrate 501 faces upward. Next, an etching method is performed on the substrate 1 ′ and thus the supporting structure 506 and the corresponding supporting pores 508 are formed. The polishing and forming steps of the support structure can be implemented in any order, and the polishing / forming can be performed before or after the support structure is formed. Next, the micropores 5 1 0 can be formed by “plasma etching”, so the micropores 5 10 are formed between the top and bottom surfaces of the glass material, and have a straight and parallel configuration. Or as shown in FIG. 5β 'Glass material may have non-parallel and complex shapes in 5 02, and micropores are also possible'

200416349 V. Description of the invention (11) Formed by methods other than # 刻 法. Once the pump element 3 02 and the supporting element 3 04 have been formed in the above-mentioned method, metal should be deposited on the outer surface of the pump element 3 02 'so that fewer electrodes 3 1 6 are formed on the surface of the pump element, as shown in the step of FIG. 3 6 shown. The materials of the electrodes 3 and 6 should not be decomposed in the electrolytic method. Preferred materials for the electrode 316 include platinum and graphite; other materials are also possible, depending on the liquid composition of the pump. Electrodes 3 16 are formed on the outer surface of the pump element 3 02 in different ways. The electrodes 3 and 6 are preferably formed on the outer surface of the pump element 30 by a vapor, chemical vapor deposition (CVD) or plasma vapor deposition (PVD) method. Alternatively, the electrodes 316 are formed on the screen or the contact printing on the outside of the pump element: 302. Alternatively, an electrode curtain (not shown) may be placed near the pump element 302. Alternatively, a lead is coupled to each outside of the pump element. It should be understood that the coupling of the electrode of the present invention to the pump element is not limited to the method described above. f ^ illustrates a cooling system for cooling a liquid passing through a heat radiation device. As shown in Figure 6, the system is a closed loop, and the liquid flows to a component to be cooled. As in the microprocessor 602, the processor's liquid bath is more comfortable. After leaving the microprocessor 602, the heat transfer between the liquid and the heat sink is performed by the radiator 6 04, and the temperature of the liquid is 59 degrees in the south, and enters C ^ L Ψ ^. In /, medium ~ σP to lower At a temperature of 44 ° C, the liquid enters the "〇〇" of the present invention at a temperature of 44 ° C. Please refer to it again. After the pump is pumped out and rained, the liquid at the island enters the support pore 10 8 ′ and is negatively charged by the above-mentioned permeation method. 〇. The voltage applied to the pump element 102 causes a bow in the liquid 丨】 The voltage difference between the top surface and the bottom surface of the 70 element is absorbed by the positive voltage applied to the top surface of the pump element 102 The liquid is driven to pass through the phase and the liquid thus leaves the pump 100 at a temperature (“degree. J./degree. 44 degrees C) of entering the fruit.

Younger page 18, 200416349 V. Description of the invention (12) The pump of the present invention can generate enough flow to repel the system with sufficient heat of single-phase liquid. Existing pumps operating with a 100 W heat source require two-phase thermal rejection, while single-phase liquids can capture and reject lower temperatures, thus eliminating problems related to stability and phase changes in two-phase systems. In addition, lowering the operating voltage to a low level allows the existing voltages in the electronic system to be utilized without the need for phase-to-phase switching. The pump of the present invention can be operated with complex liquids, such as antifreeze or water with additives to improve heat capture and rejection performance. As described above, the electric current passes through the liquid through the chemical reactor, and thus the electric current passes through the electrode 3 1 6 of the electric energy pump 100 (Fig. 3). In pure water, this reaction leads to electrolysis, which generates tritium gas to other electrodes 3 1 6. In more complex liquids, this reaction results in more complex by-products, most of which cannot be recombined in a sealed system. When the chemical reaction of the electrode 3 1 6 has sufficient structural energy, it occurs as a potential difference between the electrodes to overcome the affinity of the electrode charge. In the case of water, these overpotentials can increase the voltage by about 4 V. For other chemicals and additives, these overpotential changes and differences. If an electric energy pump is operated at high voltage, this overpotential is very small and can be ignored in the analysis. However, during low voltage operation, the overpotential is automatically subtracted from the pump element 102, thus forming a potential difference in the pump medium, which is reduced by the sum of the overpotentials reacted at the two electrodes. In the case of multi-component liquids, if the applied voltage is large enough to overcome the overpotential of all reactions, the electrochemical reaction is related to all components of the liquid. However, operating at low voltage can cause only a certain component of the liquid to undergo an electrochemical reaction. For example, if water includes additives and appears to form at low temperatures,

Page 19 200416349 V. Description of the invention (13) When the overpotential is changed with pure water, the electricity is applied. This situation (only related to H2,0, Zhu low-voltage operating rate device is lower than can be suppressed. Liquid additions can be suppressed. These additions for these additions are usually larger than the theoretical, shape, rough overpotential value can be the behavior of the dosage system Related to the type. Most of the heat can be overlapped or mixed to a critical concentration at a pressure of two diodes as a concentrated gas mixture. In the agent of the present invention, the overpotential of the pump dosing agent can only be higher than water. The added overpotential is very high. When there is only a low voltage in the water ion cross-pressure range in the electroosmosis method, the advantage of only water participating in the electrode is that the electrochemical reaction can be kept simple 2), even in liquid Contains complex chemical combinations. The advantage of the present invention is that it can generate an appropriate flow rate and pressure for the purpose of cold body freezing point under the potential of high potential such as useful additives of antifreeze additives. For example, cyclohexanone and acetone are soluble in water at low concentrations. , And for good performance. The electrode potential of the chemical agent is calculated from theory. However, the minimum electrode potential is 2 to 3 times the overpotential. In addition, the overpotential is a function of degrees and the current density of the electrode / electrolyte interface. It is estimated for an electrode material / electrolyte pair, which is related to the addition; the special concentration of the additive and the system in which the additive is used. This chemical reactant has the same freezing point as the analogy on the weighted effect path. The lower gate is more current than the water. The negative effect is extremely extreme, of which the limit is two and the south is diverted. The operating voltage involves a few non-linear electrolytic currents, and low-concentration additives are small. This situation can be added with a low concentration of the threshold electrode body with each diode tending to exhaust all potentials, even if the applied voltage is relatively high, such as its over-charge additive. The effect seems to be the same as the critical concentration

II

Page 20 200416349 V. Description of Invention (14) Off. Therefore, adding low concentrations such as cycloethanol or acetonitrile or other additives has the beneficial effect of freezing point without affecting the electrochemical reaction of the electrode. Therefore, the best additives are soluble chemicals with high freezing point constants, which are also effective at low concentrations. The present invention has been described with specific embodiments incorporating details in order to have an understanding of the structure and operation principle of the present invention. The reference to the specific embodiments and details herein is not intended to limit the scope of the patent application scope of the present invention. To those skilled in the art, modifications can be made in the selected embodiments for explanation without departing from the spirit and scope of the present invention.

Page 21 200416349 Brief Description of Drawings Figure 1A illustrates a perspective view of a pump element according to a preferred embodiment of the present invention. Figure 1B illustrates a perspective view of a pump element according to another embodiment of the present invention. Figure 2 illustrates a cross-sectional view of a pump according to a preferred embodiment of the present invention. FIG. 3 illustrates a preferred method of manufacturing a pump according to a preferred embodiment of the present invention. Figure 4 illustrates another preferred method of manufacturing a pump according to the present invention. Figure 5A illustrates another method of manufacturing the pump of the present invention. Figure 5B illustrates another embodiment of a glass material having non-parallel microvoids of the present invention. Fig. 6 illustrates a closed system circuit including a pump of the present invention.

Component symbol description: 112 top surface 114 bottom surface 300 pump 301 wafer 302 substrate wafer. Pump element 303 oxide 304 support element 306 support structure 308 support pore 310 micro pore 312 bottom surface 316 electrode 318 oxide layer 400 pump 401 standard silicon Wafer or substrate 402 Pump element 403 Bonding material 404 Support structure 405 Calibration mark 406 Support structure 407 Oxide layer 408 Support void 409 Polysilicon layer 410 Micropore 414 Top surface 501 Wafer 502 Glass material 506 Support structure 508 Support aperture 510 Micro Pore 600 Pump 602 Microprocessor 604 Radiator

Page 22 _

Claims (1)

200416349 VI. Scope of Patent Application 1. A method for manufacturing an electric energy pump, including the following steps: a. Providing a first material having a first surface and a second surface; b. Forming a plurality of capillaries through the first material, wherein the Each capillary includes micropores on the first surface and the second surface of the substrate; c. Oxidizing the first surface and the second surface with an insulating agent, wherein the inner surface of each capillary is oxidized with an insulating film; d. Coupling the electrode to The first surface and the second surface, wherein the potential generated between each electrode drives the liquid to flow through the plurality of capillaries. 2. The method according to item 1 of the patent application scope, further comprising the following steps: a. Applying an oxidant to the second surface of the first material; b. Combining the second material with the oxidant. 3. The method according to item 2 of the patent application scope, further comprising forming a plurality of support structures in the second material, wherein each support structure is coupled to the first material by an oxidant. 4. The method of claim 3, further comprising removing a predetermined amount of oxidant from the second surface, wherein a substantial amount of the oxidant remains between the support structure and the second surface. 5. The method according to item 4 of the patent application, wherein hydrofluoric acid is applied to a predetermined amount of oxidant to be removed. 6. The method of claim 2 further comprising oxidizing each support structure with an insulator. 7. The method according to item 1 of the scope of patent application, wherein the plurality of capillaries are formed by # 刻 法. 8. The method of claim 1 in the scope of patent application, wherein the diameter of the micropores 200416349 6. The scope of patent application is 0.1 to 2 nm. 9. The method of claim 1, wherein the first material includes a thickness dimension of 10 nm to 1 mm. 1 0. A method for manufacturing an electric energy pump, including the following steps: a. Providing a substrate having a first surface; b. Forming a plurality of correction marks on the substrate, wherein the correction marks are made of the first material; c Applying a second material to the first surface; d. Forming a plurality of capillaries passing through the second material; e. Forming a support structure at each correction mark of the substrate, thereby forming a plurality of support structures, wherein the second surface is formed on Between each support structure; f. Applying a diffusing oxidant to the first and second surfaces, wherein the diffusing oxidant is applied to a plurality of capillaries, wherein a voltage difference between the first and second surfaces drives the liquid through the plurality of capillaries; . 1 I The method of claim 10, further comprising the step of applying a diffusion oxidant to an outer surface of each support structure. 12. The method of claim 10, further comprising the step of applying an oxidizing agent to the first surface before the second material is applied to the first surface. 13. The method according to item 12 of the patent application scope, further comprising the step of removing the oxidant from the first surface. 14. The method of claim 10, further comprising the step of coupling the device to apply a voltage difference between the first surface and the second surface. 15. The method according to item 10 of the scope of patent application, wherein the first material is glass 200416349 VI. Scope of Patent Application Glass materials. 16. The method of claim 10, wherein the first material is a ceramic material. 17 · The method according to item 10 of the patent application scope, wherein the second material is a polycrystalline material. 18. The method according to item 10 of the scope of patent application, wherein each of the plurality of capillary tubes has a diameter of 0.1 to 0.2 nm. 19. The method of claim 10, wherein the second material comprises a thickness dimension in the range of 10 to 1 nm. 2 0. A method for manufacturing a micro-electric energy pump, including the following steps: a. Providing a substrate; b. Applying a porous structure glass material to the interface of the substrate, wherein the porous material is coupled to the substrate on the interface; and c A plurality of support structures are formed outside the substrate, thereby forming a plurality of support pores between the support structures along the interface. One of the voltage differences between the interface and the surface of the porous structure glass material drives the liquid from the plurality of support structures through the porous to Structural surface. 2 1. The method of claim 20 in the scope of patent application, further comprising the step of polishing the porous structure to a predetermined thickness. 2 2. The method of claim 20 in the scope of patent application, further comprising forming a plurality of micropores having an appropriate diameter size to pass through the porous structure, wherein the plurality of micropores extend from the surface to the interface. 2 3. The method according to item 22 of the scope of patent application, wherein the micropores are in a parallel shape. 0 200416349 6. Scope of patent application 24. The method of item 20 of the scope of patent application, wherein the porous structure includes a plurality of micropores in a non-parallel shape. ′ I 2 5. The method of claim 20 in the scope of patent application, wherein the porous structure is pre-manufactured. 26. The method according to item 22 of the patent application range, wherein the porous structure has a predetermined thickness and a size range of 50-500 nm.丨 * | 27. —An electric energy pump for pumping liquid, including: a. —The body has a predetermined thickness, the body includes a first outer surface and a second outer surface, and the first and second outer surfaces include an oxide B. A plurality of micropores to allow liquid to pass through the body, wherein each micropore extends from the first outer surface to the second outer surface, and includes an oxide insulating film therein; c. A pair of electrodes to apply a first A voltage difference between an outer surface and a second outer surface, wherein the potential pressure drives the liquid through each micropore. 28. The electric energy pump according to item 27 of the patent application scope, further comprising a supporting element coupled to the body, wherein the supporting element includes a plurality of supporting structures. 29. — A cooling system circuit for cooling a heat radiation device with a liquid, wherein the heat radiation device outputs a liquid having a first temperature, and the cooling system includes: 丨 a. — The microchannel heat exchanger transfers the liquid of the self-heat radiation device from the first A temperature is cooled to a second temperature, wherein the micro-channel heat exchanger outputs liquid at the second temperature; b. — A micro-electric energy pump is provided for osmotically pumping liquid from the micro-channel heat exchanger to the heat radiation device, wherein the pumping The liquid to the heat radiation device is basically the second i temperature. The electric energy pump further includes: Page 26 200416349 6. Scope of patent application i. A body having a predetermined thickness, the body including a first outer surface and a second outer surface, wherein the first outer surface and the second outer surface include an oxide insulating film; ii A plurality of micropores for the passage of liquid through the body; wherein each micropore extends from the first outer surface to the second outer surface, and includes an oxide insulating film therein; and ii i. A pair of electrodes for applying the first A voltage difference between an outer surface and a second outer surface, wherein the potential difference drives liquid through each micropore. 30. The cooling system circuit according to item 29 of the scope of the patent application, wherein the electromotive energy element further comprises a building element coupled to the body, and the supporting element includes a plurality of building structures. Page 27