TW200416197A - Boron doped diamond - Google Patents

Boron doped diamond Download PDF

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TW200416197A
TW200416197A TW092103942A TW92103942A TW200416197A TW 200416197 A TW200416197 A TW 200416197A TW 092103942 A TW092103942 A TW 092103942A TW 92103942 A TW92103942 A TW 92103942A TW 200416197 A TW200416197 A TW 200416197A
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diamond
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diamond layer
layer
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TW092103942A
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TWI271450B (en
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Geoffrey Alan Scarsbrook
Philip Maurice Martineau
Daniel James Twitchen
Andrew John Whitehead
Michael Andrew Cooper
Barbel Susanne Charlotte Dorn
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Element Six Ltd
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Priority claimed from PCT/IB2002/005324 external-priority patent/WO2003052174A2/en
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Abstract

A layer of single crystal boron doped diamond produced by CVD and having a total boron concentration which is uniform. The layer is formed from a single growth sector, or has a thickness exceeding 100 μm, or has a volume exceeding 1 mm<SP>3</SP>, or a combination of such characteristics.

Description

玖、發明說明 (發月°兒明應敘明:發明所屬之技術領域、先前技術、内容、實施方式及圖式簡單說明) 【發明所屬之技術領域j 發明背景 本發明係關於攙雜鑽石,且更特別的是關於藉由化學 氣相沉積(Chemical Vapour Deposition)來製造之鑽石(以下 簡稱為CVD鑽石)。 對一粒可被廣泛應用之鑽石而言,攙雜鑽石層體所具 有之特殊尺寸、均一攙雜濃度及與電子及/或光學有關之 1〇性質皆為有利。視其應用之内容,這種材料需要實質地排 除有害之具有電子或光學活性之陷阱(traps)或瑕疵。目前 尚無此型材料。 於諸如高功率電子上之應用需要具有厚度居於5〇_ ΙΟΟΟμιη,且側面積居於i x lmm2 — 5〇 χ 5〇mm2之範圍内之大 15型表膜獨立鑽石。對於一個競爭市場上具可行性之生產而言 ,供用於這些結構中鑽石較有利是以一種大型材料長成並予 以加工成最終之成品。此外,大片可進行晶片切割加工,並 進步降低成品製造成本。對於諸如濾膜及吸收能量之量測 器之光學應用而言,大尺寸料之原料是—種對器材本質之 2〇需求。因此,合成厚的層體是具有多種利益的。 硼是僅知之具有良好之相當淺接之攙雜表現特性之鑽 石攙雜物。文獻上報導其他尚在研發中之有潛力之淺接纔 雜物包含:硫⑻、磷〇&gt;)、氧(〇)、經(u),但其等還不是 值得信賴之大量⑽k)攙雜物。有許多需要擾雜鑽石之電 6 200416197 玖、發明說明 子應用,其等通常是於一大面積上,且需要具有均一之特 性。然而,於合成中攙雜硼是該特定晶槽所具有之一種非 常靈敏之特性。聚晶鑽石係包含一種隨機選擇之長晶槽, 然而雖然該硼之平均濃度於一個大於顆粒之尺度上是均一 5的,在同該顆粒財之尺度了,該局部之蝴濃度在點與點 之間是具有實質差異的。 攙雜物亦可藉由長晶之後處理來予以攙入。目前唯一 可信賴之適用於鑽石之長晶後處理是離子植入法,且其係 為一種可用以製造不具攙雜均一性之層疊鑽石結構之方法 10 。例如,可藉由使用一種適用於將硼植入一粒高品質之天 然Ila型鑽石之劑量及能量來製造一種‘ρ_Γ(ρ_型本質)結構 。不幸地,殘量損害(空隙及裂縫)常於離子植入法之狀態 下發生。雖然黏合(annealing)處理能夠減少此種損害但 此種損害無法完全被移除。該損害會由於硼受體之散射及 15補償不良而導致帶電載體性質衰降。 藉由化學氣相沉積(CVD)於一基材上沉積或生長例如 鑽石之方法,是目前已建立且被廣泛描述於專利案及其他 文獻中。由於鑽石是藉由CVD來沉積於一種基材上,因此 該等方法通常涉及提供一種氣體混合物,其於解離時能夠 20提供王原子形式之氫或一種鹵素(例如··氟、氣)、及碳或 含碳自由基及其他具反應性物質(例如:CHx、CFX,其中X 可以疋1至4)。此外,含氧來源物可以存在,以及提供氮及 提供硼之來源物。於多種方法中惰性氣體諸如氦、氖或氬 亦可存在。因此,一種典型的來源氣體(s〇urCe gas)混合物 7 200416197 玖、發明說明 . 會包含:碳氫化合物(CxHy,其中X及y可各自是1至ι〇)或齒 化碳(CxHyHalz,其中X及z可各自是1至1〇,且y可以是〇至 10)以及任擇之下列一者或數者:COx(其中X可以是〇至2)、 〇2、H2、N2、NH3、B2H6及一種惰性氣體。每一種氣體可 5以呈其天然同位素比例存在,或者可以呈人工控制相對之 同位素比例;例如:氫可以氘或氚存在,且碳可以或 13C存在。來源氣體(source gas)混合物可藉由一種能量來源 ,例如··微波、RF(高週波)能量、一種火燄、一種熱鎢絲 或以噴射為主之技術來產生解離,且可容許該等藉此產生 10之具有反應性氣體被沉積於一個基材上來形成鑽石。 CVD鑽石可以被產生在各種不同的基材上。視該基材 之本質及製法之化學性質可製成多晶或單晶CVD鑽石。 對許多其他的攙雜物而言,於沉積之過程中使硼攙雜 入固體中是較不困難的。該於固體中硼之攙雜比例是攙雜 15之硼(B)對比碳(C)之濃度([B]/[C]:固體)較諸於沉積氣體 之[B]/[C]:氣體而言,通常(於{1〇〇}長晶槽内)是大約工, 而 &gt;、可因夕種因素而異。有多種可以於製程中以硼攙雜 CVD鑽石之方法。以微波錢、熱絲及電弧噴射技術, 可添加乙硼烷(Β^6)或某些其他適合之氣體至氣體流内、 可將4 ^入氣體打氣通入包含氧化侧之甲醇或丙嗣 内可置放爛酸粉末於晶槽内、或插入棚電極至電漿中。 、子藉由L: k火燄方法來長晶而言,一種包含硼酸之甲醇煙 霧可以一種噴霧器來予以注射入氣流内。鑽石薄膜亦可以 在非刻意之情形下被攙雜,例如:電衆已分解一種以石肖酸 8 200416197 玖、發明說明 硼製成之基材。 氮氣亦可呈多種形式來予以導入合成之電漿内,其等 之典型是氮氣(N2)、氨(nh3)、空氣及乙硼烯(b2h4)。 雖然高品質之單晶(SCV)CVD鑽石於高能電子上扮演 5 一個重要的角色,但有潛力之應用數量必須在一粒具有均 一且優良電子性能之CVD攙雜鑽石是可得之情況下才會實 質地增加。此外,硼攙雜鑽石還能夠被應用在其他以硼 (B)攙雜可有利地產生均一之顏色、亮度或其他相關特性 之應用上。 10 【明内3 發明概要 依據本發明之第一個方面,本發明係提供一種以氣相 沉積(CVD)製造之硼攙雜鑽石,其中硼攙雜之整體濃度是 均一的’於大部分體積内之差異小於5〇% ,且較佳是小於 15 2〇%,於每一個量測點以一種側向解析來予以量測是小於 50μπι,較佳是於每一個量測點以一種側向解析來予以量 測是小於30μπι,且具有特性之至少一種: ⑴層體係形成自一個較佳是一個由{1〇〇}、{113}、 {111}及{110}所構成之單一養晶槽,以及更佳是該等 20 {100}晶槽。 (H)層體厚度超過ΙΟΟμπι,且更佳是超過5〇〇μηι,以及 (lii)層體之體積超過lmm3,更佳是超過1〇mm3,甚至 更佳是超過30mm3。 該術語“大部分層體,’被使用於本說明書及申請專利範 9 200416197 玖、發明說明 圍中係意指鑽石層體總體積之至少70% ,較佳是大於8〇% ’且更佳是大於95%。 本發明之CVD單晶硼攙雜鑽石層體亦可包含以氮作為 -種攙雜物。該鑽石層體一般會包含一種不超過ι/5硼濃 5度之氮濃度,且較佳是低於硼濃度之丨/50。 該鑽石層體較佳是具有“優良之結晶性質,,。此“優良 之結晶性質,,容許硼原子及氮原子以攙雜物以及與點瑕疵 有關之例如諸等包含··空隙、氫及類似物之存在。 單曰s爛攙雜鑽石層體亦可於該鑽石之大部分體積内具 10有一種或多種下列特性,該大部分體積係如上文所定義·· (a)該層體包含一種是高於1 X 1〇i4原子/em3且低於 1 X 1〇μ原子/cm3之非補償性硼濃度,較佳是一種是高於1 X 10原子/cm3且低於2 x 1019原子/cm3之未補償硼濃度, 且更佳是一種是高於5 χ 1〇i5原子/cm3且低於2 X 1〇〗8原子 15 /cn&gt;3之未補償硼濃度, (b) —種於300K下量測之電洞移動率((ih)係超過 χ 2.1 χ 1010 /(Nh0·52) 當Nh小於或等於8 χ 1〇15原子/cm3時 (函數1) 20 χ 1 χ 1018 /Nh 當Nh大於8 χ 1015原子/cm3時 (函數2) 其中Nh是電洞濃度(或當量,離子化硼接受子之濃度) ’〜與Nh之函數關係是依據現行模式且該g之數值代表最 10 坎、發明說明 佳之現有讀值。G是一個大於M之數值,且較佳是一個大 於1.4之數值,且更佳是一個大於17之數值,甚至更佳是 大於2.0。 (c) 具有在與氮-空隙(N_V)色蕊相關之575nni&amp;637nm 下為微弱或無冷光特性。特別地,當於77K下以纟丨如出氬 離子雷射激發來量測時,該氮空隙於575nm對比㈠〜㈤峰 值之零聲子譜線之積分強度是小於該落在1332cm·1之鑽石 拉曼譜線(Raman line)之積分強度的1/50,較佳是小於 1/100 ’且更佳是小於1/300。 (d) —條於300K下以514nm氬離子雷射激發下量測之 拉曼谱線的寬度半高寬值(FWHM)是小於4cm·1,較佳是小 於3cm-1,且更佳是小於2 5cm_】。 (e) 當以傅立葉轉換紅外線光譜儀(FTIR)使用下述方 法來量測時,其未補償硼濃度具有高度之非均一性。特別 是,該未補償硼濃度之分佈頻率是於一取樣自該層體之代 表性取樣以傅立葉轉換紅外線光譜儀(FTIR)來予以量測, 於90%之量測中的差異,以平均值之百分比表示,是小於 50%,更佳是小於3〇0/〇。 σ) 一種於紫外線激發之下,使用下述之方法量測 77Κ下238nmi結合激子散射(ΒΕ),該結合激子散射(ΒΕ) 與未補償性取代蝴原子之固體漠度一致。特別地,該藉由 此種方法量測之ΒΕ頻率分佈,於任何—個該層體之代紐 表面或該層體之取樣下’其9〇%之量測所具有之差異,以 平均值之百分比表示,是小於篇,更佳是小於3〇%。 200416197 玖、發明說明 (g)於紫外線激發之下,使用下述方法量測其於77κ 之自由激子散射_強度是具有高度均—性。特別地該 藉由此種方法量測之FE的頻率分飾,於任何—個該層體之 代表性表面或制體之取樣下,其9()%之量朗具有之差 異,以平均值之百分比表示,是小於⑽,更佳是小於 30% 〇 發現本發明CVD鑽石中具有高移動率是令人驚言牙的。 現行之供用於該等載體濃度大於8 χ 1〇ls原子/cm3之載體( 或離子化接受子)濃度所產生之移動率差異模式是依據接 1〇受子硼原子是主要的散射機制’且其分佈是之本質是依據 其存在。因此’這個模式暗示不可能達到高於這個數值。 因此相反地,於本β兒明書中所述之本發明結果顯示該模式 是錯誤的,此係由於先前文獻中所報導之攙雜鑽石中所具 有之移動率是受限於其他可被移除之因子。 丨5 本發明之CVD單晶硼攙雜鑽石層體可以是表膜獨立或 構成一粒較大之鑽石個體或層體之一個層體或區域。該較 大之鑽石層體或個體可以是以CVD或其他合成方法製造之 单晶或聚晶鑽石。該較大之鑽石層體或個體可被攙雜以硼 、氮或或其他元素。 :0 本發明之鑽石層體或個體可以是一種寶石之形式。 依據本發明之另一個方面,本發明係提供一種用以製 —種删攙雜單晶CVD鑽石層體。此方法包含之步驟是: 提供一種具有一個實質不具有結晶瑕疵表面之鑽石基材, 提供一種來源氣體(source gas)(此種來源氣體包含一種硼 12 200416197 玖、發明說明 之來源),分解該來源氣體,然後容許均相磊生鑽石於該 實質不具有結晶瑕疵之表面上生長,藉此來產生一種單晶 硼攙雜鑽石層體,較佳是具有上述型式者。該方法之基本 要件是該鑽石必須是於一個實質不具有結晶瑕疵之表面上 5 生長。 於本發明之方法中可額外地包含使用控制性添加氮至 來源氣體中。於來源氣體中之氮可提供對生長之單晶所產 生之形體具有額外的控制,且氮的攙雜比例會實質地低於 硼。因此氮氣之添加,以氮氣分子來計算,是居於該高於 10 〇·5且低於looooppm之範圍内,且較佳的是居於該高於 低於lOOOppm之範圍内,更佳的是居於該高於3且低於 200Ppm之範圍内,其等由於該攙雜材料之硼是以一種散射 色蕊存在,因此對硼攙雜層體之電子特性不具有顯著負面 影響,且會顯著地增加{100}晶體生長槽之尺寸,並縮小 15競爭性晶體生長槽(例如:{Hi})之尺寸。此意指,對生長 於一個{1〇〇}板塊上而言,該添加之氮氣能使其生長而維 持實質之{ 100}晶體生長槽。那些熟習此項技藝人士可瞭 解的是使用氮氣來改變形體之階段可與之分離或接續該均 一硼攙雜層體長晶之階段。 20 因此本發明之均一硼攙雜鑽石可被應用於一寬廣範圍 之項域中,其例如:電子、彳貞測儀、高能電子,等等。此 外,硼攙雜鑽石還能夠被應用在其他以硼(B)攙雜可有利 地產生均一之顏色、亮度或其他相關特性之應用上。例如 於某些諸如一種切割刀之應用中,硼可被使用來使該鑽 13 200416197 玖、發明說明 石具有顏色,藉此改善視覺控制,且其顏色之均一度可當 做一種指示品質之因子。可選擇性該鐵石可被使用於諸: 抛光寶石之裝飾性應用上,其一般係相同地可以顏色之均 一度當做一種指示品質之因子。 5 對於上述各種不同的應用而言,該鑽石這體或層體可 藉由例如··切割來產生兩個或數個以及通常是大量之小顆 粒或單元,俾以供用於上述之一種或多種應用中。該顆粒 或單元之尺寸可視其應用而定。 C貧施方式:| 10 較佳實施例之詳細說明 除了上述特徵之外,本發明單晶硼攙雜Cvd鑽石層體 可於其大部分體積中具有一種或數種下列之特徵,該大部 分特徵係如上文所定義: 1 ·由任何一種單一雜質:矽(si)、磷、硫⑻、鎳 15 (Ni)、鈷(Co)、鋁(A1)、錳(Μη)、鐵自由激子散射(FE)所構 成之一個位准是居於不超過1 ppm *以及一個由這些雜質所 構成之總量是不超過5ppm。上述之“雜質,,不包含氫及其同 位素。 2· —個落在57511111寬帶之陰極冷光(CL)發散訊號很低 20 或不存在,且一個於77K下以514nm氬離子雷射激發(稱為 300mW入射光束)來量測之光學冷光(PL)相關譜線係具有 一個較或落在1332cm-1 &lt;拉曼譜線(Raman line)波峰積分面 積小1/100之波峰積分面積,較佳是小於丨/50,更佳是小於 1/300 〇说明 Description of the invention (The description of the invention should be stated: the technical field, prior art, content, embodiments, and drawings of the invention are briefly described.) [Technical field to which the invention belongs] Background of the invention The present invention relates to doped diamonds, More specifically, it is about diamonds manufactured by Chemical Vapour Deposition (hereinafter referred to as CVD diamonds). For a diamond that can be widely used, the special size, uniform doping concentration, and electronic and / or optical-related properties of the doped diamond layer body are all advantageous. Depending on the content of their application, this material needs to substantially eliminate harmful traps or defects with electronic or optical activity. No such material is currently available. For applications such as high-power electronics, a large 15-type film independent diamond with a thickness of 50-100 mm and a side area in the range of i x lmm2-50 x 50mm2 is required. For a viable production in a competitive market, diamonds for use in these structures are advantageously grown from a large material and processed into the final product. In addition, large pieces can be processed for wafer dicing, and the cost of finished product manufacturing can be reduced. For optical applications such as filter membranes and energy-absorptive measuring devices, the raw material for large-size materials is a 20% requirement on the nature of the device. Therefore, synthesizing thick layer bodies has multiple benefits. Boron is the only diamond inclusion known to have good, rather shallow, doped performance characteristics. It is reported in the literature that other potential superficial inclusions that are still in development include: sulfur, phosphorus (O &gt;), oxygen (〇), warp (u), but these are not yet a large number of reliable (k) impurities Thing. There are many electric applications that need to disturb diamonds. 6 200416197 发明, invention description, sub-applications, etc. are usually on a large area and need to have uniform characteristics. However, doped boron in synthesis is a very sensitive property of this particular cell. Polycrystalline diamonds contain a kind of randomly selected crystal growth tank. However, although the average concentration of boron is uniform on a scale larger than the particle size, it is on the same scale as the particle wealth. The local butterfly concentration is at the point and point. There are substantial differences between them. Inclusions can also be incorporated by post-growth processing. At present, the only reliable crystal post-treatment suitable for diamond is ion implantation, and it is a method that can be used to make laminated diamond structures without heterogeneity 10. For example, a 'ρ_Γ (ρ_-type essence) structure can be manufactured by using a dose and energy suitable for implanting boron into a high-quality natural Ila-type diamond. Unfortunately, residual damage (voids and cracks) often occurs under ion implantation. Although annealing can reduce such damage, such damage cannot be completely removed. The damage will result in the degradation of the charged carrier due to the scattering of boron receptors and poor compensation. Methods for depositing or growing, for example, diamond, on a substrate by chemical vapor deposition (CVD) are currently established and widely described in patents and other literature. Since diamond is deposited on a substrate by CVD, these methods usually involve providing a gaseous mixture that, when dissociated, can provide hydrogen in the form of a king atom or a halogen (eg, fluorine, gas), and Carbon or carbon-containing free radicals and other reactive substances (for example: CHx, CFX, where X can be 疋 1 to 4). In addition, oxygen-containing sources can be present as well as sources that provide nitrogen and boron. An inert gas such as helium, neon or argon may also be present in a variety of methods. Therefore, a typical source gas (sourCe gas) mixture 7 200416197 玖, description of the invention. Will contain: hydrocarbons (CxHy, where X and y can each be 1 to ι〇) or toothed carbon (CxHyHalz, where X and z may each be 1 to 10, and y may be 0 to 10) and one or more of the following: COx (where X may be 0 to 2), 〇2, H2, N2, NH3, B2H6 and an inert gas. Each gas can exist in its natural isotope ratio, or it can be artificially controlled relative isotope ratio; for example, hydrogen can exist in deuterium or tritium, and carbon can exist in 13C. The source gas mixture can be dissociated by an energy source, such as microwave, RF (high frequency) energy, a flame, a hot tungsten wire, or a jet-based technology, and allow such borrowing This produces 10 reactive gases that are deposited on a substrate to form a diamond. CVD diamond can be produced on a variety of different substrates. Depending on the nature of the substrate and the chemical nature of the manufacturing method, polycrystalline or single crystal CVD diamonds can be made. For many other dopants, it is less difficult to get boron dopants into the solid during the deposition process. The doping ratio of boron in the solid is the concentration of boron (B) versus carbon (C) doped with 15 ([B] / [C]: solids) compared to [B] / [C]: gases of the deposition gas. In other words, usually (within the {100%} crystal growth tank) is about work, and it can be different depending on various factors. There are various methods by which CVD diamond can be doped with boron in the manufacturing process. With microwave money, hot wire and arc spray technology, diborane (B ^ 6) or some other suitable gas can be added to the gas stream, 4 ^ into the gas can be pumped into methanol or propane containing the oxidation side The rotten acid powder can be placed in the crystal trough or inserted into the electrode in the plasma. In terms of crystal growth by the L: k flame method, a methanol mist containing boric acid can be injected into the gas stream with a sprayer. Diamond films can also be doped under unintentional circumstances. For example, Dianzhan has decomposed a substrate made of boric acid 8 200416197, description of the invention. Nitrogen can also be introduced into the synthesized plasma in various forms. Typical examples are nitrogen (N2), ammonia (nh3), air, and diborene (b2h4). Although high-quality single crystal (SCV) CVD diamonds play an important role in high-energy electronics, the number of potential applications must only be achieved if a CVD doped diamond with uniform and excellent electronic properties is available Substantial increase. In addition, boron doped diamonds can also be used in other applications where boron (B) doping can advantageously produce uniform color, brightness, or other related properties. 10 [Akiuchi 3 Summary of the Invention According to the first aspect of the present invention, the present invention provides a boron doped diamond made by vapor deposition (CVD), wherein the overall concentration of boron dopant is uniform 'in most of the volume. The difference is less than 50%, and preferably less than 15 2%. It is less than 50μm measured by a lateral analysis at each measurement point. It is better to use a lateral analysis at each measurement point. It is measured to be less than 30 μm and has at least one of the following characteristics: The sacral layer system is formed from a single, preferably a single crystal growth tank composed of {1〇〇}, {113}, {111}, and {110}, And even better are these 20 {100} crystal troughs. The thickness of the (H) layer body is more than 100 μm, and more preferably 500 μm, and the volume of the (lii) layer body is more than 1 mm3, more preferably more than 10 mm3, and even more preferably more than 30 mm3. The term "most layers, 'used in this specification and applied for patent 9 200416197', the description of the invention means at least 70% of the total volume of the diamond layer, preferably more than 80% 'and more preferably It is greater than 95%. The CVD single crystal boron doped diamond layer of the present invention may also contain nitrogen as a kind of dopant. The diamond layer generally contains a nitrogen concentration of no more than ι / 5 boron concentration of 5 degrees, and It is preferably lower than the concentration of boron 丨 / 50. The diamond layer body preferably has "excellent crystalline properties." This "excellent crystalline property allows boron atoms and nitrogen atoms to exist as impurities and point defects such as inclusions, voids, hydrogen, and the like. It can also be used in this way. Most of the volume of the diamond has one or more of the following characteristics, the majority of the volume is as defined above. (A) The layer contains a type that is higher than 1 X 1〇i4 atoms / em3 and lower than 1 X. An uncompensated boron concentration of 10 μatoms / cm3, preferably an uncompensated boron concentration higher than 1 X 10 atoms / cm3 and lower than 2 x 1019 atoms / cm3, and more preferably a higher than 5 χ 1〇i5 atoms / cm3 and less than 2 X 1〇〗 8 atoms 15 / cn &gt; 3 uncompensated boron concentration, (b) — a hole mobility measured at 300K ((ih) is greater than χ 2.1 χ 1010 / (Nh0 · 52) When Nh is less than or equal to 8 χ 1015 atoms / cm3 (function 1) 20 χ 1 χ 1018 / Nh When Nh is greater than 8 χ 1015 atoms / cm3 (function 2) where Nh Is the hole concentration (or equivalent, the concentration of the ionized boron acceptor) '~ The function relationship with Nh is based on the current model and the value of g represents the maximum 10 kan, which is a good description of the invention The existing reading. G is a value greater than M, and preferably a value greater than 1.4, and more preferably a value greater than 17, even more preferably greater than 2.0. (C) Has a nitrogen-gap ( N_V) Chrominaceous correlation at 575nni &amp; 637nm is weak or no cold light characteristics. In particular, when measured at 77K with 纟 丨 such as argon ion laser excitation, the nitrogen void is at 575nm compared with the peak of ㈠ ~ ㈤ The integrated intensity of the zero phonon spectral line is less than 1/50 of the integrated intensity of the Raman line of the diamond falling at 1332 cm · 1, preferably less than 1/100 'and more preferably less than 1/300. (D) —The FWHM of the Raman spectrum measured at 300K with 514 nm argon ion laser excitation is less than 4 cm · 1, preferably less than 3 cm-1, and more preferably Is less than 2 5cm_]. (E) When measured with a Fourier Transform Infrared Spectrometer (FTIR) using the following method, its uncompensated boron concentration has a high degree of heterogeneity. In particular, the distribution frequency of the uncompensated boron concentration A representative sample taken from this layer was obtained using a Fourier transform infrared spectrometer (FTIR). For measurement, the difference in 90% of the measurement, expressed as a percentage of the average value, is less than 50%, and more preferably less than 300 / 〇. Σ) Under ultraviolet excitation, use the following method 238 nmi bound exciton scattering (ΒΕ) was measured at 77K. The combined exciton scattering (ΒΕ) was consistent with the solid indifference of the uncompensated substitution of butterfly atoms. In particular, the BEE frequency distribution measured by this method has a difference of 90% of its measurement on any surface of the layer or the sample of the layer, and the average value is the average value. The percentage indicates that it is less than the article, and more preferably less than 30%. 200416197 发明, description of the invention (g) Under the excitation of ultraviolet rays, the free exciton scattering intensity measured at 77κ using the following method is highly homogeneous. In particular, the frequency distribution of FE measured by this method, under any one of the representative surfaces or samples of the layer, the difference of 9 ()% of the amount, with the average value The percentage indicates that it is less than ⑽, more preferably less than 30%. It is surprising to find that the high mobility in the CVD diamond of the present invention is high. The current mobility difference pattern for carriers (or ionized acceptors) with a concentration of more than 8 x 10 ls atoms / cm3 for these carriers is based on the assumption that boron atoms with 10 acceptors are the main scattering mechanism 'and The nature of its distribution is based on its existence. So this pattern implies that it is impossible to reach a value higher than this. Conversely, the results of the present invention described in this beta book indicate that this mode is wrong, because the mobility of the doped diamonds reported in the previous literature is limited to other ones that can be removed Factor.丨 5 The CVD single crystal boron doped diamond layer of the present invention may be a layer or an area where the surface film is independent or constitutes a larger diamond body or layer. The larger diamond layer or body may be a single crystal or polycrystalline diamond manufactured by CVD or other synthetic methods. The larger diamond layer or body can be doped with boron, nitrogen, or other elements. : 0 The diamond layer body or individual of the present invention may be in the form of a gem. According to another aspect of the present invention, the present invention provides a kind of doped single crystal CVD diamond layer body. This method includes the steps of: providing a diamond substrate with a surface substantially free of crystal defects, providing a source gas (this source gas contains a boron 12 200416197 玖, the source of the invention description), and decomposing the The source gas then allows the homogeneous epitaxial diamond to grow on the surface that is substantially free of crystal defects, thereby producing a single crystal boron doped diamond layer, preferably having the above type. The basic requirement of this method is that the diamond must be grown on a surface that is substantially free of crystal defects 5. The method of the present invention may additionally include the use of a controlled addition of nitrogen to the source gas. The nitrogen in the source gas can provide additional control over the shape produced by the growing single crystal, and the doping ratio of nitrogen will be substantially lower than that of boron. Therefore, the addition of nitrogen, calculated in terms of nitrogen molecules, is within the range of higher than 100.5 and lower than looooppm, and more preferably within the range of higher than 1,000ppm, and more preferably within the range In the range of higher than 3 and lower than 200 Ppm, because the boron of the doped material exists as a scattering color core, it does not have a significant negative impact on the electronic characteristics of the boron doped layer, and it will significantly increase {100} The size of the crystal growth groove, and the size of 15 competitive crystal growth grooves (for example: {Hi}) is reduced. This means that, for growing on a {100} plate, the added nitrogen can cause it to grow while maintaining a substantial {100} crystal growth tank. Those skilled in the art can understand that the stage of using nitrogen to change the shape can be separated from it or continue the stage of the uniform boron doped layer growth. 20 Therefore, the uniform boron doped diamond of the present invention can be applied to a wide range of fields, such as: electrons, tritium testers, high-energy electrons, and the like. In addition, boron doped diamonds can also be used in other applications where boron (B) doping can advantageously produce uniform color, brightness, or other related characteristics. For example, in some applications such as a cutting knife, boron can be used to make the diamond 13 200416197. Description of the invention Stone has a color, thereby improving visual control, and the uniformity of its color can be used as a factor indicating quality. Optionally, the iron stone can be used for decorative applications of polished gemstones. Generally, the uniformity of color can be used as a factor indicating quality. 5 For the various applications mentioned above, the body or layer of the diamond can be produced, for example, by cutting two or more and usually a large number of small particles or units for use in one or more of the above In use. The size of the particles or cells depends on their application. C lean application mode: | 10 Detailed description of the preferred embodiment In addition to the above features, the single crystal boron doped Cvd diamond layer body of the present invention may have one or more of the following features in most of its volume, and most of the features The system is as defined above: 1 Scattered by any single impurity: silicon (si), phosphorus, thionium, nickel 15 (Ni), cobalt (Co), aluminum (A1), manganese (Μη), and iron free exciton scattering (FE) constitutes a level of not more than 1 ppm * and a total amount of these impurities is not more than 5 ppm. The above-mentioned "impurities" do not contain hydrogen and its isotopes. 2 · A cathode cold light (CL) emission signal falling in the wide band of 57511111 is very low 20 or absent, and one is excited by a 514nm argon ion laser at 77K (called The optical cold light (PL) correlation spectral line measured with a 300 mW incident beam) has a peak integrated area that is smaller than or 1/100 times smaller than the integrated area of the peak of 1332 cm-1 &lt; Raman line. It is preferably less than 丨 / 50, and more preferably less than 1/300.

14 200416197 玖、發明說明 3·於電子磁共振光譜(EPR)中,一個帶電中性之單一氮 色蕊[N-C]。之濃度是低於40ppb,更典型地是低於i〇ppb。 4·於電子磁共振譜(EPR)中,一個於g=2.0028之轉動 密度是小於1 X 1017cm·3,更典型是小於5 X l〇16cm·3。於單 5 晶鑽石中,此落在g==2.0028之譜線係與晶格瑕疵濃度有關 ’其較大值典型地存在於:天然之Ila型鑽石中、於CVD鑽 石中(經由凹陷來予以可塑性地破壞)、及於品質不良之均 相蠢生(homoepitaxial)鑽石中。 5.具有優良之光學性質,其紫外線(UV)/可見光及紅 10 外線(IR)穿透性近似lib型鑽石之理論極大值,且更特別地 ’單一取代氮於紫外線(UV)之270nm的吸收值很低或無, 於紅外線光譜之2500至3100cm-1之範圍内的C-Η吸收寬帶 很小或無。半導體硼攙雜鑽石之吸收光譜特徵是一個起始 自近紅外線光譜區域之落在大約370meV向大約2.2eV延伸 15 之連續吸收峰。此吸收峰係負責產生藍色(對濃度〜5 x l〇15cm_3而言是淡藍色,對濃度〜5 χ i〇19cm-3而言是深藍色 至黑色)。可於能量之連續寬帶閥值以下觀測到三個居於 304、348及363meV之顯著寬帶,其等若以高解析度之低 溫觀測時,會展現一個呈相當數量之結構。 20 6. X-射線形貌學(x_ray topography)顯示與長晶有關之 特性中,原始基材之&lt;100&gt;稜線向外生長形成&lt;11〇&gt;稜線。 由於具有潛力之補償氮氣實質低於硼,因此於未補償 删之分佈均一性通常可代表所有的硼濃度之均一性。此外 ,電子特性主要是視未補償之硼濃度而非所有的硼濃度而 15 200416197 玖、發明說明 疋因此未補彳員删濃度之均一性是一項重要的參數。 含有未補償硼之鑽石顯示一種具有一極大值落在 1282(:11^1 (159meV)之單一聲子吸收特徵。據發現該未補償 硼》辰度與此寬帶對nsacm·1之吸光係數效應間是呈一種線 5 I*生關係 ^於至溫下進行量測時,該以ppm計之侧濃度是 1·2 X (1282cm·1之吸光係數)。 匕έ未補償爛之鑽石亦顯示一種可藉由扣除本質性兩 聲子吸收光譜所顯現之一個落在2457cm·1之吸收特徵。當 其1282cm-1之特徵太弱而無法使用時,其未補償硼濃度可 10 使用關係式: 未補侦石朋⑻濃度(PPm)=〇.〇〇142 X 2457咖_1(11^乂111-1) 之積刀吸光係數來推算其落在2457€111·!之積分吸光係數。 於一粒兩側邊平行之鑽石樣品中,一巨觀量測該未補 償硼濃度之均一度可以下列方式來使用傅立葉轉換紅外線 15光譜儀(FTIR)吸光儀。一個整體樣品之代表性紅外光圖譜 特徵可藉由收集該等於室溫下以一個〇. 5 c爪_ i解析度及一個 0.5mm之視角尺寸量測之傅立葉轉換紅外線光譜儀 光請來予以製成,該圖譜包含一個數據點最小值為20點。 其後以其平均量測為依據,挑選上述關係之-,並使用其 2〇來推算出每-個位置之未補償蝴濃度。其後由其濃度量測 之頻率圖來判斷其均一度,以其遠離群組標準差極限值之 平均值來評估量測之百分比。 高品質爛攙雜鑽石之紫外線冷光光譜(於77K下記錄) 顯不一個洛在5.22eV(237.5nm)有很㈣結合激發散射,且 16 200416197 玖、發明說明 於5.27eV(235.2nm)有自由激發散射。對具有硼濃度超過大 約lppm之高品質鑽石而言,這兩個於77K下散射之積分強 度與未補償侧之濃度呈近似正比例。其關係式為: [以ppm計之未補償硼濃度]=1·86 X 1(結合激發強度 5 1(自由激發強度)。 於整個樣品内不同位置之此比例於整個量測之蝴濃度 所涵概範圍内可以被用來判斷該鑽石於接近表面區域之鑽 石均一性。該樣品被塗覆以一薄層(5nm)、均一層金,俾 以避免電荷效應,配置於溫度77K下一部掃瞄電子顯微鏡 10 ’並使用一部MonoCL系統以一 15kV之加速電壓、一 〇·2毫 安培之電流以及一尺寸小於ΙΟμιη X ΙΟμιη之點來收集。 該樣品之UV CL特性可藉由收集該等落在以兩組具有 間隔500μηι或1 mm(視其涵概之面積)之垂直線所交錯而成 之格線内的交叉點來予以定義之譜線作圖,收取最少3〇點 15 之數據。其後由量測之濃度所製成之頻率圖來判斷,評估 90%量測之全部寬度分佈,並以其平均值之百分比來表示 。這個方法被施用來置測結合激發及自由激發散射之強度 ,並計算兩種強度之比例。 由於在抑制結合激發散射之捕捉瑕疵上有顯著差異, 20 而使此等於其後增加該等被觀測到之結合激發散射,除非 每一處之結合激發散射都被完全抑制。 一個強烈的自由激發之存在係意指其實質沒有諸如差 排(dislocation)及雜質之瑕疵。對於聚晶CVD鑽石合成中 之個別結晶而言,低瑕疵及雜質密度與高自由激發自由激 17 200416197 玖、發明說明 子散射(FE)散射之間的關連性已於先前被報導。於較高之 蝴位准(典型是於固體中高於2〇_25ppm)時,其自由激發散 射最終會被高的硼點缺陷密度抑制,而不是因為諸如差排 之結晶缺陷。自由激發散射之均一度是一種優良之不存有 5 局部高缺陷密度量測。 典型之二次離子質譜儀(SIMS)分析法係以一 i〇kV之主 電壓、一典型為1μΑ之電子束電流以及一小於5〇μΜ之空間 解析度來施加於主要之02+電子束。其典型地是循該等於 個於層體表面上標定〇· 5 mm或imm之分析點,典型是由 10每一面得到最少20點,更佳是最少40點。藉由比較植入之 標準點來做校正。得自二次離子質譜儀(SIMS)之數據是藉 由求取群組平均值來予以分析,其後再以求取數據所涵概 之範圍’來表示數據群組中不同%之部分,對於一層體之 兩個相反的主要表面設定大約是相等之加重計分,俾以界 15定一個體積。於一偵測極限為大約2_5 χ 1〇&quot;原子/cm3之下 ,典型之二次離子質譜儀(SIMS)再現性可視其情形落在3_ 5%。 為了界疋一材料之體積,兩個相反的表面是以SIMS 及BE/FE圖谱來予以界定,並藉由紅外線(IR)吸光來界定 20穿透樣品之厚度。量測技術(供用於BE、FE及未補償硼濃 度之SEM分析法,以及供用於所有硼濃度之SIMS分析法) 之解析度與諸等能夠於鑽石中觀測到之不同型態之硼濃度 有關。例如··於具有一 1〇〇μηι之典型顆粒尺寸之聚晶鑽石 中,以一個1mm分析點掃瞄樣品可能會平均掉而於個別之 18 200416197 玖、發明說明 晶粒或長晶槽之間觀察不到實質之硼(B)濃度差異。以一 5〇μιη或更低之解析度來取樣2〇個或更多之數據點時,可 能會展現此種微小等級差異是不存在的。 對製造本發明之均一硼攙雜CVD鑽石單晶層體而言, 5於一粒實質不具有結晶瑕疵之鑽石表面上長晶是很重要的 於此考里下’瑕疲主要是意指差排(disi〇cati〇n)及微細 W縫’其亦包含·雙晶分界(twin boundaries)、本質與攙 雜氮無關之點瑕疲、低頻散射分界及任何一種其他之晶格 延伸性損壞。較佳地,該基材是一種低雙折射型電中性 〇 、lb或Ila咼壓/南溫合成鑽石或一種cvD合成單晶鑽石。 瑕疵會呈兩種方式來損害材料:負面影響電子性質(例如 :電洞之移動性)及影響局部的硼導入。由於差排長晶 (dislocation multiplication)是在厚層體長晶期間發生,因 此於基材及長晶早期控制差排是特別重要的。 5 瑕疵密度可以最容易地使用一種最適於顯現該瑕疵之 電漿或化學蝕刻(被稱為一種顯示電漿蝕刻)來做光學檢視 ,其可使用例如:一種如下述型式之簡易電漿蝕刻。可顯 現兩種型式之瑕疵: 1) 諸4基材材料品質之本質。於挑選之天然鑽石中 〇 ’這些瑕庇密度可低至50/mm2,較典型之數值是1〇/1111112 ,或時而高至l〇6/mm2或更高。 2) 諸等由拋光所產生者,包含沿拋光線之差排結構 及微細裂縫所形成之細碎裂痕。此等之密度可於一樣品中 具有差異’於不良拋光區域或樣品中,其典型之數值是落 19 200416197 玖、發明說明 在大約102/mm2至超過l〇4/mm2之範圍内。 以如上述之與瑕疵有關之表面蝕刻特徵密度而言,瑕 疵密度較佳是少於5 X l〇3/mm2,且更佳是少於1〇2/mm2。 因此,於CVD長晶之基材表面或該表面之下的瑕疵位 5准可藉由小心製備基材來使具有及低於瑕疵位准減至最低 。由於當完成一個基材時,每一個階段皆可能影響落在最 終會形成基材表面之材料内部之瑕疵密度,因此於本案之 製造中包含任何一種施用於該等得自礦場採石(於天然鑽 石之情形)或合成(於合成材料之情形)材料之方法。特別的 10加工步驟可包含習用之鑽石製法,例如:機械磨削、磨光 (lapping)及拋光(於此申請案中特別適用於低瑕疵位准), 以及較少使用之技術,例如:雷射製造或離子植入及剝離 技術、化學/機械拋光、以及液體及電漿兩種化合 物製造技術。此外,該表面Rq(以點針剖面儀(styius 15 pr〇fil〇meter),較佳是以大於〇.〇〇8mm之長度來量測之平 坦表面剖面)應降至最低,於電漿蝕刻前之典型數值是不 超過數奈米(即低於10奈米)。 2014 200416197 发明, description of the invention 3. In the electron magnetic resonance spectroscopy (EPR), a single charged nitrocellulose [N-C]. The concentration is below 40 ppb, and more typically below IOppb. 4. In the electronic magnetic resonance spectroscopy (EPR), a rotational density at g = 2.0028 is less than 1 X 1017 cm · 3, and more typically less than 5 X 1016 cm · 3. In single 5 crystal diamonds, the line that falls at g == 2.0028 is related to the concentration of lattice defects. Its larger values are typically found in natural Ila diamonds, in CVD diamonds (through depression Plastically breakable), and in poor quality homoepitaxial diamonds. 5. With excellent optical properties, its ultraviolet (UV) / visible light and red 10 outer line (IR) penetration approximates the theoretical maximum value of lib diamonds, and more particularly 'single substitution of nitrogen at 270nm of ultraviolet (UV) The absorption value is very low or absent, and the C-Η absorption bandwidth in the range of 2500 to 3100 cm-1 of the infrared spectrum is small or absent. The characteristic of the absorption spectrum of semiconductor boron doped diamond is a continuous absorption peak starting from the near-infrared spectral region and extending from about 370 meV to about 2.2 eV 15. This absorption peak is responsible for generating blue (light blue for a concentration of ~ 5 x 1015 cm_3, and dark blue to black for a concentration of ~ 5 x 1019 cm-3). Three significant broadbands at 304, 348, and 363 meV can be observed below the continuous broadband threshold of energy, and if observed at high resolution and low temperature, a significant number of structures will be exhibited. 20 6. X-ray topography shows that, in the characteristics related to the crystal, the &lt; 100 &gt; edge line of the original substrate grows outward to form &lt; 11〇 &gt; edge line. Since the potential of compensated nitrogen is substantially lower than that of boron, the uniformity of the distribution in uncompensated sources usually represents the uniformity of all boron concentrations. In addition, the electronic characteristics mainly depend on the uncompensated boron concentration instead of all boron concentrations. 15 200416197 玖, description of the invention 疋 Therefore, the uniformity of the concentration is an important parameter. Diamonds containing uncompensated boron show a single phonon absorption characteristic with a maximum value falling at 1282 (: 11 ^ 1 (159meV). It was found that the uncompensated boron and the broadband absorption coefficient effect on nsacm · 1 The relationship between them is a line of 5 I *. ^ At the temperature measurement, the side concentration in ppm is 1.2 X (the absorption coefficient of 1282cm · 1). The uncompensated rotten diamond also shows An absorption feature falling at 2457cm · 1 that can be revealed by subtracting the essential two-phonon absorption spectrum. When its 1282cm-1 feature is too weak to be used, its uncompensated boron concentration can be 10 using the relationship: The concentration of the unrefined detective stone pentamidine (PPm) = 〇〇〇142 X 2457 ga_1 (11 ^ 乂 111-1) is used to calculate the integral absorbance coefficient which falls at 2457 € 111 · !. In a diamond sample with two sides parallel to each other, a macroscopic measurement of the uniformity of the uncompensated boron concentration can be performed using a Fourier transform infrared 15 spectrometer (FTIR) absorber in the following manner. Representative infrared light spectrum characteristics of a whole sample This can be obtained by collecting a resolution of 0.5 c claw_i at room temperature. And a Fourier Transform Infrared Spectrometer with a 0.5mm angle of view measurement is made. The map contains a minimum of 20 data points. Then, based on its average measurement, select the above relationship-, and Use its 20 to calculate the uncompensated butterfly concentration at each location. Then determine its uniformity from the frequency diagram of its concentration measurement, and evaluate the measurement by its average value far from the limit of the group standard deviation. Ultraviolet cold light spectrum of high-quality rotten diamonds (recorded at 77K) shows that there is very strong combined excitation scattering at 5.22eV (237.5nm), and 16 200416197, and the invention description is at 5.27eV (235.2nm). Free-excitation scattering. For high-quality diamonds with boron concentrations exceeding approximately 1 ppm, the integrated intensity of the two scattering at 77K is approximately proportional to the concentration on the uncompensated side. The relationship is: [uncompensated in ppm Boron concentration] = 1.86 X 1 (combined with excitation intensity 5 1 (free excitation intensity). This ratio at different positions in the entire sample can be used to judge the drill within the approximate range of the measured butterfly concentration. The uniformity of the diamond near the surface area. The sample is coated with a thin layer (5nm) and a uniform layer of gold to avoid charge effects. It is arranged at a temperature of 77K and a scanning electron microscope 10 'and a MonoCL is used. The system was collected with an acceleration voltage of 15kV, a current of 10.2 milliamps, and a point with a size smaller than 10 μιη X 10 μιη. The UV CL characteristics of the sample can be collected by collecting these samples at two intervals of 500 μηι or 1 The line points defined by the intersection of the grid lines intersected by the vertical lines of mm (depending on the approximate area) are plotted, and a minimum of 30:15 data is collected. Then judge from the frequency diagram made by the measured concentration, evaluate the entire width distribution of 90% of the measurement, and express it as a percentage of the average. This method was applied to measure the intensity of combined excitation and free excitation scattering and calculate the ratio of the two intensities. Because there is a significant difference in trapping artifacts that suppress the combined excitation scattering, 20 this is equal to the subsequent increase in the observed combined excitation scattering, unless the combined excitation scattering is completely suppressed everywhere. The existence of a strong free excitation means that it is substantially free of defects such as dislocation and impurities. For individual crystals in polycrystalline CVD diamond synthesis, the correlation between low defect and impurity densities and high free-excitation free-excitation 17 200416197 发明, description of the invention has been previously reported. At higher butterfly levels (typically higher than 20-25 ppm in solids), its free excitation scattering will eventually be suppressed by high boron point defect densities, rather than due to crystal defects such as differential emissions. The uniformity of free excitation scattering is an excellent non-existent 5 local high defect density measurement. A typical secondary ion mass spectrometer (SIMS) analysis method applies a main 02+ electron beam with a main voltage of 10 kV, an electron beam current of typically 1 μA, and a spatial resolution of less than 50 μM. It typically follows the analysis points calibrated at 0.5 mm or imm on the surface of the layer, typically at least 20 points are obtained from each side of 10, and more preferably at least 40 points. Calibration is performed by comparing the implanted standard points. The data obtained from the secondary ion mass spectrometer (SIMS) is analyzed by obtaining the group average, and then the range of the data is used to represent the different percentages of the data group. The two opposite major surfaces of a layer are set to approximately equal weighting points, and a volume of 15 is defined. Below a detection limit of about 2_5 χ 10 &quot; atoms / cm3, the reproducibility of a typical secondary ion mass spectrometer (SIMS) may be in the range of 3_5%. To define the volume of a material, the two opposite surfaces are defined by SIMS and BE / FE spectra, and the thickness of the penetrating sample is defined by infrared (IR) absorption. The resolution of measurement techniques (for SEM analysis for BE, FE and uncompensated boron concentration, and SIMS analysis for all boron concentration) is related to the different types of boron concentration that can be observed in diamonds . For example, in a polycrystalline diamond with a typical particle size of 100 μm, scanning a sample with a 1 mm point of analysis may fall evenly between the individual 18 200416197 玖, invention description grains or crystal growth tanks No substantial difference in boron (B) concentration was observed. When sampling 20 or more data points at a resolution of 50 μm or less, it may be shown that such minor level differences do not exist. For the production of the uniform boron-doped CVD diamond single crystal layer of the present invention, it is important that 5 crystals grow on the surface of a diamond that does not substantially have crystal defects. In this test, the term “defective fatigue” mainly means poor discharge. (Disiocation) and fine W slits also include twin boundaries, point defects that are essentially independent of doped nitrogen, low-frequency scattering boundaries, and any other type of lattice elongation damage. Preferably, the substrate is a low birefringence type electrically neutral 0, lb, or Ila pressure / South temperature synthetic diamond or a cvD synthetic single crystal diamond. Defects can damage materials in two ways: negatively affecting electronic properties (eg, hole mobility) and affecting local boron introduction. Since dislocation multiplication occurs during thick body growth, it is particularly important to control dislocations in the substrate and in the early stages of growth. 5 Defect density The easiest to use a plasma or chemical etch (known as a display plasma etch) that is best suited to visualize the defect for optical inspection. It can be used, for example, as a simple plasma etch of the following type. There are two types of defects: 1) the essence of the quality of the 4 substrate materials. In selected natural diamonds, these flaw densities can be as low as 50 / mm2, more typically 10/1111112, or sometimes as high as 106 / mm2 or higher. 2) Those produced by polishing include fine cracks formed by the differential structure along the polishing line and micro-cracks. These densities may differ in a sample 'in poorly polished areas or samples. Typical values are 19 200416197 发明, invention description is in the range of about 102 / mm2 to more than 104 / mm2. In terms of the surface etching characteristic density related to defects as described above, the defect density is preferably less than 5 X 10 / mm2, and more preferably less than 102 / mm2. Therefore, the defect level on the substrate surface of the CVD growth substrate or below the surface can be minimized by carefully preparing the substrate. Because when each substrate is completed, each stage may affect the density of defects that fall inside the material that will eventually form the surface of the substrate, the manufacturing in this case includes any kind of In the case of diamonds) or synthetic (in the case of synthetic materials) materials. The special 10 processing steps may include conventional diamond manufacturing methods, such as: mechanical grinding, lapping and polishing (especially applicable to low defect levels in this application), and less commonly used techniques, such as: Laser manufacturing or ion implantation and stripping technology, chemical / mechanical polishing, and liquid and plasma compound manufacturing technology. In addition, the surface Rq (a flat surface cross-section measured with a styius 15 profilometer, preferably a length greater than 0.008 mm) should be minimized and etched by plasma The previous typical value is no more than a few nanometers (that is, less than 10 nanometers). 20

一種特別之減少基材表面損壞之方法係包含一種於均 貝從生鑽石長晶之表面原位(in situ)電漿蝕刻。理論上這 種韻刻並不需要原位’亦不需要於其後立刻進行長晶,但 原位可達到最高效益,因為其可避免任何一種進一步物理 性損壞或化學性汙染之風險。當長晶亦是以電漿為主之方 法時’-種原㈣刻也通常是最便利的。電漿㈣可使用 類似沉積或鑽石長晶之方法,但不使用任何_種含碳來源 20 玖、發明說明 氣體且通常是於一略低之溫度下,俾以產生較佳之蝕刻速 率控制。例如,其可由下列之一或數者所構成: (0 一種氧氣蝕刻法,其主要是使用氫氣,可任擇地 具有一少量之氬氣,並需要一少量之02。典型之氧氣蝕刻 條件是50-450 x 102 Pa, 一種包含氧氣含量卜4%之姓刻氣 體,一種0-30%之氬氣含量,以及平衡之氫氣,所有的百 分比是以體積計,具有一個600_11〇(rc之基材溫度(更典型 是800°C)以及一個典型為歷時3-6〇分鐘之期間。 (ii) 一種類似於⑴之氫氣蝕刻法,但其中不含氧氣。 (in)選擇性之供用於蝕刻之方法,但不單獨以氬氣為 主,氫氣及氧氣亦可被使用,例如:諸等使用鹵素、其他 惰性氣體或氮氣。 蝕刻法係典型地由一種氧氣蝕刻,繼之以一種氫氣蝕 刻,然後直接移入該藉由導入碳來源氣體之合成中。可選 擇蝕刻時間/溫度,俾使由製造留存在表面之損壞能夠被 移除,但不致形成一種高度粗縫之表面,且沒有廣泛沿延 伸性瑕疵之蝕刻(例如:貫穿表面之差排(disl〇cati〇n)),及 藉此產生深凹洞。由於蝕刻是侵蝕性,因此這些階段特別 重要的是其組份之合成槽設計及材料選擇,俾使沒有材料 被電漿轉移入氣相或移入基材表面。該氫氣蝕刻繼之以氧 氣I虫刻之方法對該等由氧氣餘刻所造成之角度磨損之結晶 瑕疵較不具專一性,其等會侵害性攻擊此種瑕疵並提供_ 種較平緩、較適合接續長晶之平面。 CVD鑽石於其上長晶之鑽石基材面或表面較佳是 200416197 玖、發明說明 {100} {110丨、{113}或{111}表面。受限於製法,實際樣 U口表面方位可與這些理論之方位相差高達5度,某些個例 可向達10度’雖然這會不利地影響再現性而較不為所欲。 於本發明方法中亦很重要的是適當控制CVD長晶之環 5浼中的雜質含量。更特別地,該鑽石長晶必須發生在一實 貝不S污染物之空氣中,且該刻意添加之硼(以及設若使 用氮)被適當地控制。所需控制之硼及氮攙雜濃度係視實 施例而定’但典型是需要安定地大於20%,更典型是需要 女疋地大於1 〇%,甚至更典型是需要安定地大於。此種 10控制必須小心控制來源氣體之氮雜質,因為氮是一種常見 之污染物。為了達到這種控制程度,於小心添加氮之前, 該來源氣體中之氮的位准通常被維持於氣相中低於5〇〇 ppb(以氣體總體積之分子分量計),較佳是低於3〇〇ppb,更 佳是低於lOOppb。量測氣相中低至⑺帅沖之絕對及相對氮 15 (或硼)濃度需要精密之監測儀器,例如··氣體層析法來予 以達成。此種方法之一個實例被描述如下: 標準氣體層析法(GC)包含:使用一個被最佳化來供最 大流速及最小無效空間(dead volume)之窄孔樣品線,並自 感興趣之點抽取之一個氣體樣品流,然後在被通入廢棄物 20 之前,通過GC樣品線圈。該GC樣品線圈是一段以一固定 且已知體積來環繞成之管線(對標準大氣壓注射而言,典 型是lcm3),其可自其居於樣品之位置被轉移入該注入氣 體層析管柱中之載體氣體(高純度之氦氣)線。此可將一個 已知體積之氣體樣品置入流入管柱之氣體流中;於該項技 22 200416197 玖、發明說明 藝中,這個步驟被稱為樣品注射。 η樣品注射是藉由載體氣體通過第1個GC管枉(填充一種 被最佳化來供分離簡單無機氣體之分子濾器),然後被部 刀地刀離,然而高濃度之原始氣體(例如·· &amp;、氯)會致使 5該官柱全分離之飽和(例如:II氣滯&amp;(nitrogen diffic’。其後該自第&quot;固管柱流出之部分被注入第2個管 柱,藉此來避免大部分之其他氣體被通入第2個管柱,避 免吕柱飽和並使該標的氣體(氮氣NO完全分離。這個步驟 被稱為“心臟切割,,(“heart-cutting”)。 1〇 第2個管柱之輸出流通過一部排氣離子化偵測儀(DID) 可偵測δ亥等由於樣品存在所造成之經由載體氣體漏放 流增加。化學結構可藉由該等以標準氣體混合物來予以校 正之氣體滯留時間來予以鑑定。該DID之反應於5倍之級數 内是線性的且其是使用特殊校正之氣體混合物來予以校正 15 ,其等典型是居於1〇4〇〇PPm之範圍内,藉由測定重量之 刀析法其後由供應薇商做驗證。該DID之線性關係可以 謹慎之稀釋試驗來予以驗證。 此種已知技藝之氣體層析法已被更進.一步修改,並研 發如下來供用於此申請案:於本案分析之方法典型是於 20 50-500 X 102 Pa下操作。正常GC操作係使用超過來源氣體 之氣壓之過量壓力來驅動氣體通過樣品線。在本案中,樣 品是藉由在管線之廢棄物端連接一部真空幫浦來予以驅動 ,且該樣品是在低於空氣壓力下被抽取。然而,由於氣體 在管線中流動阻抗會造成管線壓力顯著降低,影響校正及 23 200416197 玖、發明說明 靈敏度。因此,於該樣品線圈及真空幫浦之間置放一個閥 ,其於樣品注射前之一段歷時很短的期間内被關閉,俾使 樣cr 口線圈之壓力能夠穩定並以一壓力計來予以量測。為確 保注入一足量之樣品氣體,該樣品線圈之體積被增加至大 5約5 cm。視该樣品管線之設計而定,此技藝可有效地在 低至大約70 X 102Pa之壓力下被操作。該GC之校正可視注 入之樣品體積而定,且可藉由同在分析下能夠供應與樣品 使用相同之壓力校正GC來得到最高之準確度。必須觀測 非常高標準之真空及氣體操作,來確保量測是準確的。 10 取樣點可以落在:合成槽之上游(俾以定性輸入氣體) 、居於槽内(俾以定性槽内環境)、或槽之下游。 典型地以乙硼烧(B2H6)來被添加至製程中之删(B)是使 用一種校正且稱為1 〇〇ppm之配於Ha之乙硼烷(B2H6)來簡化 控制,相同地以氮氣(NO來被添加至製程中之氮是使用一 15種杈正且稱為100pPm之配於H2之氮氣(N2)來簡化控制。添 加之硼(B)及氮(N)皆以ppm來表示,其係以[B2H6]/[所有的 氣體]來計算硼(B),其中[Β^6]係代表乙硼烷(B2h6)之莫耳 數,而[所有的氣體]則代表所有存在氣體之莫耳數),相同 地其係以[N2]/[所有的氣體]來計算氮氣(n2)。 2〇 該來源氣體可以是任何一種該技藝中所已知且包含含 碳材料,其可解離產生自由基或其他具反應性之物種。該 氣體混合物亦通常會包含適合提供呈原子形式之氫氣或一 種鹵素。 該來源氣體之解離較佳是於一部使用微波能量之反應 24 200416197 玖、發明說明 器(其等之範例係為該技藝中所已知)内進行。然而,自該 反應器轉移任何一種雜質應減至最少。可使用—種微波系 統來破保錢被置放在除了該鑽石H基材表φ及其基 座(基材制)之外,遠處。—個㈣之基座 材料的實例是m、較碳切。—個較佳之反應槽 材料的實例是:不銹鋼、鋁、銅、金及鉑。 應使用可產生高微波功_(典型是3肩千瓦(請)來供 用於直徑25侧随之基材載體)之_種高電襞密度,以及 高氣體壓力(50-500 X 102 Pa ,較佳是 1〇〇 45〇 χ i〇2 pa)。 10A special method for reducing the surface damage of the substrate comprises a plasma etching in situ on the surface of the crystals of the raw diamond. Theoretically, this rhyme does not need to be grown in situ or immediately afterwards, but in situ can achieve the highest benefit because it can avoid any risk of further physical damage or chemical pollution. When the crystal growth is also a plasma-based method, the 'origin engraving' is usually the most convenient. Plasma can be used similar to deposition or diamond growth, but does not use any carbon source 20 20, description of the invention gas and usually at a slightly lower temperature, 俾 to produce better etch rate control. For example, it can be composed of one or more of the following: (0) An oxygen etching method, which mainly uses hydrogen, optionally has a small amount of argon, and requires a small amount of 02. Typical oxygen etching conditions are 50-450 x 102 Pa, a gas containing the last name with an oxygen content of 4%, an argon content of 0-30%, and a balanced hydrogen, all percentages are by volume, with a base of 600_11〇 (rc Material temperature (more typically 800 ° C) and a typical duration of 3 to 60 minutes. (Ii) a hydrogen etching method similar to rhenium, but containing no oxygen. (In) selective for etching The method, but not solely argon, hydrogen and oxygen can also be used, for example: halogen, other inert gases or nitrogen are used. The etching method is typically etched by an oxygen, followed by a hydrogen etch, Then directly move into the synthesis by introducing a carbon source gas. The etching time / temperature can be selected so that the damage left on the surface by manufacturing can be removed, but does not form a highly rough surface, and there is no extensive Etching of elongational defects (for example: disl0cation across the surface), and thereby creating deep recesses. Since etching is aggressive, these stages are especially important for the design of the composition grooves of their components And material selection, so that no material is transferred into the gas phase or the surface of the substrate by the plasma. The hydrogen etching followed by the method of oxygen I insect engraving is less crystalline defects caused by the angular wear caused by the residual oxygen. Specificity, which will attack such defects invasively and provide _ a kind of flatter, more suitable for crystal growth. The surface or surface of the diamond substrate on which CVD diamond is grown is preferably 200416197 玖, description of the invention { 100} {110 丨, {113}, or {111} surface. Subject to the manufacturing method, the actual orientation of the U-port surface may differ from these theoretical orientations by as much as 5 degrees, and in some cases may reach 10 degrees. It affects the reproducibility less than desired. It is also important in the method of the present invention to appropriately control the impurity content in the ring 5 of the CVD growth. More specifically, the diamond growth must occur in a solid shell. S pollutants in the air, and The deliberately added boron (and if nitrogen is used) is appropriately controlled. The boron and nitrogen dopant concentration to be controlled depends on the embodiment ', but typically needs to be more than 20% stable, more typically it needs to be more than 1 〇%, even more typically, it needs to be more than stable. This type of control must carefully control the nitrogen impurities of the source gas, because nitrogen is a common pollutant. In order to achieve this degree of control, the source gas must be carefully added before nitrogen is added. The level of nitrogen in the gas is usually maintained below 500 ppb (based on the molecular weight of the total gas volume) in the gas phase, preferably below 300 ppb, more preferably below 100 ppb. The absolute and relative nitrogen 15 (or boron) concentration in the phase as low as Xuan Shuaichong requires precise monitoring equipment, such as gas chromatography to achieve it. An example of this method is described below: Standard gas chromatography (GC) involves using a narrow-hole sample line optimized for maximum flow rate and minimum dead volume, and from the point of interest A gas sample stream is drawn and then passed through the GC sample coil before being passed to waste 20. The GC sample coil is a piece of tubing surrounded by a fixed and known volume (for standard atmospheric pressure injection, typically 1 cm3), which can be transferred into the injection gas chromatography column from the position where the sample is located. Carrier gas (high purity helium) line. This allows a known volume of gas sample to be placed into the gas stream flowing into the column; in this technique, the process is called sample injection. η sample injection is through the carrier gas through the first GC tube (filled with a molecular filter optimized for the separation of simple inorganic gases), and then knife-by-knife, but high-concentration original gas (such as · · &Amp;, chlorine) will cause the full separation of the 5 official column to be saturated (for example: II gas lag &amp; (nitrogen diffic '. Then the part flowing out of the &quot; solid pipe column is injected into the second pipe column, This is to prevent most of the other gases from being passed into the second column, to avoid saturation of the column and to completely separate the target gas (nitrogen NO. This step is called "heart-cutting") 10 The output flow of the second column can be detected by an exhaust ionization detector (DID) to increase the leakage and release of carrier gas through the carrier gas caused by the presence of samples. The chemical structure can be determined by these The gas residence time corrected by the standard gas mixture is used for identification. The response of this DID is linear within 5 times the order and it is calibrated using a specially calibrated gas mixture15, which is typically at 1 °. Within the range of 4〇PPm The weight analysis method was later used to verify by the supplier. The linear relationship of the DID can be verified by careful dilution tests. This known technique of gas chromatography has been further improved. One step modification, It was developed for this application as follows: The method analyzed in this case is typically operated at 20 50-500 X 102 Pa. Normal GC operation uses excess pressure to exceed the pressure of the source gas to drive the gas through the sample line. In this case The sample is driven by connecting a vacuum pump to the waste end of the pipeline, and the sample is drawn under air pressure. However, the pressure of the pipeline in the pipeline will cause the pipeline pressure to decrease significantly. It affects the correction and the sensitivity of the invention description. Therefore, a valve is placed between the sample coil and the vacuum pump, which is closed within a short period of time before the sample injection, so that the sample cr port is closed. The pressure of the coil can be stabilized and measured with a pressure gauge. To ensure that a sufficient amount of sample gas is injected, the volume of the sample coil is increased to about 5 to 5 cm. Depending on the design of the sample line, this technique can be effectively operated at pressures as low as about 70 X 102Pa. The calibration of the GC can depend on the volume of the sample injected, and can be analyzed by simultaneous analysis. The supply and sample use the same pressure-corrected GC to obtain the highest accuracy. Very high standards of vacuum and gas operation must be observed to ensure that the measurement is accurate. 10 The sampling point can fall: upstream of the synthesis tank (for qualitative purposes) Input gas), reside in the tank (to characterize the environment in the tank), or downstream of the tank. Typically, diboron (B2H6) is added to the process. The deletion (B) uses a correction and is called 1 〇 〇ppm diborane (B2H6) mixed with Ha to simplify the control, the same nitrogen (NO to be added to the process of nitrogen is using 15 kinds of branches and is called 100pPm nitrogen H2 (N2 ) To simplify control. The added boron (B) and nitrogen (N) are expressed in ppm, which is calculated as [B2H6] / [all gases], where [B ^ 6] represents diborane (B2h6) Molar number, and [all gases] represents the mole numbers of all existing gases), which is similarly calculated as [N2] / [all gases] for nitrogen (n2). 20 The source gas can be any of the materials known in the art and containing carbonaceous materials which can dissociate to produce free radicals or other reactive species. The gas mixture will also typically contain hydrogen or a halogen suitable for providing atomic form. The dissociation of the source gas is preferably carried out in a reaction using microwave energy, 24 200416197, an invention demonstrator (examples of which are known in the art). However, the transfer of any impurities from the reactor should be minimized. A microwave system can be used to break the security deposit and place it in a distance other than the diamond H substrate surface φ and its base (made of substrate). An example of a base material is m, more carbon cut. An example of a preferred reaction vessel material is: stainless steel, aluminum, copper, gold, and platinum. Should use a kind of high electric power density that can generate high microwave power (typically 3 shoulder kilowatts (please) for 25 sides with a substrate carrier) and high gas pressure (50-500 X 102 Pa, compared with It is preferably 1045 × 10 2 pa). 10

使用上述條件下,可製造出具有厚的高品質蝴捷雜單 曰曰CVD鑽石層體,其具有異常高之流動性之電荷載體並具 有一種形體最適合用以製造該等供用於商業產品之均一大 體積。 以下描述本發明之實施例。 15 實施例1Under the above conditions, a thick, high-quality CVD diamond layer can be manufactured, which has an extremely high flow charge carrier and has a shape that is most suitable for making these uniform for commercial products. Big volume. Hereinafter, embodiments of the present invention will be described. 15 Example 1

適用於合成本發明單晶CVD鑽石之基材可以製備如下: ⑴最佳之原料材料(la型天然寶石及Ib型高壓高溫 (HPHT)寶石)挑選是以顯微鏡審視及雙折射影像來鑑定基 材是不含斑點及雜質。 20 (丨丨)雷射切割、磨光(lapping)及拋光來使表面瑕疲減 至最少’使用一種顯示電漿蝕刻法來測定該藉由加工來被 導入之瑕疲位准。 (iii)於最佳化之後,可依慣例來製造基材,其所具有 之可由一種顯示電漿蝕刻法來予以量測之瑕疵密度係主要 25 200416197 玖、發明說明 是視材質而定,且少於5 x 103/mm2 ’且通常是少於ι〇2 /mm。藉由此方法來製備基材,並於其後使用於接續之合 成法中。 一種高溫/高壓合成之la型鑽石係於一高壓壓製下長晶 5 並使用上述方法來使基材瑕疵減至最少,俾以形成一個 尺寸為7.65mm X 8.25 mm2且厚度為〇.54mm之每一面皆為 {100}之拋光平板。於此階段之表面粗糙度Rq是小於 。該基材是使用一高溫之銅鋅合金焊接來予以設置於一鎢 基材上。其被導入一反應器内,並起始一個如上述之電漿 10 及長晶週期: 1) 該2.45GHz反應器被預先以配備之純淨機來調降 居於進料氣體流内之不為所欲之污染物,俾使其低於 80ppb 〇 2) 於270 X 1〇2 Pa及一個753〇c之基材溫度下,使用 15 15/75/6〇〇SCCm(標準每秒立方公分)之氧氣/氬氣/氫氣 (〇2/Al/H2)來進行一種原位(in situ)氧氣電漿蝕刻。 3) 此可在不干擾之下,於一 758它之溫度(歷時1〇分 鐘内)自氣體流中移除氧氣並移入一種氫氣蝕刻。 4) 此係藉由添加碳源(於此實施例中為cH4)及攙雜氣 20體來移入長晶之製程。於此實施例中,甲烷(CH4)於氣相中 之流動是3〇Sccm。乙硼烷(B#6)被使用作為硼攙雜物之來 源。該乙硼烷(Β^6)氣體濃度是l.4ppm。溫度為780°C。 5) 於長晶期完成時,自反應器移除該基材,然後自 4基材移除該生長於上述之一低瑕疵密度之表面之Cvd鑽 26 200416197 玖、發明說明 石層體。 6) 其後拋平此層體來產生一粒具有&lt;1〇〇&gt;稜線且側 面尺寸大約為5x 5mm2之均一硼攙雜、厚度73 5μιη層體。 7) 此被鑑定為CD-1之層體被清洗並以喷氧氣(〇2)來 5清除其表面,然後使用沃氏技術(Hall technique)來測試其 移動性。測得其於300K為360cm2/Vs,於440K為185The substrate suitable for synthesizing the single crystal CVD diamond of the present invention can be prepared as follows: ⑴ The best raw materials (la-type natural gemstones and Ib-type high-pressure high-temperature (HPHT) gemstones) are selected by microscopic examination and birefringent images to identify the substrate. It is free of spots and impurities. 20 (丨 丨) Laser cutting, lapping, and polishing to minimize surface flaws' A display plasma etching method was used to determine the flaw levels that were introduced by processing. (iii) After optimization, the substrate can be manufactured according to conventional practices. The density of defects that can be measured by a display plasma etching method is mainly 25 200416197. The description of the invention depends on the material, and Less than 5 x 103 / mm2 'and usually less than ιOM2 / mm. A base material is prepared by this method, and thereafter used in a subsequent synthesis method. A high-temperature / high-pressure synthesized la-type diamond is grown under a high-pressure compaction 5 and the above method is used to minimize substrate defects, so as to form a size of 7.65 mm X 8.25 mm2 and a thickness of 0.54 mm. Polished plates with {100} on one side. The surface roughness Rq at this stage is less than. The substrate is placed on a tungsten substrate using a high-temperature copper-zinc alloy weld. It is introduced into a reactor and starts a plasma 10 and crystal growth cycle as described above: 1) The 2.45GHz reactor is pre-adjusted with a pure machine equipped to reduce the inhabitation in the feed gas flow. Desired pollutants, so that it is lower than 80ppb 〇2) at a substrate temperature of 270 X 102 Pa and a 753 ° C, using 15 15/75 / 6〇SCCm (standard cubic meters per second) Oxygen / Argon / Hydrogen (〇2 / Al / H2) to perform an in-situ oxygen plasma etching. 3) This can remove oxygen from the gas stream at a temperature of 758 (within 10 minutes) and move into a hydrogen etch without interference. 4) This is a process of adding crystals by adding a carbon source (cH4 in this example) and a dopant gas 20 body. In this example, the flow of methane (CH4) in the gas phase is 30 Sccm. Diborane (B # 6) is used as a source of boron dopants. The diborane (B ^ 6) gas concentration was 1.4 ppm. The temperature is 780 ° C. 5) When the growth phase is completed, remove the substrate from the reactor, and then remove the Cvd drill grown on one of the above-mentioned low defect density surfaces from the substrate. 6) The layer is subsequently flattened to produce a uniform boron doped layer with a thickness of <50.00 mm and a side dimension of about 5 x 5 mm2 and a thickness of 73 5 µm. 7) The layer identified as CD-1 was cleaned and its surface was cleaned with a spray of oxygen (02), and then its mobility was tested using the Hall technique. Measured at 300K is 360cm2 / Vs and 440K is 185

cm2/VS 〇此數據與一個以聲學聲子散射之模式所預測之T_L: 倚賴性是一致的。 8) 使用二次離子質譜儀(SIMS)來分析此層體,可測 1〇 得其具有均一性之侧(B)總濃度為6·2 X 1018原子/cm3。 9) 使用沃氏技術(Hall technique)測試其載體濃度於 200K為 4·5 X 1〇13,於 300K為 4 X 1015,於 500K為 1·6 X 1〇17 。該於300K為4 X 1015之載體濃度依照函數(1)所推算之移 動性上限值為163cm2/Vs ’其測量值則為360cm2/Vs。因此 15 所顯示之G因子(定義如上述之函數1)較習知技藝之材料高cm2 / VS 〇 This data is consistent with the T_L: dependence predicted by an acoustic phonon scattering pattern. 8) Using a secondary ion mass spectrometer (SIMS) to analyze this layer, it can be determined that the side with uniformity (B) has a total concentration of 6 · 2 X 1018 atoms / cm3. 9) The carrier technique was used to test the carrier concentration at 4.5K 10 5 at 200K, 4 X 1015 at 300K, and 1.6 X 1017 at 500K. The upper limit of the mobility of the carrier concentration at 4K 1015 at 300K calculated according to function (1) is 163 cm2 / Vs', and the measured value is 360 cm2 / Vs. Therefore, the G factor (defined as function 1 above) shown by 15 is higher than that of materials of conventional skill

2·2。 實施例2 以下列改變之條件來重覆實施例1所述之方法: 1) 拋光之高壓高溫(HPHT)基材為厚度500μιη之所有 20 表面皆為{100}之5 X 5mm正方形。 2) 於333 X 1〇2 Pa及一個800°C之基材溫度下,使用 15/75/600sccm(標準每秒立方公分)之氧氣/氬氣/氫氣 (CVAr/H2)來進行一種原位(in situ)氧氣電漿蝕刻。 3) 繼之以一個歷時30分鐘之氫氣蝕刻,其中氧氣 27 200416197 玖、發明說明 (〇2)自氣體流中被移除,且維持溫度810°C。 4)長晶是藉由添加36sccm之甲烷(CH4)氣流,以及分 別可產生氣體濃度0.05及7ppm之乙硼烷(B2H6)及氮氣(N2) 氣流。溫度為812°C。 5 5)於長晶期完成時,自反應器移除該基材,然後自 該基材移除該CVD鑽石層體。 6)其後拋平此被鑑定為CD-2之層體來產生一粒具有 &lt;100&gt;稜線且側面尺寸大約為7 X 7mm2之均一侧攙雜、厚 度410μηι層體。 10 7)使用SIMS來分析該層體,一系列量測顯示該層體 具有一均一侧濃度為6.1 X 1018原子/cm3。該删(B)濃度之 SIMS圖譜顯示:在該圖譜所具有之解析度下沒有濃度差 異’該圖譜具有一小於30mm之側面空間解析度及一高於 10%之量測靈敏度位准。量測到之氮濃度皆低於5 χ 1〇ι5原 15 子/cm3。 8)此被鑑定為CD-2之層體被清洗並以喷氧氣(〇2)來 清除其表面’然後測試其移動性及載體濃度。測得其載體 濃度超過4·5 X 1013,且量測其流動性係超過2.5 x 1〇3 cm2/Vs,產生G值為大約1.5。 2 〇 9) C D -2可以下述數據來做進一步定性: (i) 其CL光譜顯示自由及結合激發,且無其他特 徵。 (ii) 電子磁共振譜(EPR)顯示無電中性取代氣且只 具有一 g=2.0028之微弱譜線。 28 200416197 玖、發明說明 (iii) 光譜顯示其具有除了與一6·5 X 10丨6原子/cm3之 未補償硼濃度有關之特徵性吸收之外之近似理論穿透度。 (iv) X射線振動曲線(X-ray rocking curve)圖譜顯示 該樣品之角度分佈是小於10 arc sec。 5 (v)拉曼光譜顯示一譜線寬度之半高寬值(FWHM) 為大約2cm_1。 實施例3twenty two. Example 2 The method described in Example 1 was repeated with the following changed conditions: 1) The polished high pressure and high temperature (HPHT) substrate was 500 μm thick and all 20 surfaces were {100} 5 x 5 mm squares. 2) At 333 X 10 2 Pa and a substrate temperature of 800 ° C, use in situ oxygen / argon / hydrogen (CVAr / H2) at 15/75/600 sccm (standard cubic centimeters per second) (In situ) oxygen plasma etching. 3) Followed by a 30-minute hydrogen etching, in which oxygen 27 200416197 玖, description of the invention (〇2) was removed from the gas flow, and the temperature was maintained at 810 ° C. 4) The growth of crystals is by adding 36 sccm of methane (CH4) gas stream and generating diborane (B2H6) and nitrogen (N2) gas streams with gas concentrations of 0.05 and 7 ppm, respectively. The temperature is 812 ° C. 5 5) When the growth phase is completed, the substrate is removed from the reactor, and then the CVD diamond layer body is removed from the substrate. 6) The layered body that was identified as CD-2 was flattened to produce a layered body with a thickness of 410 μηι with a single side with a size of &lt; 100 &gt; 10 7) SIMS was used to analyze the layered body. A series of measurements showed that the layered body had a concentration of 6.1 X 1018 atoms / cm3 on one side. The SIMS spectrum of the deleted (B) concentration shows that there is no concentration difference under the resolution of the spectrum. The spectrum has a lateral space resolution of less than 30mm and a measurement sensitivity level of more than 10%. The measured nitrogen concentrations were all lower than 5 x 105 cells / cm3. 8) The layer identified as CD-2 was cleaned and its surface was sprayed with oxygen (02) to remove its surface 'and tested for its mobility and carrier concentration. The carrier concentration was measured to be more than 4.5 x 1013, and the mobility was measured to be more than 2.5 x 103 cm2 / Vs, yielding a G value of about 1.5. 2 0 9) CD-2 can be further characterized by the following data: (i) its CL spectrum shows free and bound excitation, and has no other characteristics. (ii) Electron magnetic resonance spectroscopy (EPR) shows that there is no electrically neutral replacement gas and only a weak line with g = 2.0028. 28 200416197 (ii) Description of the invention (iii) The spectrum shows that it has an approximate theoretical penetration except for the characteristic absorption related to an uncompensated boron concentration of 6.5 X 10 6 atoms / cm3. (iv) The X-ray rocking curve shows that the angular distribution of the sample is less than 10 arc sec. 5 (v) The Raman spectrum shows that the full width at half maximum (FWHM) of a line width is about 2 cm_1. Example 3

以下列改變之條件來重覆實施例1所述之方法: 氬氣(Ar) 75sccm,氫氣(H2) 600sccm,甲烷(CH4) 30 10 seem,330 x 102 Pa,795°C,4.4kW,乙硼烷(B2H6)及氮氣 (N2)氣體濃度分別為15及0.5ppm。 其後適當地加工及分析該厚度為300μπι之CVD層體的 兩面。 其頂面之一個SIMS圖譜顯示一個硼濃度為1.75 X 1018 15 原子/cm3,其底面之一個平均SIMS濃度為1.98 X 1018原子The method described in Example 1 was repeated with the following changed conditions: Argon (Ar) 75sccm, Hydrogen (H2) 600sccm, Methane (CH4) 30 10 seem, 330 x 102 Pa, 795 ° C, 4.4kW, B The borane (B2H6) and nitrogen (N2) gas concentrations were 15 and 0.5 ppm, respectively. Thereafter, both sides of the CVD layer body having a thickness of 300 µm were appropriately processed and analyzed. A SIMS spectrum on the top surface shows a boron concentration of 1.75 X 1018 15 atoms / cm3, and an average SIMS concentration on the bottom surface is 1.98 X 1018 atoms

/cm3 〇 實施例4 以下列改變之條件來重覆實施例1所述之方法: 氬氣(Ar) 50sccm,氫氣(H2) 600sccm,甲烷(CH4) 40 20 seem,330 x 102 Pa,795°C,4.4kW,乙硼烷(B2H6)及氮氣 (N2)氣體濃度分別為0.05及0.7ppm。其後適當地加工及分 析該厚度為113 μιη之C VD層體的兩面。 其頂面之一個SIMS圖譜係量測自一個面積2mm X 4.5 mm内之0.5mm凹槽深度及一個面積5mm X 6mm内之1mm凹 29 200416197 玖、發明說明 槽深度。底面之數據則係量測自一個lmm之凹槽深度。因 此,分析之體積為3.4mm3。 量測到之頂面平均棚濃度為0.56,而底面為0.52ppm 。因此測定出該材料具有一平均值居於特定濃度範圍内的 5 體積百分比被顯示於表1 ; 表1-於lmm凹槽上分析之SIMS濃度及分佈 SIMS 標準 單 位 詳細 說明 表面 體積 硼濃度平均值 ppm 頂面 底面 0.54 1.0mm 凹槽 0.56 0.52 數值範圍 % 100% -24% 至 +23% -14% 至 + 16% -21 %至+27% (範圍48%) 95% -17% 至 +20% -14% 至 + 11% -17% 至+ 18% (範圍35%) 85% -11% 至 + 14% -11% 至 + 11% -15% 至+ 13% (範圍28%) 70% -90/〇 至 +9% -7%至 +9% •9% 至+ 10% (範圍28%)/ cm3 〇 Example 4 The method described in Example 1 was repeated under the following changed conditions: Argon (Ar) 50sccm, Hydrogen (H2) 600sccm, Methane (CH4) 40 20 seem, 330 x 102 Pa, 795 ° C, 4.4 kW, diborane (B2H6) and nitrogen (N2) gas concentrations were 0.05 and 0.7 ppm, respectively. Thereafter, both sides of the C VD layer body having a thickness of 113 μm were appropriately processed and analyzed. A SIMS map on the top surface is measured from a 0.5mm groove depth within an area of 2mm X 4.5mm and a 1mm depression within an area of 5mm X 6mm. 29 200416197 发明 Description of the groove depth. The bottom data is measured from a 1mm groove depth. Therefore, the volume analyzed was 3.4 mm3. The measured average shed concentration on the top surface was 0.56, and the bottom surface was 0.52 ppm. Therefore, it is determined that the material has an average of 5 volume percentages within a specific concentration range is shown in Table 1; Table 1-SIMS concentration and distribution analyzed on a 1mm groove SIMS standard unit details surface volume boron concentration average ppm Top surface Bottom surface 0.54 1.0mm Groove 0.56 0.52 Value range% 100% -24% to + 23% -14% to + 16% -21% to + 27% (range 48%) 95% -17% to + 20% -14% to + 11% -17% to + 18% (range 35%) 85% -11% to + 14% -11% to + 11% -15% to + 13% (range 28%) 70%- 90 / 〇 to + 9% -7% to + 9% 9% to + 10% (range 28%)

因此,由表1顯示100%之硼量測皆落在一個佔樣品頂 面47%之總範圍内,及一個佔樣品底面30%之總範圍内,Therefore, Table 1 shows that 100% of the boron measurement falls within a total range of 47% of the top surface of the sample and a total range of 30% of the bottom surface of the sample.

10 及於合併分析時佔兩主要表面結合體積之30%。類似地, 這些量測之70%皆落在佔兩表面合併19%之範圍内。 於該層體内量測到之氮濃度是低於〇.〇6ppm,此上限 被設為所使用量測條件之靈敏度。 該樣品底面被進一步使用MonoCL系統來分析自由激 15 發發射自由激子散射(FE)及結合激發發射(BE)強度,求取 一6 X 6矩陣(36個數據點)之lmm凹槽上之數據,其結果顯 示於表2。 30 200416197 玖、發明說明 表2-FE及BE量測之分佈 量測包含之% 總範圍之數值(平均值之%) 頂面 底面 BE FE BE/FE BE FE BE/FE 100% 41 34 31 95% 39 29 28 90% 25 18 25 85% 20 15 24 70% 14 12 1710 and 30% of the binding volume of the two main surfaces when combined analysis. Similarly, 70% of these measurements fall within the range of 19% of the two surface mergers. The nitrogen concentration measured in this layer is less than 0.06 ppm, and this upper limit is set to the sensitivity of the measurement conditions used. The bottom surface of the sample was further analyzed using the MonoCL system to analyze 15 free-emitting free exciton scattering (FE) and excited-excitation (BE) intensities to obtain a 6 x 6 matrix (36 data points) on the 1 mm groove The results are shown in Table 2. 30 200416197 发明, Description of the invention Table 2- Distribution of FE and BE measurements Measurements% of total range (% of average value) Top and bottom BE FE BE / FE BE FE BE / FE 100% 41 34 31 95 % 39 29 28 90% 25 18 25 85% 20 15 24 70% 14 12 17

因此,該樣品頂面90%之硼(B)量測的自由激發皆落在 平均值25%之範圍内,自由激發是落在25%,結合激發是 5 落在18%,BE/FE比例是落在25%。 實施例5 以實施例4所述之方法長晶成一個層體。其後適當地 加工及分析該厚度為233 μηι之CVD層體的兩面。分析之體 積為 7.0mm3。 10 測定其頂面之蝴濃度為0.34ppm,底面為0.29ppm,平Therefore, the free excitation measured by 90% of boron (B) on the top surface of the sample falls within the average 25% range, the free excitation is 25%, the combined excitation is 5 and 18%, and the BE / FE ratio Is falling at 25%. Example 5 Crystals were grown into a layered body by the method described in Example 4. Thereafter, both sides of the CVD layer having a thickness of 233 μm were appropriately processed and analyzed. The volume analyzed was 7.0 mm3. 10 Determine the butterfly concentration on the top surface to be 0.34 ppm and the bottom surface to be 0.29 ppm.

均為0.32ppm。因此測定出該材料具有一平均值居於特定 濃度範圍内的體積百分比被顯示於表3 : 表3_SIMS之硼(B)量測之分佈 層體體積之% 量測到結合及硼(B)濃度之分佈 下限 上限 範圍 100% -22% + 24% 46% 95% -21 % + 19% 40% 85% -13% + 13% 26% 70% -10% + 9% 19% 15 於該層體内量測到之氮濃度是低於〇.〇3ppm,此上限 31 200416197 玖、發明說明 被設為所使用量測條件之靈敏度。 該樣品之頂面及底面被進一步使用M〇n〇CL系統來分 析自由激發發射自由激子散射(FE)及結合激發發射(BE)強 度,求取一 6 X 6矩陣(36個數據點)之lmm凹槽上之數據, 5 其結果顯示於表4。 表4-FE及BE量測之分佈 量測包含之% 總範圍之數值(平均值之一 頂面 底面 BE FE BE/FE BE FE BE/FE 100% 20 14 26 19 29 32 95% 16] 12 22 17 24 21 90% 13 11 18 14 21 17 85% 11 9 17 13 14 '14 70% 10 8 14 11 9 12 使用頂面及底面當做兩個主要表面,這顯示9〇%自由 激發、結合激發及BE/FE比例皆實質地落在大約平均值 10 30%之分佈範圍内。 實施例6 以實施例4所述之方法長晶成一個層體。其後適當地 加工及分析該厚度為538μϊΏ之CVD層體的兩面。分析之體 積為 16.1mm3。 15 測定其頂面之硼濃度為0.52PPm ,底面為〇,34ppm,平 均為0.43PPm。因此測定出此層體7〇%體積是落在平均值 之-23.3至+23.4的範圍内,其為全範圍之46.7%。 其後於該長晶面上,以低於30μιη之解析度來重覆硼 (Β)之SIMS圖譜,進一步顯現局部硼攙入均一度,其結果 32 200416197 玖、發明說明 顯示於下列表5。碳以外之元素分析顯示無雜質超過偵測 限值之0.5ppm。 於該層體内量測到之氮濃度是低於〇.〇3ppm,此上限 被設為所使用量測條件之靈敏度。 5 該樣品之頂面及底面被進一步於SEM使用MonoCL系Both were 0.32 ppm. Therefore, it was determined that the material had a volume percentage with an average value in a specific concentration range. Table 3 is shown in Table 3:% of the volume of the distribution layer measured by boron (B) measurement in SIMS. Binding and boron (B) concentration were measured. Upper limit of the lower limit of the distribution 100% -22% + 24% 46% 95% -21% + 19% 40% 85% -13% + 13% 26% 70% -10% + 9% 19% 15 In this layer The measured nitrogen concentration is less than 0.03 ppm. The upper limit is 31 200416197. The invention description is set to the sensitivity of the measurement conditions used. The top and bottom surfaces of this sample were further analyzed by the MONCL system for free excited emission free exciton scattering (FE) and combined excited emission (BE) intensity to obtain a 6 X 6 matrix (36 data points) The data on the 1mm groove, 5 The results are shown in Table 4. Table 4- Distribution of FE and BE measurements% of total range values (one of the average top surface bottom surface BE FE BE / FE BE FE BE / FE 100% 20 14 26 19 29 32 95% 16] 12 22 17 24 21 90% 13 11 18 14 21 17 85% 11 9 17 13 14 '14 70% 10 8 14 11 9 12 The top and bottom surfaces are used as the two main surfaces, which shows 90% free and combined excitation The BE and FE ratios substantially fall within a distribution range of about 10 to 30% of the average value. Example 6 Crystals were grown into a layer by the method described in Example 4. Thereafter, the thickness was appropriately processed and analyzed to be 538 μϊΏ. Both sides of the CVD layer. The volume analyzed was 16.1 mm3. 15 The boron concentration on the top surface was determined to be 0.52 PPm, the bottom surface was 0,34 ppm, and the average was 0.43 PPm. Therefore, it was determined that 70% of the volume of the layer was Within the range of -23.3 to +23.4 of the average value, it is 46.7% of the full range. Thereafter, the SIMS pattern of boron (B) was overlaid on the long crystal plane with a resolution of less than 30 μιη to further show the locality Boron is homogenous, and the result is 32 200416197. The description of the invention is shown in the following table 5. Analysis of elements other than carbon shows no The quality exceeds the detection limit of 0.5 ppm. The nitrogen concentration measured in this layer is less than 0.03 ppm, and this upper limit is set to the sensitivity of the measurement conditions used. 5 The top and bottom surfaces of the sample It is further used MonoCL system in SEM

統來分析自由激發發射自由激子散射(FE)及結合激發發射 (BE)強度,求取一6 X 6矩陣(36個數據點)之imm凹槽上之 數據,其結果顯示於表5。To analyze the free exciton free exciton scattering (FE) and the combined excitation emission (BE) intensity, the data on the imm groove of a 6 X 6 matrix (36 data points) were obtained. The results are shown in Table 5.

表5-硼(B)濃度及FE及BE量測之分佈 量測包 含之% 總範圍之數值(平均值之%) 頂面 底面 硼濃 度*1 硼濃 度*2 BE FE BE/FE 硼濃 度*2 BE FE BE/FE 100% 25 30 41 33 30 29 20 13 25 95% 24 24 39 28 27 25 16 12 22 90% 25 18 24 13 10 18 85% 15 22 19 15 23 16 11 8 17 70% 12 14 14 12 17 9 9 8 13 10 mSIMS,解析度 &lt;30μπι *2SIMS,解析度 &lt;50μηι 此層體亦使用紅外線(IR)吸收光譜來量測一面積5 χ 5mm(36個數據點)上1mm凹槽之未補償棚之差異。90%之 15 量測皆落在一個居於平均值大約34%之範圍内。 使用514nm氬離子雷射冷光於77K下量測其拉曼/光學 冷光光譜。其光譜之特徵為居於大約133201^1之鑽石拉曼 譜線,該譜線寬度之半高寬值(FWHM)為1.6cm_1。偵測其 居於575及637nm之零聲子譜線,顯示一波峰強度對比拉漫 20 波峰強度之比例極大值為1:1000。 33 200416197 玖、發明說明 實施例7 以實施例4所述之方法長晶成一個層體。其後適當地加 工為厚度818μιτι之層體。使用紅外線(IR)吸收光譜來量測一 面積5 X 5tnm(36個數據點)上1mm凹槽之未補償棚之差異。 5 90%之量測皆落在一個居於平均值大約13%之範圍内。 【圖式簡革说明3 (無)Table 5-Boron (B) concentration and the distribution of FE and BE measurement% of total range (% of average value) Top surface bottom surface boron concentration * 1 Boron concentration * 2 BE FE BE / FE Boron concentration * 2 BE FE BE / FE 100% 25 30 41 33 30 29 20 13 25 95% 24 24 39 28 27 25 16 12 22 90% 25 18 24 13 10 18 85% 15 22 19 15 23 16 11 8 17 70% 12 14 14 12 17 9 9 8 13 10 mSIMS, resolution &lt; 30μπι * 2SIMS, resolution &lt; 50μηι This layer also uses infrared (IR) absorption spectrum to measure an area of 5 x 5mm (36 data points) Difference in uncompensated shed with 1mm groove. 15% of 90% measurements fall within a range that is approximately 34% of the average. The Raman / optical cold light spectrum was measured using a 514nm argon ion laser cold light at 77K. The spectrum is characterized by a diamond Raman spectrum line of approximately 133201 ^ 1, and the full width at half maximum value (FWHM) of the spectrum line is 1.6 cm_1. Detecting its zero phonon spectral lines at 575 and 637nm, it shows that the ratio of the peak intensity to the peak intensity of Laman 20 is 1: 1000. 33 200416197 (ii) Description of the invention Example 7 A crystal was grown into a layered body by the method described in Example 4. Thereafter, a layer having a thickness of 818 μm was appropriately processed. The infrared (IR) absorption spectrum was used to measure the difference in an uncompensated shed with a 1mm groove on an area of 5 X 5tnm (36 data points). 5 90% of the measurements all fall within a range of about 13% of the average. [Schematic Briefing Note 3 (none)

【圈式之主要元件代表符號表】 (無)[Representative symbol table for main components of circle type] (none)

3434

Claims (1)

200416197 拾、申請專利範圍 一種以化學氣相沉積(CVD)製造之單晶硼攙雜鑽石層體 ,其中硼之總濃度是以一種每一個量測點小於5〇(1111之 側向解析度來予以量測為具有一個大部分層體差異小於 50%之均一性,該大部分層體意指該層體總體積之至少 5 70°/°,且其中該層體具有至少一種下列特性(i)-(in): (i)該層體是形成自一個單一養晶槽, ⑴)該層體厚度超過ΙΟΟμπι,且 (ii〇該層體之體積超過 1 mm3 〇 2·如申凊專利範圍第丨項之鑽石層體,其中該大部分體積 10 差異小於20%。 3·如申請專利範圍第1或2項之鑽石層體,其中該差異是 以一種每一個量測點小於3〇{1111之側向解析度來予以量 測。 4.如前述申請專利範圍任一項之鑽石層體,其中該層體 15 之^部分體積包含一種高於1 X 1014原子/cm3且低於i χ 102G原子/cm3之未補償硼濃度。 5·如申請專利範圍第w項任一項之鑽石層體,其中該層 體之大部分體積包含一種高於1 X 1〇15原子W且低於2 X 1〇原子/cm3之未補償硼濃度。 2〇 6·如巾請專利範圍第丨·3項任-項之鑽石層體,其中該層 體之大部分體積包含一個高於5 χ 1〇15原子W且低於2 xlO18原子/cm3之未補償硼濃度。 7.如:述中4專利範圍任_項之鑽石層體,其具有一種 在门於300KT $測 &lt; 電洞移動率⑹係超過 35 200416197 拾、申請專利範圍 Mh=G X 2.1 X 1〇10 /(Nh0·52) 當Nh小於或等於8 X 1015原子/cm3時 (函數1) X 1 X 1018 /Nh 當Nh大於8 X 1015原子/cm3時 (函數2) 其中Nh是電洞濃度,且G是一個大於數值。200416197 Patent application scope: A single crystal boron doped diamond layer body manufactured by chemical vapor deposition (CVD). The total concentration of boron is given by a lateral resolution of less than 50 (1111) at each measurement point. It is measured to have a homogeneity of a majority of the layer differences less than 50%. The majority of the layers means at least 5 70 ° / ° of the total volume of the layer, and the layer has at least one of the following characteristics (i) -(in): (i) the layer is formed from a single crystal growth tank, ii) the thickness of the layer is more than 100 μm, and (ii) the volume of the layer is more than 1 mm3. The diamond layer of item 丨, wherein the difference between the majority of the volume 10 is less than 20%. 3. If the diamond layer of item 1 or 2 of the patent application scope, the difference is that each measurement point is less than 30. The lateral resolution is measured. 4. The diamond layer body according to any one of the aforementioned patent applications, wherein a part of the volume of the layer body 15 contains a type higher than 1 X 1014 atoms / cm3 and lower than i χ 102G. Uncompensated boron concentration in atom / cm3. The diamond layer of any one of clauses, wherein a majority of the volume of the layer contains an uncompensated boron concentration higher than 1 X 1015 atoms W and lower than 2 X 10 atoms / cm3. Please claim the diamond layer of any of the scope of item 丨 · 3, wherein most of the volume of the layer contains an uncompensated boron concentration higher than 5 x 1015 atoms W and lower than 2 x 1018 atoms / cm3. . For example, the diamond layer body in any of the 4 patent scopes mentioned above has a kind of gate at 300KT $ Measure &lt; hole movement rate is more than 35 200416197, patent application scope Mh = GX 2.1 X 1〇10 / (Nh0 · 52) When Nh is less than or equal to 8 X 1015 atoms / cm3 (function 1) X 1 X 1018 / Nh When Nh is greater than 8 X 1015 atoms / cm3 (function 2) where Nh is the hole concentration and G Is a value greater than. 8·如申請專利範圍第7項之鑽石層體,其中〇是一個大於 1.4之數值。 1〇 9.如申請專利範圍第7項之鑽石層體,其中G是一個大於 17之數值。 10. 如申請專利範圍第7項之鑽石層體,其中g是一個大於2 之數值。 11. 如前述申請專利範圍任一項之鑽石層體,其在與氮-空 15 隙(N-V)色蕊相關之575nm及637nm下係具有微弱或無8. The diamond layer of item 7 in the scope of patent application, where 0 is a value greater than 1.4. 109. The diamond layer body according to item 7 of the patent application scope, wherein G is a value greater than 17. 10. For the diamond layer of item 7 of the patent application, where g is a value greater than 2. 11. The diamond layer body according to any one of the foregoing patent applications, which is weak or absent at 575nm and 637nm related to the nitrogen-space 15-gap (N-V) core. 冷光特性。 12. 如申請專利範圍第丨_10項任何一項之鑽石層體,其中 該於77K下以514nm氬離子雷射激發量測之該氮空隙於 575nm對比637nm峰值之零聲子譜線的積分強度是小於 2〇 該落在1332cm·1之鑽石拉曼譜線(Raman line)之積分強 度的1/50。 13·如申請專利範圍第12項之鑽石層體,其中該比例是低 於 1/100 〇 14.如申請專利範圍第12項之鑽石層體,其中該比例是低 36 200416197 拾、申請專利範圍 於 1/300。 15.如前述申請專利範圍任一項之鑽石層體,其具有一條 於300K下以5 14nm氬離子雷射激發下量測之拉曼譜線 的寬度半高寬值(FWHM)是小於4cm-1。 5 16·如申請專利範圍第15項之鑽石層體,其中該拉曼譜線 的寬度半高寬值(FWHM)是小於3cm_1。 17·如申請專利範圍第15項之鑽石層體,其中該拉曼譜線 的寬度半高寬值(卩\\^]\4)是小於2.5〇111“。 18.如前述申請專利範圍任一項之鑽石層體,其中該取樣 1〇 自该層體之一個代表性取樣之未補償硼濃度的分佈頻 率是以傅立葉轉換紅外線光譜儀(FTIR)來予以量測, 其9〇%之量測所具有之差異是小於其平均值之50%。 19·如申請專利範圍第M7項任一項之鑽石層體,其中該取 樣自。亥層體之-個代表性取樣之未補償删濃度的分佈頻 15 率是以傅立葉轉換紅外線光譜儀(FTIR)來予以量測,其 90 /❶之量測所具有之差異是小於其平均值之川%。 2〇·如刖述申請專利範圍任一項之鑽石層體,其中該取樣 自該層體之代表性取樣之結合激子散射(BE)的分佈頻 率顯示其90〇/〇之量測所具有之差異是小於其平均值之 20 50% 〇 2L如申請專利範圍第1-19項中任一項之鑽石層體,其中 該取樣自該層體之代表性取樣之結合激子散射_的 分佈頻率顯示其90%之量測所具有之差異是小於其平均 值之30%。 37 200416197 拾、申請專利範圍 22·如前述申請專利範圍任一項之鑽石層體,其中該於任 何個该層體之代表性表面或該層體取樣之自由激子 放射自由激子散射(FE)的分佈頻率,其9〇%之量測所具 有之差異是小於其平均值之50%。 申明專利範圍第1 _21項中任一項之鑽石層體,其中 忒於任何一個該層體之代表性表面或該層體取樣之自 由激子散射自由激子散射(FE)的分佈頻率,其9〇%之量 ’則所具有之差異是小於其平均值之3〇0/〇。 24.如則述申請專利範圍任一項之鑽石層體,其中該大部 1〇 分體積係代表超過85%之總體積。 25·如申凊專利範圍第1_23項中任一項之鑽石層體,其中 5亥大部分體積係代表超過95%之總體積。 •如如述申請專利範圍任一項之鑽石層體,其中該層體 是長晶自一個單一長晶槽,其係為一種{100}、{110} ' {⑴}或{111}晶槽。 月’J述申凊專利範圍任一項之鑽石層體,其厚度超過 5〇〇μιη。 •則迷申請專利範圍任一項之鑽石層體,其體積超過 3mm3 〇 2 0 2 9 士口由▲主 • °曱請專利範圍第1-27項中任一項之鑽石層體,其體 積超過lOmm3。 3〇·如則述申請專利範圍任一項之鑽石層體,其又包含氮 做為一種攙雜物。 3 1 如申叫專利範圍第30項之鑽石層體,其中氮濃度不超 38 200416197 拾、申請專利範圍 過該硼濃度之1/5。 其包含之氮濃度 32·如申請專利範圍第30項之鑽石層體, 不超過該硼濃度之1/50。 33·-種鑽石主體,其中—如前述巾請專利範圍任一項之 鑽石層體形成其一薄層或區域。 34.如申請專利範圍第3〇 ^ 頌石主體或如申請專利範圍 第1-32項中任一項之錯石層體,其係呈一種寶石之形 式。Cold light characteristics. 12. If the diamond layer of any one of the scope of application patent No. 丨 _10, wherein the integral of the zero phonon spectrum of the nitrogen gap at 575nm vs. 637nm peak measured at 77K with 514nm argon ion laser excitation The intensity is less than 20 times the integrated intensity of the Raman line of the diamond falling at 1332 cm · 1. 13. If the diamond layer body in the scope of patent application No. 12 in which the ratio is less than 1/100 〇14. If the diamond layer body in the scope of patent application No. 12 in which the ratio is lower 36 200416197 At 1/300. 15. The diamond layer body according to any one of the aforementioned patent applications, which has a Raman spectral line width at half maximum height (FWHM) measured at 300K under 5 14nm argon ion laser excitation is less than 4cm- 1. 5 16. The diamond layer of item 15 in the scope of patent application, wherein the FWHM of the Raman spectral line is less than 3 cm_1. 17. The diamond layer body of item 15 in the scope of patent application, wherein the width at half maximum width (卩 \\ ^] \ 4) of the Raman spectrum line is less than 2.5〇111 ". A diamond layer of one item, wherein the sampling frequency of the uncompensated boron concentration from a representative sample of the layer 10 is measured by a Fourier transform infrared spectrometer (FTIR), and its 90% measurement The difference is less than 50% of its average value. 19. If the diamond layer body according to any one of the M7 scope of the patent application, the sample is taken from the uncompensated deletion concentration of a representative sample. The distribution frequency 15 is measured by a Fourier transform infrared spectrometer (FTIR), and the difference between its 90 / ❶ measurement is less than the average of its percentage. 2 · As described in any of the patent application scopes Diamond layer, in which the sampling frequency from the representative sample of the layer combined with the distribution frequency of exciton scattering (BE) shows that the difference between its 90/0 measurement is less than 20 50% of its average. 2L If you apply for any of the items in the scope of patents 1-19 The layered body, in which the sampling frequency from the representative sample of the layered body combined with the distribution frequency of exciton scattering shows that the difference between 90% of its measurements is less than 30% of its average value. 37 200416197 Patent application scope 22. The diamond layer body according to any one of the foregoing patent applications, wherein the free exciton radiation free exciton scattering (FE) distribution frequency of the representative surface of the layer body or the layer body sampled, which The difference of 〇% measurement is less than 50% of its average value. The diamond layer of any one of claims 1-21 is claimed, in which any one of the representative surfaces of the layer or the layer The free exciton scattering (FE) distribution frequency of the sample, the amount of 90% 'of which has a difference of less than 300/0 of its average value. A diamond layer of one item, wherein the majority of the 10 minute volume represents more than 85% of the total volume. 25. The diamond layer of any one of items 1 to 23 in the scope of the patent application, most of which is in volume Represents more than 95% of the total volume. • As stated The diamond layer body of any one of the patent scopes, wherein the layer body is grown from a single crystal cell, which is a {100}, {110} '{⑴} or {111} cell. Month' J The diamond layer body of any of the patent scopes mentioned above has a thickness of more than 500 μm. • The diamond layer body of any of the patent scopes of the patent application has a volume of more than 3mm3 〇2 0 2 9 The mouth is controlled by ▲ ° Please request the diamond layer body of any of the patent scope items 1-27, whose volume exceeds 10mm3. 30. As described above, the diamond layer body of any patent scope, which also contains nitrogen as an impurity . 3 1 If it is claimed as the diamond layer body in item 30 of the patent scope, the nitrogen concentration does not exceed 38 200416197. The scope of the patent application exceeds one fifth of the boron concentration. The nitrogen concentration contained in it 32. For example, the diamond layer body in the scope of patent application No. 30 does not exceed 1/50 of the boron concentration. 33. A diamond body, in which the diamond layer as described in any one of the foregoing patent claims forms a thin layer or region thereof. 34. If the main body of the patent application scope is 30 ^^ or the wrong stone layer body according to any of the patent application scope items 1-32, it is in the form of a gem. 35.-種元件’其係以如申請專利範圍第⑶項任何一項 之鐵石層體或如申請專利範圍第33項之鑽石個體所製 成035.-A kind of element ’, which is made of the iron stone layer body such as any one of the scope of patent application item (3) or the diamond body as the patent application scope of item 0. 36·-種用以製造一種單晶硼攙雜鑽石層體之方法其包 含下列步驟:提供一種具有一個實質不具有結晶瑕疵 表面之鑽石基材,提供一種來源氣體,該來源氣體包 含—種硼之來源,解離該來源氣體,然後容許均相磊 生鑽石於该貫質不具有結晶瑕症之表面上生長。 37. 如申請專利範圍第36項之方法’其中該單晶硼攙雜鑽石 層體係如申請專利範圍第1-32項任何一項所定義者。 38. 如申請專利範圍第36或37項之方法,其中該添加至來 源氣體之氮是呈一種適合藉由單晶鑽石生長來控制其 形體育成之數量。 39_如申請專利範圍第“項之方法,其中該添加至來源氣 體之氮是高於〇·5ρρηι且低於lOOOOppm。 4〇·如申請專利範圍第38項之方法,其中該添加至來源氣 39 200416197 拾、申請專利範圍 體之氮是高於lppm且低於i〇〇〇ppm。 至來源氣 41·如申請專利範圍第38項之方法,其中該添力 體之氮是高於3ppm且低於2〇〇ppm。 項之方法,其中於該 面餘刻特徵密度是低 42·如申請專利範圍第36_41項中任一 鑽石長晶表面上與瑕疵有關之表 於5 X l〇3/mni2 〇 43.如申請專利範圍第36_41項中任一項之方法其中於該36. A method for manufacturing a single crystal boron-doped diamond layer, comprising the steps of: providing a diamond substrate having a surface substantially free of crystal defects, providing a source gas, the source gas comprising a boron Source, dissociating the source gas, and then allowing homogeneous epitaxial diamonds to grow on the surface without crystal defects. 37. The method of claim 36, wherein the single crystal boron doped diamond layer system is as defined in any of claims 1-32 of the scope of patent application. 38. The method of claim 36 or 37, wherein the nitrogen added to the source gas is in a form suitable for controlling the amount of formation by single crystal diamond growth. 39_ The method according to the scope of the patent application, wherein the nitrogen added to the source gas is higher than 0.5 ρρηι and less than 1000 ppm. 40. The method according to the scope of the patent application 38, wherein the addition to the source gas 39 200416197 The nitrogen in the scope of the patent application is higher than 1 ppm and less than 1000 ppm. To the source gas 41. If the method of the 38th scope of the patent application is applied, the nitrogen in the additive body is higher than 3 ppm and Less than 200ppm. The method of item, wherein the characteristic density remaining on the surface is low. 42. As shown in the patent application scope of any of the 36_41 diamond crystals, the defect-related surface is shown in 5 X 10 / mni2 〇43. The method according to any one of the 36th to 41st patent scope, wherein 鑽石長晶表面上與瑕疫有關之表面敍刻特徵密度是低 於 102/mm2。 44.如申研專利範圍第36_43項中任一項之方法,其中該鑽 石長晶表面係於鑽石長晶之前,先被引至一電漿蝕刻。 45·如申請專利範圍第36_44項中任—項之方法,其中該鑽 石係長晶於一種{i〇〇}、{110}、{113}或{111}表面。 46·如申請專利範圍第38·45項中任一項之方法,其中該硼 15 之來源是乙硼烷(β2η6)。The surface engraved characteristic density associated with blemish on the surface of diamond crystals is lower than 102 / mm2. 44. The method of any one of items 36-43 in the scope of Shenyan's patent, wherein the surface of the diamond crystal is before the diamond crystal, and is first introduced to a plasma etching. 45. The method according to any one of items 36 to 44 of the scope of application for a patent, wherein the diamond is grown on a {i00}, {110}, {113}, or {111} surface. 46. The method according to any one of claims 38.45, wherein the source of boron 15 is diborane (β2η6). 47·如申請專利範圍第丨項之鑽石層體,其是參照任一實施 例且實質如本案所描述。 48.如申請專利範圍第刊項之方法,其是參照任一實施例 且實質如本案所描述。 40 200416197 陸、(一)、本案指定代表圖爲:第_圖 (二)、本代表圖之元件代表符號簡單說明: (無)47. For the diamond layer body in the scope of patent application, it refers to any embodiment and is substantially as described in this case. 48. The method of applying for the item in the patent scope refers to any embodiment and is substantially as described in the present case. 40 200416197 Lu, (1), the designated representative of this case is: Figure _ (2), the component representative symbols of this representative diagram are simply explained: (none) 柒、本案若有化學式時,請揭示最能顯示發明特徵的化 學式=柒 If there is a chemical formula in this case, please disclose the chemical formula that can best show the characteristics of the invention = (無) 4(None) 4
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458852B (en) * 2005-06-22 2014-11-01 Element Six Ltd High colour diamond
US20210230766A1 (en) * 2014-08-11 2021-07-29 Sumitomo Electric Industries, Ltd. Diamond composite body, substrate, diamond tool including diamond, and method for manufacturing diamond

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI458852B (en) * 2005-06-22 2014-11-01 Element Six Ltd High colour diamond
US20210230766A1 (en) * 2014-08-11 2021-07-29 Sumitomo Electric Industries, Ltd. Diamond composite body, substrate, diamond tool including diamond, and method for manufacturing diamond

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