TW200414640A - Structure for packing and method of controlling power of optical sub-assembly (OSA) module - Google Patents

Abstract

A structure for packing and a method of controlling power of optical sub-assembly (OSA) module are disclosed. The present invention is featured in that an attenuation piece is inserted into a gap in a sleeve of an optical sub-assembly (OSA) from the outer side surface of the sleeve, whereby an optical axis of the semiconductor laser can pass through the attenuation piece. With the use of the present invention, the power loss of the laser diode during the packaging of the OSA is prevented, the attenuation piece can be replaced any time, and the issue that the optoelectronic efficiencies among the different devices vary severely during the process of the OSA can be improved.

Description

200414640 The invention is guessed (the description of the invention should state: the invention of dirty vines, or the previous technology, content, and implementation methods are illustrated in a simple diagram) The technical field to which the invention belongs: The present invention relates to the packaging of an optical sub-module component Structure and method for controlling optical power output thereof, and in particular, to a packaging structure of an optical sub-module element in which an attenuation sheet is placed into a groove in the sleeve from the outer side of the sleeve and a method for controlling optical power output thereof . Prior Technology: An application area created by the Optoelectronics Department combining electronics and optics. Among them, the optical transceiver module in the optoelectronic component may include a transmitter (Transmitter), a receiver (Receiver), or the two can be integrated into a transceiver (Transceive0. The function of the transmitter is to convert electrical signals into optical signals and transmit them out) Transmitters are generally distinguished according to light sources. The light sources used for optical fiber communication are mainly light-emitting diodes and laser diodes. Because laser diodes have high output power, fast transmission speed, and small light-emitting angles ( It means that the light source is more efficient in coupling into the fiber), and has a narrower spectrum (smaller dispersion), so it is more suitable for medium and long distance transmission. As for the light emitting diode, it has low cost and is easier to use (driving It is simpler than the compensation circuit) and is suitable for short-distance transmission. Laser diodes or semiconductor lasers have small size, low power consumption, fast response, impact resistance, long life, high efficiency, and low price. And other advantages, it is widely used in optoelectronic system products. Due to the sophisticated laser diode system 200414640, high technical level and expensive production equipment The price of components is low, so from the perspective of the optoelectronic industry as a whole, laser diodes are extremely important and critical components. Laser diodes are roughly divided into two categories, short wavelengths and long wavelengths. Lasers generally refer to lasers with emission wavelengths from 390nm to 950nm, and are mainly used in optical information and display applications such as optical disc drives, laser printers, barcode printers, scanners, and indicators. Long-wavelength lasers are Refers to lasers with emission wavelengths from 980nm to 1 550nm, which are mainly used for optical fiber communication. Another type of laser diode that is developing rapidly is Vertical Cavity Surface Emitting Laser (VCSEL). The basic difference between laser diodes is the relative position of the resonant cavity and the epitaxial layer. The resonant cavity of a traditional laser diode is parallel to the epitaxial layer, in which the reflective surface is formed by the natural fracture surface of the crystal and the epitaxial layer. The vertical layer and the laser light emitted from the side, so the traditional laser diode is also known as edge-emitting laser (Edge Emitting Laser; EEL). The vertical cavity surface-emitting laser's resonance cavity is perpendicular to the stupid crystal layer The reflection surface is composed of an epitaxial layer or a surface dielectric film, and the laser light is emitted from the front side, so it is called a vertical cavity surface shot laser. Because the resonant cavity of a vertical cavity surface shot laser is very short, the gain is There is less material (Gain Media) and the output power is also greatly limited. The output power of a typical vertical cavity surface laser is around lmW. However, the output beam of a vertical cavity surface laser is circular Symmetric, easy to couple with optical fiber, and easy to make vertical cavity surface-emitting laser array (Array), so it is expected to replace some low-power edge-emitting laser diodes in the future, reducing the system price 7 200414640 low . Among them, 850nm vertical cavity surface-emission lasers were launched in 997, and began to enter various area networks (Local Area Network; LAN) in 1998, and obtained such as optical fiber networks (Fibre Channel) And Gigabit Ethernet and other billion-level transmission module standards are adopted to carry out large-scale information transmission over short distances. Traditional semiconductor lasers

(Metal-Can). In order to meet different application requirements, before a semiconductor laser is packaged into a metal can, a coupon film is often coated on the glass window of the metal cover to control the amount of optical power output by the laser. Cover to seal into a metal can. Next, secondary packaging is performed to form an optical sub-module element (Optical Sub_AsSembly 'OSA) with a ^ optical mechanism. Please refer to the cross-sectional view of the conventional laser diode package shown in Figure i. The metal can package is in the form of flat glass. The white optical sub-group TL 100 in the figure i includes a semiconductor laser diode, a base 20 pins 30, a metal cover 40, a glass window 50, a film 60, a sleeve 80, a protective cover, and an optical fiber. 92 and other components. The semiconductor laser diode 10 γ is fixed on one surface of the base 20. Pin 30 is connected to the base 20;

The surface is used to transmit electrical signals to the wheel. The so-called semiconductor laser diode self-encapsulation means that the metal cover 40 is sleeved on the base 20 to protect half of the laser diode 10. The central part of the metal cover 40 has a through hole ^ of cover 40: ^ d 'and the glass window 50 is embedded in this hole, so that when the gold cover 40 is set on its earthen seat 20, the semiconductor laser diode The light emitted by the body 10 can pass through the & slope 50 and reach the outside of the metal cover 40. In order to control the amount of optical power output by 3 8 200414640 laser to meet different application requirements, before the metal cover 40 is set on the base 20, the glass window 50 on the metal cover 40 needs to be coated with a film 60. . After the glass window 50 is coated with the thin film 60, a metal cover + ^ can be placed on the base 20, and a space 70 is formed between the metal cover 40 and the base 20. …, Then put the sleeve 80 on the metal cover 40, and insert the sleeve 90 with the optical fiber 92 into the hole in the sleeve 80, so as to form the space 71 and the space 77, i φ,, and the middle room. 71 is located on the metal cover 40 and the film 60, the space 7 7 is located on the space 7, and the jacket 90, which has the optical fiber 92 therein, is located on the workshop 77. In addition, the sleeve 80 needs to be provided with a lens 82 for focusing the light. The metal can package shown in the above Figure 1 is in the form of flat glass, because the glass_50 is parallel to the base 20. There is also a form of metal can sealing for beveled glass, as shown in Figure 2. In Fig. 2, the glass window 52 does not flatly align the base 20, but forms an angle with the base 20. As described above, before the metal cover 42 is set on the base 20, the glass window 52 of the metal cover 42 is coated with a thin film 62 first. After the glass window 52 is coated with the thin film 62, the metal cover 42 can be placed on the base 20, and a space 72 is formed between the metal cover 42 and the base 20. Then, the sleeve go is sleeved on the metal cover 42, and the sheath 90 with the optical fiber 92 is inserted into the hole in the sleeve 80 to form a space 73 and a space 77, wherein the space 73 is located on the metal cover 42 and the film 62. The upper space 77 is located on the space π, and the sheath 90 having the optical fiber 92 therein is located on the space 77. In addition, the tube 80 must be provided with a lens 9 200414640 82 for focusing the light. In addition, there is a metal can packaging form of spherical glass, as shown in Figure 3. In FIG. 3, the surface of the glass window 54 is spherical. As described above, before the metal cover 44 is set on the base 20, the glass window 54 of the metal cover material needs to be coated with a thin film 64 first. After the glass window 54 is coated with a thin film, the metal cover 44 can then be placed on the base 20, and a space 74 is formed between the metal cover 44 and the base 20. Then, the ferrule 80 is put on the metal cover, and the sheath 90 having the optical fiber 92 therein is inserted into the hole in the ferrule 80.

The hole forms a space 75 and a space 77, wherein the space 75 is located on the metal 44 and the film 64, the space 77 is located on the space, and the sheath 90 having the fiber 92 is located on the space 77. In addition, since the glass window 54 whose surface is the ball 3 has the function of a lens, the sleeve 8 in Fig. 3 does not need to have a lens like the sleeve 8 in Figs. 1 and 2 "

As mentioned above, before the traditional laser diode is packaged into a metal can, it must be coated with a thin film on the glass window of the metal cover, and then the laser diode is packaged into a metal can with a metal cover. Optical power of semiconductor lasers. ^ And when the metal can package of the laser diode is further packaged to form an optical sub-module component with an optical mechanism, the optical power is often missed, which makes the optical power of the product unable to be accurately grasped, thus making the product The stability of the product is reduced, and the yield of the product is seriously affected. Summary of the Invention: 乂 In view of the above background of the invention, before the conventional laser diode is packaged into a metal can, it needs to be coated with a thin film on the glass window of the metal cover, and then the metal cover is used to cover it. 10 200414640

The laser diode is sealed into a metal can. However, when the metal can package of the laser diode is further packaged to form an optical sub-module component with an optical mechanism, the optical power is often missed, and the optical power of the product cannot be accurately grasped. Therefore, an object of the present invention is to provide a sealing structure of an optical sub-module element and a method for controlling optical power output thereof, which can perform optical power modulation after the optical sub-module element is assembled to accurately control the optical sub-module. The optical power output of the module components can effectively solve the leakage of optical power caused by the assembly of optical sub-module components. Another object of the present invention is to provide a packaging structure of an optical sub-module element and a method for controlling the optical power output thereof, so that the attenuation sheet can be replaced at any time to adjust the output optical power. The M-head of the present invention is to provide a sealing structure of a module module and a method for controlling the optical power output of the module, which are not affected by different packaging methods of metal cans (flat glass, beveled surface will attenuate sheet light from the outer side of the sleeve) The size of the power. The influence of glass or spherical glass can be placed in the groove of the sleeve for precise control

It is another object of the present invention to provide a structure and a control method for the optical power output, so as to perform the secondary adjustment of the optical power. An optical sub-module component packaging method can be integrated with traditional coated metal cans, thus greatly reducing the product. Another object of the present invention is to provide an optical structure and a method for controlling optical power output, which can: ^ Module In the process of packaging the components, the photoelectric efficiency of each component improves the situation that the optical sub-module is too large. 11 200414640 In accordance with the above purpose of the present invention, the present invention provides a package structure for an optical sub-trigger assembly including at least: a base; a 帛 conductor laser diode is fixed to the surface of the base; a metal cover, a sleeve On the base, to spend between the metal cover and the base? , &Amp;# Β 日, and forming the first two rooms, and the semiconductor laser diode system is located in the second room 'where the metal cover is embedded in the glass window, so that the semiconductor laser: the semiconductor emitted by the diode The laser can pass through the glass window and reach: it is outside the cover; the sleeve is placed on the metal cover, so as to form a 70% space between the sleeve and the metal cover, wherein the sleeve has a groove, and the groove is from The side of the sleeve extends into the sleeve, and the groove and the second space have a common intersection portion, and an attenuation sheet is placed in the groove, so that the semiconductor laser passes through the attenuation sheet. A According to the above purpose of the present invention, the present invention further provides a method for controlling the optical power output of optical sub-module components, which includes at least the following steps. First, a base is provided; then, a semiconductor laser diode is fixed to the base. Then, a metal cover is placed on the base to form a first space between the metal cover and the base. The semiconductor laser diode system is located in the first space, and a glass window is embedded in the metal cover. , So that the semiconductor laser emitted by the semiconductor laser diode can pass through the glass window and reach the outside of the metal cover; then, a set of tubes is sleeved on the metal cover to form a second between the cover officer and the metal cover A space, wherein the sleeve has a groove therein, the groove extends from the side of the sleeve into the sleeve, and the groove and the second space have an intersecting portion; and an attenuation sheet is placed in the recess In the slot, the semiconductor laser can pass through the attenuator. 12 200414640 Embodiment: The present invention relates to a sealing structure of an optical sub-module element and a method for controlling optical power output thereof, wherein the present invention can be used for a vertical cavity surface emitting laser or an edge emitting laser. Please refer to FIG. 4 for a structural cross-sectional view of an optical sub-module component package according to a preferred embodiment of the present invention. The optical sub-module element 200 in FIG. 4 includes a semiconductor laser diode 110, a base 120, a pin 130, a metal cover 144, a glass window 154, a sleeve 18, a sheath 190, an optical fiber 192, and Attenuator 21 and other components. The semiconductor laser diode 1 is fixed on one surface of the base 120. Pin 13 is connected to the other surface of base 120 for transmitting electrical signals. In addition, the form of the optical sub-module element 200 may be sc or LC. As for the metal can package of the 'semiconductor laser diode 11', the metal cap 144 is set to the base 120 to protect the semiconductor laser diode 110. In addition, the central part of the metal cover 144 has a hole penetrating through the metal cover 144, and the glass window 154 is embedded in this hole, so that when the metal cover 44 is set on the base 120, the semiconductor laser diode 11 The emitted laser light can pass through the glass window 154 and reach the outside of the metal cover 144. In addition, when the metal cover 144 is placed on the base 120, a space 1 74 is formed between the metal cover 144 and the base 120. The semiconductor laser diode 丨 丨 0 is located in the space i 74. Then, the ferrule 180 is sleeved on the metal cover 144, and the sheath 190 having the optical fiber 192 therein is inserted into the hole in the ferrule 180, so that the metal cover 144, the glass window 154, the sleeve 180, and the sheath are The space between 190 and 13 200414640 175 and space 177 'where space 175 is located on metal cover 144 and glass window 154' space 177 is located on space 175, and the sheath 190 with optical fiber i92 is located on space 77. In addition, the material of the sleeve 丨 80 may be metal, polymer, or Tao Yao. One of the main features of the present invention is that the sleeve 18 has a groove 205. The groove 205 extends from one outer side of the sleeve 180 into the sleeve 180 and intersects the space 177. That is, at least one end of the groove 205 is in communication with the outside world, and the groove 205 and the space 177 have a common intersection portion. Another main feature of the present invention is that it has an attenuator 21, which is inserted into the groove 205, so that the semiconductor laser emitted by the semiconductor laser diode i 丨 〇 can be sequentially passed along the optical axis 215 The space 174, the glass window 1 54, the space 1 75, the space 1 77, and the attenuation sheet 2 1 0 reach the optical fiber 1 92. The function of the attenuating sheet 210 is to attenuate the optical power of the semiconductor laser passing through it to a preset value, so that the optical power of the semiconductor laser can be arbitrarily and precisely adjusted to meet actual needs. As for the attenuation sheet 210, it is composed of a base material and a thin film, and the thin film is plated on the base material, wherein the material of the base material can be glass or plastic, and the material of the thin film can be a metal thin film, high reflection (High Reflection; HR) film, or light absorbing film. In addition, the attenuation sheet 2 10 can be replaced at any time according to the actual optical power requirements. The optical sub-module element 200 in the above FIG. 4 adjusts the optical power of the semiconductor laser emitted by the semiconductor laser diode 110 through the attenuation sheet 2 i 〇. However, the present invention can also be applied as shown in FIG. 5. That is, before the cover 14 of the gold 14 200414640 is placed on the base 120, the glass window 154 embedded in the hole of the metal i μ may be plated with a thin 臈 164, and the material may be a metal film, a highly reflective film, or light. Absorptive film. Then, the metal i 144 is put on the base 120 to perform the first adjustment of the optical power. As for the instrument's official set of 180 sets to the metal cover! 44 and the attenuation sheet 21o is placed in the groove 20 to perform the second adjustment of the light power. The process is the same as that in Figure 4. In addition, the above 4 The form of the glass window 154 in the figure and FIG. 5 is called spherical glass. In fact, the present invention can also be applied to the case where the shape 3 of the glass window 154 is flat glass or beveled glass. As for the form of the glass window 154 is flat glass For the case of beveled glass, please refer to the previous figure.

As shown in Figure 2. To sum up, one advantage of the present invention is to provide an optical sub-module component packaging structure and a method for controlling optical power output, which can perform optical power modulation after the optical sub-module components are assembled to accurately control the optical The optical power output of the sub-module components can effectively solve the optical power leakage caused by the assembly of the optical sub-module components.

Another advantage of the present invention is to provide a sealed structure of an optical sub-module element and a method for controlling the optical power output thereof. The attenuator can be replaced at any time to adjust the output optical power. Another advantage of the present invention is to provide a packaging structure of optical sub-assembly components and a method for controlling the optical power output, which can be unencumbered by metal can packaging methods (flat glass, beveled glass, or spherical slope). The glass can be placed in the groove φ, of the sleeve from the outer side of the sleeve to accurately control the optical power of 15 200414640. Another advantage of the present invention is to provide an optical sub-module Element structure and method for controlling optical power output 'can be matched with traditional coatings to perform secondary adjustment of optical power, thereby greatly reducing yield. Another advantage of the present invention is to provide an optical sub-module element structure and The optical power output control method can effectively improve the optical element efficiency during the manufacturing process of optical components. As those skilled in the art understand, the above is only a preferred embodiment. To limit the scope of the application of the present invention; all other changes or modifications made without departing from the spirit disclosed by the present invention should be included in the scope of patent application described below Schematic description: Figure 1 shows the structure of a conventional laser diode package. The metal can package in the cross section is a flat glass. Figure 2 shows another conventional laser diode package. The result is that the metal can package is in the form of bevel glass; Figure 3 shows another conventional laser diode package cooker in which the metal can package is in the form of spherical glass; Figure 4 is a diagram showing the invention -The structural sectional view of the optical secondary component package of the preferred embodiment; and FIG. 5 is a structural sectional view of the optical element package of another preferred embodiment of the present invention. Submodule 〇 Equivalent modification of the patent scope of the present invention, its drawing structure, section, section, module, submodule 16 200414640 Drawing number comparison description: 10 semiconductor laser diode 20 30 pin 40 42 metal cover 44 50 Glass window 52 54 Glass window 60 62 Film 64 70 Space 71 72 Space 73 74 Space 75 77 Space 80 82 Lens 90 92 Optical fiber 100 110 Semiconductor laser diode 120 130 Pin 144 154 Glass window 164 174 Space 175 17 7 Space 180 190 Sheath 192 200 Optical sub-module element 205 210 Attenuation sheet 215 Base _ Metal cover 'Metal cover glass window film film space Φ Space space sleeve sheath Optical sub-module element base metal cover film space φ Optical fiber grooved optical axis 17

Claims (1)

200414640 Scope of patent application ι · An optical sub-module component (0ptical Sub Assembiy; 〇sa) package structure, at least includes: a base; a semiconductor laser diode, fixed to a surface of the base; A metal cover, a metal cover is sleeved on the base, thereby forming a first space between the metal cover and the base, and the semiconductor laser diode system is located in the -space +, in which the metal cover hinders access A glass window, so that a semiconductor laser emitted by the semiconductor laser diode can pass through the glass window and reach the outside of the metal cover; a sleeve, 'the sleeve is sleeved on the metal cover, thereby A second space is formed between the sleeve and the metal cover, wherein the sleeve has a groove therein, the groove extends from an outer side of the sleeve into the sleeve, and the groove and the second space Having a common intersecting portion; and an attenuating sheet inserted into the groove, so that the semiconductor laser passes through the attenuating sheet. 2. The packaging structure of the optical sub-module component according to item 1 of the scope of the patent application, wherein the semiconductor laser is selected from a vertical cavity surface emitting laser (VCSEL) and an edge laser A type of group consisting of edge laser (Edge Emitting Laser; EEL). 18 200414640 3. The encapsulation structure of the optical sub-module element according to item 1 of the scope of the patent application, wherein the attenuating sheet includes at least: a substrate; and a film bonded to a surface of the substrate. 4. The packaging structure of the optical sub-module component according to item 3 of the patent application scope, wherein the material of the substrate is selected from a group consisting of glass and plastic. _ 5. The packaging structure of the optical sub-module element according to item 3 of the scope of patent application, wherein the film is selected from the group consisting of a metal film, a high reflection (HR) film, and a light absorbing film One ethnic group. 6. The packaging structure of the optical sub-module element according to item 1 of the scope of patent application, wherein the form of the glass window is selected from the group consisting of flat glass, beveled glass, and spherical glass. 7. The packaging structure of the optical sub-module component according to item 1 of the patent application scope, wherein the glass window further has a thin film. 8. The packaging structure of the optical sub-module component according to item 1 of the scope of the patent application, wherein the form of the optical sub-module component is selected from the group consisting of SC and LC. 19 200414640 9. The encapsulation structure of the optical sub-module component according to item 1 of the scope of patent application, wherein the material of the sleeve is selected from the group consisting of metal, polymer, and ceramic. 1 0. —A method for controlling the optical power output of optical sub-module components, including at least: Providing a base; fixing a semiconductor laser diode to a surface of the base; covering a metal cover on the base to form a first space between the metal cover and the base, and The semiconductor laser diode system is located in the first space, and a glass window is embedded in the metal cover, so that a semiconductor laser emitted by the semiconductor laser diode can pass through the glass window to reach the metal. Covered outside A set of tubes is sleeved on the metal cover, thereby forming a second space between the sleeve and the metal cover, wherein the sleeve has a groove therein, and the groove extends from an outer side of the sleeve into In the sleeve, the groove and the second space have a common intersection portion; and an attenuation sheet is placed in the groove, so that the semiconductor laser passes through the attenuation sheet. 1 1 · The method for controlling the optical power output of an optical sub-module element as described in item 10 of the scope of the patent application, wherein the semiconductor laser is selected from vertical 20 X200414640 vertical cavity surface-emitting laser and side-emitting laser A type of group consisting of lasers. -> 0 1 2. The method for controlling optical power output of the optical sub-module element according to item 10 of the patent application scope, wherein the attenuating sheet includes at least: 'a substrate; and a film, On one surface of the substrate. 1 3. The method for controlling the Φ optical power output of the optical sub-module element as described in Item 12 of the scope of patent application, wherein the material of the substrate is selected from a group consisting of glass and plastic. 14. The method for controlling the optical power output of the optical sub-module element according to item 12 of the scope of the patent application, wherein the thin film is selected from the group consisting of a metal thin film, a highly reflective thin film, and a light absorbing thin film. 15 · The method for controlling the optical power output of the optical sub-module element as described in Item 10 of the scope of patent application, wherein the form of the glass window is selected from the group consisting of flat glass, beveled glass, and spherical glass One ethnic group. 16. The method for controlling the optical power output of the optical sub-module element according to item 10 of the scope of the patent application, wherein the glass window further has a thin film. 1 7. The method for controlling the optical power output of 21 200414640 of the optical sub-module element as described in item 10 of the scope of patent application, wherein the form of the optical sub-module element is selected from one of SC and LC Ethnic group. 1 8. The method for controlling the optical power output of the optical sub-module element as described in Item 10 of the scope of patent application, wherein the material of the sleeve is selected from a group consisting of metal, polymer, and ceramic . twenty two