200412208 五、發明說明（1) 【發明所屬 本發明係 其係指一種具 及製造該電路 【先前技術 傳統上， 氟乙烯（P T I 轴的熱膨脹係 該基板與銅箔 有之技術作法 無機陶瓷粉體 利第5 3 5 4 陶瓷粉體以降 會造成填料之 與鍍通孔之製 【發明内容 本發明人 決上述電路基 努力，終於開 本發明的 板之方法以解 經研究發 聚合物之粉體 之玻璃纖維布 之技術領域】 關於一種電路 有優異剛性， 板之方法。 板及製造該電路板之方法，尤 及低Z轴熱膨脹係數之電路板 利用玻璃 π E ))以 數過大（ 間之黏著 乃是在基 以降低基 6 1 1號 低z轴熱 沉降，導 程中產生 ] 有錐於此 板在製程 發出本發 主要目的 決上述習 現，將聚 加入氟系 所製成之 纖維 製成 多大 強度 板之 材在 中， 膨脹 致產 銅箔 布強 之基 於1 不佳 基材 Z軸 即揭 係數 生基 剝離 化氟系 板，其5 0 p ’為了 中添加 之熱膨 露出在 之方法 板於後 等良率 樹脂基 最大之 pm/ 材（如 缺點在 °C )， 改善此一 現象 氧化矽或石 ，如美 加入無 脹係數 基材中 ^然而 加工過 不佳之 此 作 程’如 問題。 聚四 於Z 使得 ，現 英等 國專 機之 法卻 鑽孔 ’乃積極進行研究改良，以期可 上所產生之問題，經過不斷試驗= 明0 在於提供一種電路板及製造該電 用電路板所產生之問題。 路 醚酮（如聚醚酮酮（ΡΕΚκ) 樹脂分散液，再將含浸有該分散 基板具有良好之機械強度、耐^ Ρ 200412208 五、發明說明（2) j。立中2 P 〇 c)、電氣絕緣性佳與抗化學性佳之腾 性其中聚醚酮酮（PEKK)iTmAqftri，之特 為 3 ·3 〇 〇 〇 〇H z ) ; H?C D k200412208 V. Description of the invention (1) [The invention to which the invention belongs refers to a method and method for manufacturing the circuit. [Previously, traditionally, the thermal expansion of vinyl fluoride (PTI shaft is based on the technical method of the substrate and copper foil. Inorganic ceramic powder. 5th 5 4th ceramic powder to reduce filler and plated through hole production [Content of the invention The inventor decided the above-mentioned circuit-based efforts, and finally opened the method of the board of the present invention to solve the research and development of polymer powder The technical field of glass fiber cloth] About a circuit with excellent rigidity, a method of a board. The board and a method of manufacturing the circuit board, especially a circuit board with a low Z-axis thermal expansion coefficient using glass π E)) are too large (between Adhesion is to reduce the thermal settlement of the low z-axis of the base 6 1 No. 1 caused by the lead.] There is a cone on this board. The main purpose of the process is to determine the above behavior. Poly is added to the fiber made of fluorine. How strong the board is made of, the expansion caused the strength of the copper foil cloth is based on a poor substrate Z-axis immediate coefficient of bio-based peeling fluorine-based board, which is 50 p ' In addition, the thermal expansion is exposed in the method, and the plate yields the highest yield of the resin-based pm / wood (such as the disadvantage at ° C), to improve the phenomenon of silica or stone, Rumei added to the non-expansion coefficient substrate ^ but processed The poor process is “such as a problem. The gathering of four in Z makes the method of drilling a hole in the current British and other special planes” active research and improvement in order to improve the problems. After continuous testing = Ming 0 is to provide a circuit Board and the problems caused by the manufacture of the electrical circuit board. Lutherone (such as polyetherketone ketone (PEK)) resin dispersion, and then impregnated with the dispersion substrate has good mechanical strength and resistance ^ 20042004208 V. Description of the invention (2) j. Lizhong 2 P 0c), excellent electrical insulation and chemical resistance, among them polyetherketone ketone (PEKK) iTmAqftri, the special is 3. 3 〇00〇H z); H? CD k
Hz)。 JU.u〇4(l〇〇〇 為了達到上述發明目的，本發明 段予以達成，本發明之雷路彳且右# 木取以下之技術手 称化姑及而+ ^ ^ 之電路板，、有亂糸樹脂基材、纖％右 強化材及耐向溫高分子；該電路板之製 ‘ f、准f 分子粉體分散於氟系樹脂分散液，纩泠:溫鬲 ,^ # . 纖維布強化材經烘乾與燒結後，於1 上下表面披附銅箔予以達成。 70交於具 々經由添加有耐高溫高分子於分散 電路板之Ζ軸熱膨脹俜齡士胪下陴^ τ便付不兔明之 黏著性大幅提昇係數大巾田下卜使得電路板與銅落之 【實施方式】 为紂ί ί日」t電路板含有氟系樹脂基材 '纖維布強化材以 及耐尚咼为子。其中氟系樹脂基材可以 τ F e、 :氟^烯聚六氟烷氧乙烯共聚物（p fa /聚四氟乙稀 ===丙烯共聚物（fep)、mfa及其混合物等。纖 、·’ 5化材則為玻螭纖維布，而耐高溫高分子則包括有聚 越酮酮（PEKK)、聚鱗醚酮酮（PEEKK)、聚鱗 酮ϋ®同g同（PEKEKK)、聚_1鱗_酉同（卩£££1^ )、聚喊鱗酉同鱗酉同（peej<cek)等。 γ以聚醚酮酮（Ρ Ε κ K )之耐高溫高分子與P 丁 F E 之氟系樹脂基材為例，本發明電路板之製法乃是將聚醚酮Hz). JU.u〇4 (100) In order to achieve the above-mentioned object of the invention, the present invention section is achieved. The thunder road of the present invention and the right part of the invention take the following technical hand-made circuit boards, + ^ ^, There are messy resin substrates, fiber-reinforced right reinforcing materials, and temperature-resistant polymers; the circuit board's f and quasi-f molecular powders are dispersed in a fluorine-based resin dispersion, 纩 玲: 温 鬲, ^ #. Fiber The cloth reinforced material is dried and sintered, and the copper foil is attached to the upper and lower surfaces of 1. It is delivered to the thermal expansion through the Z-axis thermal expansion of the dispersion circuit board added with high temperature resistant polymers. The adhesiveness of Fu Buming has been greatly improved. The coefficient of the large towel makes the circuit board and copper fall. [Embodiment] The circuit board contains a fluorine-based resin substrate, a fiberglass reinforcement material, and a durable material. Among them, the fluororesin base material can be τ F e,: fluoropolyene hexafluoroalkoxyethylene copolymer (p fa / polytetrafluoroethylene === propylene copolymer (fep), mfa and mixtures thereof). Fiber, · '5 chemical materials are glass fiber cloth, and high temperature resistant polymers include polyketene (PEKK), polyscale Ketone Ketone (PEEKK), Polystigmatone® with Tong Ke Tong (PEKEKK), Poly_1 Scale_ 酉 Tong (酉 £££ 1 ^), Poly Shout with Tongue Tong (peej < cek), etc. γ Taking polyether ketone ketone (PEK) as a high-temperature resistant polymer and P but FE fluororesin base material as an example, the method for manufacturing the circuit board of the present invention is to use polyether ketone
第7頁 200412208 五、發明說明（3) 酮（PEKK)之聚合物粉體分散於PTFE分散液中’ 將玻璃纖維布含浸於所配置之分散液’使得玻璃纖維布表 面塗佈有該分散液’再將塗佈有分散液之玻璃纖維布經過 烘乾及燒結製程後’於其上下表面披附銅箔即可。其中氟 系樹脂基材佔電路板成分之至少4 〇 w t % ’而财高溫高 |分子則少於氟系樹脂基材成分之2 0 w t % ’分散液中除 I 了氟系樹脂基材及耐高溫高分子外’尚含有少量之界面活 性劑（如t r i t ο η X — 1 0 0 )，其餘為水。 【實施例】 實驗組 將l 〇wt%的聚醚酮酮（PEKK)加入PTFE 之分散液中，經過6次塗佈於玻璃纖維布上，將該玻璃纖 維布烘乾後與銅箔進行層疊及壓合以製成基板。 對照組 未於分散液中添加有聚醚酮酮（PEKK)等耐高溫 高分子之基板。Page 7 200412208 V. Description of the invention (3) The polymer powder of ketone (PEKK) is dispersed in the PTFE dispersion liquid 'impregnate the glass fiber cloth in the dispersing solution configured' so that the surface of the glass fiber cloth is coated with the dispersion liquid 'Then the glass fiber cloth coated with the dispersion liquid after drying and sintering process' can be covered with copper foil on the upper and lower surfaces. Among them, the fluorine-based resin substrate accounts for at least 40% by weight of the circuit board component, and the high temperature is high. The molecule is less than 20% by weight of the fluorine-based resin substrate component. In addition to high temperature resistant polymers, a small amount of surfactant (such as trit ο η X — 1 0 0) is still contained, and the rest is water. [Example] The experimental group added 10% by weight of polyetherketone ketone (PEKK) to a dispersion of PTFE, coated it on a glass fiber cloth 6 times, and dried the glass fiber cloth and laminated it with a copper foil. And pressed to make a substrate. In the control group, substrates containing high temperature resistant polymers such as polyetherketone ketone (PEKK) were not added to the dispersion.
經測試得知於分散液中 (PEEK)所製成之基板 p p m / °C ;抗張強度為5 6 2 6 k p s i ;Dk 為 2 未添加有财尚溫局分子 為 164ppm/°C;抗張 模數為1407kps i 。 添加有1 Owt%之聚醚嗣_ ’其Z轴之熱膨服係數為3 4 •4811^/1〇;模數為1 •75;Df 為 〇·〇〇ι6。 之基板，其Ζ軸之熱膨脹係數 強度為 〇.421b/in; 由上述對照可知，添加有耐高溫高分子於分散液中所 1After testing, it is known that the substrate made of PEEK is ppm / ° C; the tensile strength is 5 6 2 kpsi; Dk is 2 without the addition of financial and thermal local molecules: 164 ppm / ° C; tensile strength The modulus is 1407kps i. The addition of 1 Owt% of polyether 嗣 _ 'has a Z-axis thermal expansion coefficient of 3 4 • 4811 ^ / 10, a modulus of 1 • 75, and Df of 0.005. The thermal expansion coefficient strength of the substrate of the Z axis is 0.421b / in; from the above comparison, it can be seen that a high temperature resistant polymer is added to the dispersion 1
III IIII I
;η; η
第8頁~~ 200412208 五、發明說明（4) 製造之基板，其Z軸之熱膨脹係數明顯較未添加有耐高溫 高分子之基板降低許多，因此可以有效解決傳統電路板製 法上，因為Z軸熱膨脹係數過高產生銅箔披附不良之問題 發生。 經由上述添加耐高溫高分子於氟系樹脂基材分散液中 方法以製造之電路板，其Dk$3 .2 ; D f $〇 ·〇〇 3 ; z軸之熱膨脹係數$ 1 0 0 p p m / °C。Page 8 ~~ 200412208 V. Explanation of the invention (4) The thermal expansion coefficient of the Z axis of the manufactured substrate is significantly lower than that of the substrate without the addition of high temperature resistant polymers, so it can effectively solve the traditional circuit board manufacturing method because the Z axis If the thermal expansion coefficient is too high, the problem of poor copper foil adhesion will occur. Dk $ 3.2; D f $ 〇 · 〇〇3; the thermal expansion coefficient of the z-axis of the printed circuit board manufactured by the above method of adding a high temperature resistant polymer to a fluorine-based resin substrate dispersion is $ 100 ppm / ° C.
第9頁 200412208 圖式簡單說明Page 9 200412208 Schematic description
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