TW200410913A - Supporting member in an over for barking glass substrate - Google Patents

Supporting member in an over for barking glass substrate Download PDF

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Publication number
TW200410913A
TW200410913A TW91136737A TW91136737A TW200410913A TW 200410913 A TW200410913 A TW 200410913A TW 91136737 A TW91136737 A TW 91136737A TW 91136737 A TW91136737 A TW 91136737A TW 200410913 A TW200410913 A TW 200410913A
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Taiwan
Prior art keywords
rod
support frame
baking
shaped support
patent application
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TW91136737A
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Chinese (zh)
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TW555713B (en
Inventor
Yung-Chin Lin
Chin-Chang Hsu
Ying-Chieh Lin
Yu-Chi Lee
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Chunghwa Picture Tubes Ltd
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Publication of TW200410913A publication Critical patent/TW200410913A/en

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Abstract

This invention discloses a supporting member in an oven, especially employing in the oven for barking glass substrate. The glass substrate yield of thin-film transistor (TFT) can be raised by the oven. According to this invention, a plurality of first bar supporting members and second bar supporting members are disposed on the oven walls for supporting a glass substrate. The outer portion of the first and the second bar supporting members are each wrapped by a soft layer with low heat conductive index. Thus, the defects, such as the scrape on the glass substrate or the unequal heat-conduction, will not happen. Moreover, the quality of the glass substrate after barking with the oven of this invention can be raised.

Description

200410913 五、發明說明α) 一、 【發明所屬之技術領域】 本發明係為一種烘烤爐内之支撐架的結構,特別是有 關於一種應用在烘烤玻璃基板之烘烤爐内的支撐架結構, 以提高薄膜電晶體(Thin-Film Transistor; TFT)所採用 之玻璃基板的良率(yield)並提高玻璃基板在經過烘烤爐 之烘烤製程後的品質。 二、 【先前技術】 薄膜電晶體是一種液晶顯示器(Liquid Crystal D i s p 1 a y ; L C D )的技術,這種螢幕在每一個圖點都放置一 個電晶體來控制顏色,如此一來可以在螢幕更新顯示的期 間保有螢幕上的顯示資訊,這種技術又稱為「主動矩陣」 (active-matrix)螢幕。現今筆記型電腦的顯示器多以 薄膜電晶體的液晶顯示器為主流,這種顯示器改進了以往 雙掃描液晶顯示器(Dual-Scan Twisted Nematic; DSTN) 在光線太強時不清楚及可顯示角度太小的問題。現在薄膜 電晶,的顯示器已經製成桌上型螢幕,有取代傳統陰極 射線管(Cathode Ray Tube; CRT)螢幕的趨勢。 所謂的液晶顯示器是利用桿狀水晶分子(r〇d —shaped wy^tal molecule)受到電流作用會改變方向的原理來顯 不貧訊。通常液晶顯示器可見於數位錶(digital watch) 、、筆5己型電腦或是碼錶等儀器上,它的耗電量極低,所以 適合長時間顯示的設備。液晶顯示器的結構為在兩片平行200410913 V. Description of invention α) 1. [Technical field to which the invention belongs] The present invention relates to a structure of a support frame in a baking furnace, and more particularly to a support frame applied in a baking furnace for baking a glass substrate. The structure is to improve the yield of the glass substrate used by the thin-film transistor (TFT) and to improve the quality of the glass substrate after the baking process of the baking furnace. 2. [Previous technology] Thin film transistor is a kind of liquid crystal display (Liquid Crystal D isp 1 ay; LCD) technology. This screen puts a transistor at each point to control the color, so that it can be updated on the screen. During the display period, the display information on the screen is maintained. This technology is also called an "active-matrix" screen. Today's notebook computer displays are mostly dominated by thin-film transistor liquid crystal displays. This display improves the previous dual-scan liquid crystal display (DSTN) when the light is too strong and the display angle is too small. problem. At present, the thin film transistor display has been made into a desktop screen, and there is a tendency to replace the traditional cathode ray tube (CRT) screen. The so-called liquid crystal display uses the principle that rod-shaped crystal molecules (rod-shaped wy ^ tal molecule) are changed in direction by the action of current to display no poor information. LCD monitors are usually found on digital watches, pen 5 PCs, or computers, and they have very low power consumption, so they are suitable for long-time display devices. The structure of the liquid crystal display is

200410913 五、發明說明(2) 的玻璃基板當中放置液態的晶體。而在這兩片玻璃基板中 間’則有♦多垂直和水平的細小電線,透過通電與不通電 的動作來控制液晶顯示器上所顯示的圖點。 在薄膜電晶體液晶顯不裔的面板的製程中,用於黏著 玻璃基板而形成液晶晶胞(ce 11)之框膠材(熱硬化型環氧 树脂),需使用加熱的方式使其硬化。而通常所採用的加 熱方式為將玻璃基板送入烘烤爐中進行烘烤的製程,以硬 化框膠材。 參照第一圖所示,此為傳統烘烤玻璃基板之烘烤爐内 的俯視圖。傳統烘烤玻璃基板之烘烤爐1 0内之結構均為層 狀之結構,以便於在一次烘烤的製程中同時烘烤多片玻璃 基板。通常烘烤爐1 〇視設備設計之不同而有不同之層數, 通常一般之烘烤爐1 0内部大約分為四十層,以使熱量均勻 散佈在烘烤爐的每一層中。烘烤爐1 〇内之每一層均可放置 一塊玻璃基板進行烘烤之製程且其内部均包含多數支頂針 (p i η) 1 2,用以承載玻璃基板。依設備及產品需求之不同 而決定頂針的數量,通常在烘烤爐1 0内之每一層中之頂針 1 2數目為八根,此些頂針1 2均以兩兩成對之方式分佈在焕 烤爐内之兩側壁。 參照第二圖所示,此為在烘烤爐内部之單——層内放 置一塊玻璃基板之示意圖。參照第三圖所示,此為一塊玻200410913 V. Description of the invention (2) Liquid crystals are placed in the glass substrate. In the middle of these two glass substrates, there are multiple small vertical and horizontal wires, which control the dots displayed on the liquid crystal display through the action of power on and power off. In the manufacturing process of the thin-film transistor liquid crystal display panel, the frame adhesive (thermosetting epoxy resin) used to adhere to the glass substrate to form the liquid crystal cell (ce 11) needs to be hardened by heating. In general, the heating method is a process in which a glass substrate is sent to a baking oven for baking, so as to harden the frame material. Referring to the first figure, this is a top view of a conventional oven for baking glass substrates. The structures in the conventional baking oven 10 for baking glass substrates are all layered structures, so that multiple glass substrates can be baked at the same time in a single baking process. Generally, the baking oven 10 has different layers depending on the design of the equipment. Generally, the inside of the general baking oven 10 is divided into about forty layers so that the heat is evenly distributed in each layer of the baking oven. A glass substrate can be placed in each layer of the baking furnace 10 for the baking process, and the interior of the baking furnace includes a plurality of thimble pins (p i η) 12 for supporting the glass substrate. The number of thimbles is determined according to different equipment and product requirements. Usually, the number of thimbles 12 in each layer in the baking oven 10 is eight, and these thimbles 12 are distributed in pairs in Huan Two side walls in the oven. Referring to the second figure, this is a schematic diagram of placing a glass substrate in a single layer inside the baking furnace. Refer to the third picture, this is a piece of glass

第6頁 200410913 五、發明說明(3) 璃基板放置在 爐的每 ,而每 壁上。 常安裝 方式安 且重量 上時, 觸,而 大壓力 璃基板 顯示器 的缺陷 不良黑 顯示器 一層上 一頂針 為了要 在烘烤 裝在烘 相當的 由於頂 容易發 而壓傷 上之面 上顯示 即為一 點的缺 之生產 烘烤爐 均分佈 均藉由 讓玻璃 爐内之 烤爐的 重,當 針12與 生應力 玻璃基 板間的 畫面時 般業界 陷將會 成本。 内之頂針上時的缺陷示意圖。在烘烤 著多數個頂針1 2用以承載玻璃基板i 6 一頂針支撐架1 4而固定在烘烤爐的側 基板1 6能平穩地放置在頂針1 2上,通 頂針1 2的排列方式為兩兩相互對應的 側壁。通常玻璃基板丨6的體積相&大 玻璃基板1 6放置在烘烤爐内之頂針i 2 玻璃基板1 6之間的接觸面皆為點狀接 集中的缺陷,造成接觸點局部承受過 板内部的支撐材料(spacer),使得玻 間係(gap)局部偏低,而導致在液晶 造成顯示不良的缺陷。此種顯示不良 所謂的不良黑點(black gap)。此項 降低玻璃基板的良率,並且增加液晶 三、【發明内容】 烤爐明! 1利用傳統的頂針方式支揮烘 象,"致=點::::=板生應力集中之現 裝多數個第—桿狀3::,,#用在烘烤爐之爐壁上安 載玻璃基板,且多數:υ數個第二桿狀支撐架用以承 支樓架外部,心大支撐架與多數個第二桿狀 句L设一層柔軟且熱傳導係數較低之材質, 五 以 的 200410913 、發明說明(4) 板在經過块烤爐之烘烤製程後因為痛力 政應所發生之不良黑點的缺陷 巧愿力 ^發明的第二個目的為利用在 架與多數個第二桿狀 架二部,均狀支撐架與多數個第二桿狀 低玻璃基板心產;ί軟且熱傳導係數較低之材質’ 的為利用在烘烤爐之爐壁上今 多數個第二桿狀支撐架用以7| 桿狀支撐架與多數個第二桿形 敕且熱傳導係數較低之材質, 爐之烘烤製程後之良率。 的為利用在烘烤爐之爐壁上今 ^數個第二桿狀支撐架用以7| 才干狀支撐架與多數個第二桿沿 軟且熱傳導係數較低之材質, 體製程的運作效率。 的,本發明提供了一種應用名 支擇架結構,以避免玻璃基柄 因為應力集中的效應所發生之 集中 裝多 載玻 支撐 以降 本發明的第三個目 數個第一桿狀支撐架與 璃基板’且多數個第一 架外部,均包覆一層柔 南玻璃基板在經過供烤 本發明之再一個目 數個第一桿狀支撐架與 璃基板’且多數個第一 架外部,均包覆一層柔 加薄膜液晶顯示器之^ 根據以上所述之目 玻璃基板之烘烤爐内的 過供烤爐之烘烤製程後 裝多 載玻 支撐 以提 裝多 載玻 支撐 以增 烘烤 在經 不良 200410913 五、發明說明(5) 黑點的缺陷。 本發明為在烘烤 第二桿 撐架與 之兩側 撐架以 一桿狀支撐架與多數個 每一第一桿狀支 ,其中 對的方 式安裝 對應於每一第 1 一 層柔軟 傷與傳 烤製程 提高玻 更可增 桿狀支 且熱傳 熱不均 後的品 璃基板 加薄膜 在烘烤爐 •二桿狀支 撐架與任 導係數較 的缺陷, 質。本發 在經過烘 液晶顯示 一第二 低之材 並提高 明也可 烤爐之 器之整 爐管的 狀支撐 苐二桿 壁上, 穩定地 桿狀支質,以 玻璃基 降低玻 烘烤製 體製程 爐壁上安 架用以承 裝多數個第 載玻璃基板 狀支撐架均以兩兩成 桿狀支撐架 基板,且任 每一第一 承載玻璃 撐架外部 避免玻璃 板在經過 璃基板之 程後之良 的運作效 ,均包覆一 基板發生刮 烘烤爐之烘 生產成本並 率。本發明 率。 四、【實施方式】 ^ 本發明的一些實施例會詳細描述如下。然而,除了詳 細描述外,本發明還可以廣泛地在其他的實施例施行,且 本發明的範圍不受限定,其以之後的專利範圍為準。 ^ 本發明提供一種應用在烘烤玻璃基板之烘烤爐内的支 樓架結構’以避免玻璃基板在經過烘烤爐之烘烤製程後因 為應力集中的效應所發生之不良黑點的缺陷。參照第四圖 y 戶斤不’此為本發明之支撐架結構安裝在烘烤玻璃基板之烘 烤爐内之俯視圖。在烘烤玻璃基板之烘烤製程中所採用的 埃烤爐1 0 0内之結構均為層狀之結構,以便於在一次烘烤 的製程中同時烘烤多片玻璃基板。通常烘烤爐1 〇 〇視設備Page 6 200410913 V. Description of the invention (3) Glass substrates are placed on each wall of the furnace. The normal installation method is safe and easy to touch, but the defect of the high pressure glass substrate display is not good. A black pin on the first layer of the black display is displayed on the surface of the black display. The shortage of production baking ovens are all distributed by letting the weight of the oven in the glass oven, and when the picture between the needle 12 and the stress-bearing glass substrate is trapped, the industry will cost. Schematic diagram of the defect when the inner thimble is on. During the baking, a plurality of thimbles 12 are used to carry the glass substrate i 6 A thimble support frame 14 is fixed to the side substrate 16 of the baking furnace can be smoothly placed on the thimbles 12 and the arrangement of the thimbles 12 For two side walls corresponding to each other. Usually, the volume phase of the glass substrate 6 and the large glass substrate 16 are placed in the baking furnace. The contact surfaces between the thimbles i 2 and the glass substrate 16 are all spot-shaped defects. The internal support material (spacer) makes the gap locally low, which causes defects such as poor display in the liquid crystal. This kind of display failure is called a black gap. This item reduces the yield of the glass substrate and increases the liquid crystal. 3. [Content of the Invention] Oven Ming! 1Using the traditional thimble method to support the drying process, " to = points :::: == the majority of the existing installation of the plate stress concentration-rod-shaped 3 :: ,, # is used to install on the furnace wall of the baking furnace A glass substrate is loaded, and most of them: υ several second rod-shaped support frames are used to support the exterior of the building frame. The heart-shaped support frame and most of the second rod-shaped sentences L are provided with a layer of soft and low thermal conductivity material. 200410913, description of the invention (4) After the plate is baked in the block oven, the defect is caused by the bad black spots caused by the painful response. The second purpose of the invention is to use the shelf and most of the first Two rod-shaped racks, the homogeneous support frame and the majority of the second rod-shaped low glass substrate; the soft and low thermal conductivity material is used for the majority of the second on the furnace wall of the baking furnace. The rod-shaped support frame is used for 7 | rod-shaped support frame and most second rod-shaped cymbals with low thermal conductivity, and the yield after the baking process of the furnace. For the use of several second rod-shaped support brackets on the furnace wall of the baking furnace for 7 | the talent-shaped support bracket and the majority of the second rods are soft and have a low thermal conductivity, the operating efficiency of the system process . The present invention provides an application of a support frame structure to prevent the glass base handle from being concentratedly installed with multiple glass supports to reduce the third mesh number of the first rod-shaped support frame and the third mesh of the present invention. The glass substrate 'and most of the first frame are covered with a layer of soft South glass substrate. After passing through another mesh of the present invention for several first rod-shaped support frames and glass substrate', and most of the first frame are outside, all Covering a layer of flexible thin film liquid crystal display ^ According to the above-mentioned purpose, the glass substrate is baked in the baking furnace. After the baking process of the oven, a multi-load glass support is installed to lift the multi-load glass support to increase the baking Defects 200410913 V. Description of the invention (5) Defects of black dots. The present invention is to bake a second pole support and two sides of the support by using a pole-shaped support frame and a plurality of each of the first pole-shaped supports, wherein a pair of ways is installed corresponding to each first layer of soft wounds and transmissions. Improving the baking process can increase the rod shape of the glass substrate and increase the thermal conductivity of the glass substrate and the film after the uneven heat transfer in the baking furnace. The present invention is on the second rod wall on the second rod wall after baking the liquid crystal to display a second-lowest material and improve the furnace tube of the oven which can also be used for baking. The glass substrate is used to reduce glass baking. A rack on the wall of the system is used to support the majority of the first-loaded glass substrate-like support frames. The support substrates are rod-shaped, and any one of the first load-bearing glass supports prevents the glass plates from passing through the glass substrate. The good operation efficiency after the process is that all the substrates are covered with a substrate and the baking production cost and rate of the baking furnace are achieved. The invention rate. 4. Embodiments ^ Some embodiments of the present invention will be described in detail as follows. However, in addition to the detailed description, the present invention can be widely implemented in other embodiments, and the scope of the present invention is not limited, which is subject to the scope of subsequent patents. ^ The present invention provides a supporting structure used in a baking furnace for baking glass substrates' to avoid the defects of bad black spots due to the effect of stress concentration after the glass substrates have undergone the baking process of the baking furnace. Refer to the fourth figure y hujinbu 'This is a top view of the support frame structure of the present invention installed in a baking oven for baking glass substrates. In the baking process of baking glass substrates, the structures in the Angstrom oven 100 are all layered structures, so that multiple glass substrates can be baked at the same time in a single baking process. Usually baking oven 1 〇 〇 depending on the equipment

200410913 五、發明說明(6) 設計之不同而有不同之層數’通常一般之烘烤爐1⑽内部 大約分為四十層’以使熱量均勻散佈在烘烤爐的每一層中 。烘烤爐1 0 0内之母一層均可放置一塊玻璃基板進行烘烤 之製程。在傳統之烘烤爐的兩側爐壁上均安裝多數支頂針 以穩定地承載玻璃基板。但是利用傳統之頂針的方式承載 玻璃基板,容易在玻璃基板上發生不良黑點之缺陷,因此 本發明在烘烤爐1 0 0内之第一側壁上安裝多數個第一桿狀 支撐架1 1 0並在烘烤爐1 0 0内之第二側壁上安裝多數個第二 才干狀支樓架1 1 2用以承載玻璃基板,其中每一第一桿狀支 樓架110與每一第二桿狀支撐架11 2均以兩兩成對的方式安 裝在洪烤爐之兩側壁上,且每一第一桿狀支撐架1 1 〇之位 置均對應於每一第二桿狀支撐架1 1 2以穩定地承載玻璃基 板在任一第一和'狀支樓架1 1 〇與任一第二桿狀支樓架112 的外部,更包覆一層柔軟且熱傳導係數較低之材質丨2〇, 以避免破璃基板發生刮傷與傳熱不均的缺陷。 ni照第五圖所* ’此為在採用本發明之支㈣結構纪 部之單一一層内放置—塊玻璃基板之示意圖。才 烤2基板14°的烘烤製程中所採用的烘烤爐 一第一桿狀支撑架110與-第二桿狀支 ΐ:槿=第干狀支撲架u°藉由多數之第-側壁支撐 =;丄3°固烤爐内之第-側壁上,而任-第二桿 烤爐二:i1 2措/1 :數之第二側壁支撑架結構1 32固定於为 烤爐内之第二側壁上。卜第-桿狀支樓架U。的位置在 200410913 五、發明說明(7) 二桿狀支撐架1 1 2, 桿狀支撐架1 1 2均呈 烘烤爐的水平方向上均對應於任一第 且任一第一桿狀支撐架1 1 0與任一第」 現平行的狀態。200410913 V. Description of the invention (6) Different designs and different layers ’Usually the inside of a general baking oven 1⑽ is roughly divided into forty layers’ so that the heat is evenly distributed in each layer of the baking oven. A glass substrate can be placed on the mother layer in the baking furnace 100 for baking. Many thimble pins are installed on both sides of the traditional baking furnace wall to stably support the glass substrate. However, the traditional thimble is used to carry the glass substrate, which is prone to the occurrence of bad black spots on the glass substrate. Therefore, the present invention installs a plurality of first rod-shaped support frames 1 on the first side wall in the baking furnace 100. 0 and a plurality of second talented support frames 1 12 are installed on the second side wall of the baking furnace 100 to support the glass substrate, wherein each of the first rod-shaped support frames 110 and each second The rod-shaped support frames 11 2 are installed in pairs on the two side walls of the flood-roasting oven, and the position of each first rod-shaped support frame 1 1 0 corresponds to each of the second rod-shaped support frames 1 1 2 A glass substrate is stably carried on the outside of any of the first and 'shaped outriggers 1 1 0 and any of the second rod-shaped outriggers 112, and further covered with a layer of soft and low thermal conductivity material 2 In order to avoid the defects of scratching and uneven heat transfer of the broken glass substrate. According to the fifth figure * 'This is a schematic diagram of placing a glass substrate in a single layer using the support structure of the present invention. Baking furnace used in the baking process of 14 ° of 2 substrates-a first rod-shaped support frame 110 and a second rod-shaped support: hibiscus = the stem-shaped support frame u ° by most of the- Side wall support =; 丄 3 ° on the first-side wall of the oven, and any-second pole oven 2: i1 2 measures / 1: the number of the second side wall support frame structure 1 32 is fixed to the inside of the oven On the second sidewall. Buddy-rod-shaped underframe U. The position is in 200410913 V. Description of the invention (7) The two rod-shaped support frames 1 1 2 and the rod-shaped support frames 1 1 2 are in the horizontal direction of the baking oven, and each corresponds to any first and any first rod-shaped support. Frame 1 10 is in a state parallel to any of them.

當欲烘烤玻璃基板i40的時候,玻璃基板14〇以分片的 方式送進烘烤爐内進行烘烤。一片玻璃基板14〇放置在烘 烤爐内之一層内,藉由烘烤爐内所安裝之第一桿狀支撐架 11 0與第一扣狀支撐架11 2支撐。第一桿狀支撐架i丨〇與第 二桿狀支撐架112之形狀,可依製程之需求而設計為不同 之开^/狀可為圓管的形狀或是為多角管狀之之形狀。若是 第一桿狀支撐架110與第二桿狀支撐架112採用多角管狀的 形式,則第一桿狀支撐架110及第二桿狀支撐架112與玻璃 基板1 4 0所接觸的部分必須為一平面,以穩定地承載玻璃 基板,並避免玻璃基板1 4 0在烘烤的過程中發生應力集中 的效應而產生不良黑點的缺陷。當玻璃基板1 4 〇藉由第一 支撐架110與第二支撐架112的承載放置在烘烤爐内時,玻 璃基板1 4 0與第一支撐架11 〇及第二支撐架n 2所接觸之方 式為平面的接觸方式,並非如傳統之點接觸方式,因此玻 璃基板之重量可均勻分散在第一支撐架π〇及第二支標架When the glass substrate i40 is to be baked, the glass substrate 14 is sent into a baking furnace in a divided manner for baking. A glass substrate 140 is placed in a layer in the baking oven, and is supported by a first rod-shaped support frame 110 and a first button-shaped support frame 112 installed in the baking furnace. The shapes of the first rod-shaped support frame i and the second rod-shaped support frame 112 can be designed differently according to the requirements of the manufacturing process. The shape can be a circular tube shape or a polygonal tube shape. If the first rod-shaped support frame 110 and the second rod-shaped support frame 112 are in the form of a polygonal tube, the parts of the first rod-shaped support frame 110 and the second rod-shaped support frame 112 that are in contact with the glass substrate 140 must be One plane to stably support the glass substrate, and avoid the defects of the dark spots caused by the stress concentration effect of the glass substrate 140 during the baking process. When the glass substrate 14 is placed in the baking furnace by the load of the first support frame 110 and the second support frame 112, the glass substrate 1 40 is in contact with the first support frame 11 and the second support frame n2. The method is a flat contact method, not the traditional point contact method, so the weight of the glass substrate can be evenly distributed on the first support frame π0 and the second support frame.

上11 2而避免應力集中的現象發生,因此可避免不良黑點 之缺陷。 由於烘烤爐在烘烤玻璃基板時所採用的溫度較高,因 此第一支撐架11 〇與第二支撐架112所採用之材質大部分均The above 11 2 can avoid the phenomenon of stress concentration, so the defects of bad black spots can be avoided. Because the baking oven uses a relatively high temperature when baking glass substrates, most of the materials used by the first support frame 110 and the second support frame 112 are

第11頁 Λ Γ-; « 200410913 五、發明說明(8) 為不鏽鋼材質,以避免第一支撐架110及第二支撐架n 2在 高溫環境下發生變形之缺陷。但是由於不鏽鋼的硬度較玻 璃基板大,且不鏽鋼的熱傳導係數較空氣為高,因此若直 接將玻璃基板140放置於由不鐘鋼所製成之第一支推架 與第二支撐架1 1 2上,則玻璃基板1 4 0之表面將較容易發生 刮傷的缺陷,且玻璃基板1 4 0與第一支撐架1 1 〇及第二支推 架1 1 2所接觸之處的傳熱速度將會比玻璃基板1 4 〇上之其他 地方的傳熱速度快而發生在玻璃基板1 4 〇上溫度分佈不均 的情形。為了避免玻璃基板14 〇發生刮傷的缺陷,並避免 玻璃基板1 4 0在加熱的過程中發生溫度分佈不均的情形, 因此必須在第一支撐架1 1 〇與第二支撐架i丨2外部包覆一層 柔軟且熱傳導係數較低之材質1 2 0,以避免玻璃基板發生 刮傷與傳熱不均的缺陷。通常採用鐵氟龍作為此柔軟且熱 傳導係數較低之材質1 2 0。 參照第六圖所示,此 爐内所安裝之支撐結構與 較圖。由圖中可得知若採 板,則玻璃基板在其與頂 璃基板的間隙將會因為應 玻璃基板上發生不良黑點 構,利用第一桿狀支撐架 ,則雖然玻璃基板上在第 與玻璃基板接觸的地方(Page 11 Λ Γ-; «200410913 V. Description of the invention (8) is made of stainless steel to avoid the defects that the first support frame 110 and the second support frame n 2 are deformed in a high temperature environment. However, because the hardness of stainless steel is greater than that of the glass substrate, and the thermal conductivity of stainless steel is higher than that of air, if the glass substrate 140 is placed directly on the first support frame and the second support frame made of stainless steel 1 1 2 Surface, the surface of the glass substrate 1 40 will be more prone to scratch defects, and the heat transfer speed of the glass substrate 1 40 and the first support frame 1 1 0 and the second support frame 1 1 2 The heat transfer rate will be faster than other places on the glass substrate 140, and the temperature distribution on the glass substrate 140 will be uneven. In order to avoid the defects of scratching the glass substrate 14 and the uneven temperature distribution of the glass substrate 140 during the heating process, the first support frame 1 1 0 and the second support frame i 2 must be used. The outer layer is coated with a soft and low thermal conductivity material 120 to avoid defects such as scratches and uneven heat transfer on the glass substrate. Teflon is usually used as this soft and low thermal conductivity material 1 2 0. Referring to the sixth figure, the supporting structure installed in this furnace and the comparison diagram. It can be seen from the figure that if a plate is taken, the gap between the glass substrate and the top glass substrate will be due to the occurrence of a bad black dot structure on the glass substrate. Using the first rod-shaped support frame, although the glass substrate Where the glass substrate is in contact (

為玻璃基板在利用本發明於烘 利用傳統之支撐結構後的品質 用傳統之頂針的方式支撐玻璃 針所接觸的地方(異常區)之 力集中的效應而較薄,而易於 的缺陷。若採用本發明之支撐 #第二桿狀支撐架支撐玻璃基 一桿狀支撐架與第二桿狀支撐 異常區)之玻璃基板的間隔仍The quality of the glass substrate after using the present invention to make use of the traditional supporting structure to support the place where the glass pin is in contact with (the abnormal region) by the conventional thimble is thinner and easier to defect. If the support of the present invention is used #the second rod-shaped support frame to support the glass base, the distance between the glass substrate of the rod-shaped support frame and the second rod-shaped support is abnormal)

第12頁 200410913 五、發明說明(9) 縮小,但是此縮小的|u μ 因此可避 & *砵14 Γ 在品質之容許範圍之内 免在玻璃基板上發生不良黑點之缺陷。 明提供了 構,以避 集中的效 管的爐壁 支撐架用 二桿狀支 上,每一第一桿 定地承載玻璃基 狀支撐架外部, ’以避免玻璃基 璃基板在經過烘 低玻璃基板之生 烤製程後之良率 製程的運作效率 之设计’具有功 型之要件,爰依 詳予審查,並祈 烤玻璃 經過烘 良黑點 第一桿狀支撐 板,其 成對的 架對應 綜 烘烤爐 烘烤製 。本發 架與多 第一桿 裝在烘 第二桿 支撐架 傳導係 均的缺 品質。 板在經 膜液晶 外,並 ’故已 此,謹 德便。 合上述 内的支 程後因 明為在 數個第 狀支撐 烤爐之 狀支撐 與任一 數較低 陷,並 本發明 過烘烤 顯示器 且為前 符合專 貴 審 ,本發 撐架結 為應力 烘烤爐 一桿狀 架與第 兩側壁 架以穩 第二桿 之材質 提局玻 也可降 爐之烘 之整體 所未見 利法新 查委員 一種應 免玻璃 應所發 上安裝 以承載 撐架均 用在烘 基板在 生之不 多數個 玻璃基 以兩兩 狀支撐 板,且 均包覆 板發生 烤爐之 產成本 。本發 ,不僅 效性與 法具文 早日賜 任一第 一層柔 刮傷與 烘烤製 並提南 明更可 具有實 進步性 申請之 准專利 基板之 烤爐之 的缺陷 中每一 方式安 於每一 一桿狀 軟且埶 傳熱不 程後的 破螭基 用功效 之增進 。為 ,至感 以上所述僅為本發明之較佳實施例而已,此實施 糸用來說明而非用以限定本發明之申請專利範圍。 、 不脫Page 12 200410913 V. Description of the invention (9) Shrinking, but this shrinking | u μ can be avoided & * 砵 14 Γ is within the quality tolerance range, avoiding the defects of bad black spots on the glass substrate. Ming provided a structure to avoid the concentrated effect of the furnace wall support frame with two rod-shaped supports, each first rod fixedly carries the outside of the glass-based support frame, 'to avoid glass substrates The design of the operating efficiency of the yield process after the substrate is baked. The essential elements are functional, and will be reviewed in detail, and the baked glass will pass through the baked black spot. The first rod-shaped support plate corresponds to the paired racks. Baking oven. The hair frame and the first pole are mounted on the second pole support frame, the conduction system is of poor quality. The plate is outside the membrane liquid crystal, and ‘it ’s already done. After combining the above-mentioned support, it is clear that the support is in the shape of several first-supporting ovens and any number of lower depressions, and the over-baking display of the present invention is in accordance with the special examination before, and the support of this hair is stressed. A rod-shaped rack of the baking furnace and a second side wall frame are used to stabilize the material of the second rod. The glass can also be lowered. The whole furnace has not been seen. The racks are used to bake substrates. Many glass-based substrates support the board in two or two shapes, and they all cover the board to incur the production cost of the oven. This hairpin, not only the validity and method of writing, will soon give any first layer of soft scratches and bakes, and mention that the defects of the oven of the quasi-patented substrate that can be applied for practical progress can be applied in every way. Each rod is soft and the heat transfer function of the broken base is improved. For, I feel that the above description is only a preferred embodiment of the present invention, and this implementation is not intended to illustrate but not to limit the scope of patent application of the present invention. , Not take off

200410913 五、發明說明(ίο) 離本發明之實質内容的範疇内仍可予以便化而加以實施, 此等變化應仍屬本發明之範圍。因此,本發明之範疇係由 以下之申請專利範圍所界定。 Φ200410913 V. Description of the Invention (ίο) It can still be implemented within the scope of the essence of the present invention, and these changes should still be within the scope of the present invention. Therefore, the scope of the present invention is defined by the following patent application scope. Φ

第14頁 200410913 圖式簡單說明 五、【圖式簡單說明】 第一圖為傳統烘烤玻璃基板之烘烤爐内的俯視圖; ‘ 第二圖為在烘烤爐内部之單——層内放置一塊玻璃基 板之不意圖, 第三圖為一塊玻璃基板放置在烘烤爐内之頂針上時的 缺陷示意圖; 第四圖為本發明之支撐架結構安裝在烘烤玻璃基板之 烘烤爐内之俯視圖; 第五圖為在採用本發明之支撐架結構的烘烤爐内部之 單——層内放置一塊玻璃基板之示意圖;及 第六圖為玻璃基板在利用本發明於烘烤爐内所安裝之 支撐結構與利用傳統之支撐結構後的品質比較圖。 主要部份之代表符號: 10 烘烤爐 4 11 頂針 1 4 頂針支撐架 16 玻璃基板 1 0 0 烘烤爐Page 14 200410913 Brief description of the drawings 5. Simple explanation of the drawings The first picture is a top view of a traditional baking glass substrate baking furnace; 'The second picture is a single layer inside the baking furnace-placed in the layer The intention of a glass substrate, the third picture is a schematic diagram of the defect when a glass substrate is placed on the thimble in the baking furnace; the fourth picture is the support frame structure of the present invention installed in the baking furnace of the glass substrate The top view; the fifth view is a schematic view of placing a glass substrate in a single layer inside the baking oven using the support frame structure of the present invention; and the sixth view is a glass substrate installed in the baking oven using the present invention Comparison of the quality of the support structure and the traditional support structure. Symbols of the main parts: 10 baking oven 4 11 thimble 1 4 thimble support 16 glass substrate 1 0 0 baking oven

第15頁 200410913 圖式簡單說明 110 112 120 130 132 140 第一桿狀支撐架 第二桿狀支撐架 柔軟且熱傳導係數較低之材質 第一側壁支撐架 第二側壁支撐架 玻璃基板 ❿ <1Page 15 200410913 Brief description of drawings 110 112 120 130 132 140 First rod-shaped support frame Second rod-shaped support frame Soft and low thermal conductivity material First sidewall support frame Second sidewall support frame Glass substrate ❿ < 1

第16頁Page 16

Claims (1)

200410913 六、申請專利範圍 1. 一種烘烤爐内之支撐架結構,其中該支撐架結構包含: 多數個第一桿狀支撐架,其中任一該第一桿狀支撐架 均固定於一烘烤爐内之一第一側壁上;及 多數個第二桿狀支撐架,其中任一該第二桿狀支撐架 均固定於該烘烤爐内之一第二側壁上且該第二桿狀支撐架 平行於該第一桿狀支撐架。 2. 如申請專利範圍第1項之烘烤爐内的支撐架結構,其中 上述之多數個第一桿狀支撐架為一圓桿型。 3 .如申請專利範圍第1項之烘烤爐内的支撐架結構,其中 上述之多數個第二桿狀支撐架為一圓桿型。 4. 如申請專利範圍第1項之烘烤爐内的支撐架結構,其中 上述之多數個第一桿狀支撐架為一多角管狀的形狀。 5. 如申請專利範圍第4項之烘烤爐内的支撐架結構,其中 上述之多數個第一桿狀支撐架與一玻璃基板接觸的部分為 一平面。 6 .如申請專利範圍第1項之烘烤爐内的支撐架結構,其中 上述之多數個第二桿狀支撐架為一多角管狀的形狀。 7.如申請專利範圍第6項之烘烤爐内的支撐架結構,其中200410913 VI. Scope of patent application 1. A support frame structure in a baking furnace, wherein the support frame structure includes: a plurality of first rod-shaped support frames, and any one of the first rod-shaped support frames is fixed to a baking On a first side wall in the furnace; and a plurality of second rod-shaped support frames, any of which is fixed on a second side wall in the baking furnace and the second rod-shaped support The frame is parallel to the first rod-shaped support frame. 2. For example, the support frame structure in the baking furnace of the scope of application for the patent, wherein the plurality of first rod-shaped support frames described above are of a round rod type. 3. The support frame structure in the baking furnace according to item 1 of the patent application range, wherein the plurality of second rod-shaped support frames described above are of a round rod type. 4. For example, the support frame structure in the baking oven of the scope of patent application, wherein the first plurality of rod-shaped support frames described above are in the shape of a polygonal tube. 5. For example, the support frame structure in the baking furnace of the scope of patent application item 4, wherein a part of the above-mentioned first rod-shaped support frame contacting a glass substrate is a flat surface. 6. The support frame structure in the baking furnace according to item 1 of the patent application range, wherein the plurality of second rod-shaped support frames described above have a polygonal tubular shape. 7. The support frame structure in the baking furnace as claimed in item 6 of the patent scope, wherein 第17頁 200410913 六、申請專利範圍 上述之多數個第二桿狀支撐架與一玻璃基板接觸的部分為 一平面0 8.如申請專利範圍第1項之烘烤爐内的支撐架結構,其中 上述之多數個第一桿狀支撐架與該多數個第二桿狀支撐架 之一材質為不鏽鋼。 i 9 .如申請專利範圍第8項之烘烤爐内的支撐架結構,其中 上述之多數個第一桿狀支撐架與該多數個第二桿狀支撐架 之一外部均包含一柔軟且熱傳導係數較低之材質。 第 圍 範 利 專 請 申 如 構。 結龍 架氟 撐鐵 支一 的為 内 爐材 烤之 烘低 之較 項數 9 係 導 傳 熱 且 軟 柔 之 述 上 中 其 1 1.如申請專利範圍第1項之烘烤爐内的支撐架結構,其中 上述之第一桿狀支撐架藉由一第一側壁支撐架固定於該第 一側壁上。 1 2 .如申請專利範圍第1項之烘烤爐内的支撐架結構,其中 上述之第二桿狀支撐架藉由一第二側壁支撐架固定於該第 二側壁上。 1 3.如申請專利範圍第1項之烘烤爐内的支撐架結構,其中 任一該第一桿狀支撐架之位置在該烘烤爐的一水平方向上Page 17 200410913 VI. Scope of patent application Most of the above-mentioned second rod-shaped support frames contact a glass substrate as a flat surface. 0. For example, the support frame structure in the baking furnace of item 1 of the patent application scope, where One of the plurality of first rod-shaped support frames and the plurality of second rod-shaped support frames is made of stainless steel. i 9. The support frame structure in the baking oven according to item 8 of the patent application scope, wherein one of the plurality of first rod-shaped support frames and the plurality of second rod-shaped support frames includes a soft and thermally conductive outer portion. Material with lower coefficient. Fan Li specially applied for Ruruo. Jielong frame fluorinated iron is one of the lower baking items of the inner furnace. 9 It is the heat conduction and softness of the medium. 1 1. As in the baking furnace in the first scope of the patent application The support frame structure, wherein the first rod-shaped support frame is fixed on the first side wall by a first side wall support frame. 12. The support frame structure in a baking furnace according to item 1 of the patent application range, wherein the second rod-shaped support frame is fixed to the second side wall by a second side wall support frame. 1 3. The support frame structure in the baking furnace according to item 1 of the patent application scope, wherein the position of any of the first rod-shaped support frames is in a horizontal direction of the baking furnace 第18頁 200410913 六、申請專利範圍 均對應於任一該第二桿狀支撐架。 1 4 · 一種用來烘烤玻璃基板之烘烤爐内的支撐架沾 中該支撐架結構包含: m& 多數個第一桿狀支樓架,其中任一該第 均藉由多數個第:侧壁支撐架固定於一供烤爐内 側壁上且任一該第一桿狀支撐架之 熱傳導係數較低之材質;及 卜1 J匕5 一柔軟且 多數個第二桿狀支撐架,其一 _ 均藉由多數個第二側壁支同+彳一忒苐一杯狀支撐架 側壁上且任一該第」=二固定於該烘烤爐内之一第二 熱傳導係數較低之材質,Α二:—外部均包含該柔軟且 行於該多數個第—桿肤二加〜夕數個第二桿狀支撐架平 之位置在該烘烤爐的一 ·^任—該第一桿狀支撐架 狀支撐架。 欠千方向上均對應於任一該第二桿 5: ί i π; m來烘烤玻璃基板之供烤爐内 桿型。、中上述之多數個第一桿狀支撐架為—圓 1 6 ·如申請專利範 内的支撐架結構 圓桿型。 圍第14項之用來烘烤玻璃基板之烘烤爐 其中上述之多數個第二桿狀支撐架為二Page 18 200410913 VI. The scope of patent application corresponds to any one of the second rod-shaped support frames. 1 4 · A support frame in a baking oven for baking glass substrates. The support frame structure includes: m & a plurality of first rod-shaped support frames, any of which includes a plurality of first: A side wall support frame is fixed to a material provided on the inner wall of the oven and has a low thermal conductivity coefficient of any of the first rod-shaped support frames; and 1 J Dagger 5 a soft and most second rod-shaped support frame, which _ All are supported by a plurality of second side walls + one side of a cup-shaped support frame and any one of the "" = two is fixed to one of the materials with a lower thermal conductivity in the baking oven, Α Two:-the outside contains the soft and runs on the majority of the first-the second skin of the rod-the number of the second rod-shaped support frame in the flat position of the oven-the first rod-shaped support frame Support. The direction of less than one thousand corresponds to any one of the second rods 5: ί i π; m to bake the glass substrate in the oven for the rod type. Most of the above-mentioned first rod-shaped supporting frames are-round 1 6 · Such as the supporting frame structure within the scope of the patent application, round rod type. The baking furnace for baking glass substrates around item 14 in which most of the above-mentioned second rod-shaped supporting frames are two 第19頁 200410913 六、申請專利範圍 1 7 ·如申請專利範圍第1 4項之用來烘烤玻璃基板之烘烤爐 内的支撐架結構,其中上述之多數個第一桿狀支撐架為一 多角管狀的形狀。 1 8 ·如申請專利範圍第1 7項之用來烘烤玻璃基板之烘烤爐 内的支撐架結構,其中上述之多數個第一桿狀支撐架與一 玻璃基板接觸的部分為一平面。 1 9 ·如申請專利範圍第1 4項之用來烘烤玻璃基板之烘烤爐 内的支撐架結構,其中上述之多數個第二桿狀支撐架為一 多角管狀的形狀。 2 0 ·如申請專利範圍第1 9項之用來烘烤玻璃基板之烘烤爐 内的支撐架結構,其中上述之多數個第二桿狀支撐架與一 玻璃基板接觸的部分為一平面。 2 1 ·如申請專利範圍第1 4項之用來烘烤玻璃基板之烘烤爐 内的支撐架結構,其中上述之多數個第一桿狀支撐架與多 數個第二桿狀支撐架之一材質為不鏽鋼。 2 2 ·如申請專利範圍第1 4項之用來烘烤玻璃基板之烘烤爐 内的支樓架結構,其中上述之柔軟且熱傳導係數較低之材 質為一鐵氟龍。Page 19 200410913 VI. Scope of patent application 17 • For the support frame structure in the baking furnace for baking glass substrates, such as in item 14 of the patent application range, most of the above-mentioned first rod-shaped support frames are one Polygonal tubular shape. 18 · The support frame structure in a baking furnace for baking glass substrates as claimed in item 17 of the scope of patent application, wherein a portion of the above-mentioned first rod-shaped support frame contacting a glass substrate is a flat surface. 19 · The support frame structure in a baking furnace for baking glass substrates according to item 14 of the scope of patent application, in which most of the above-mentioned second rod-shaped support frames are in the shape of a polygonal tube. 20 · The support frame structure in a baking furnace for baking glass substrates according to item 19 of the patent application scope, wherein a portion of the above-mentioned plurality of second rod-shaped support frames contacting a glass substrate is a flat surface. 2 1 · The support frame structure in a baking furnace for baking glass substrates as claimed in item 14 of the scope of patent application, wherein one of the plurality of first rod-shaped support frames and the plurality of second rod-shaped support frames described above The material is stainless steel. 2 2 · The structure of the supporting structure in the baking furnace for baking glass substrates according to item 14 of the scope of patent application, wherein the above-mentioned soft and low thermal conductivity material is a Teflon.
TW91136737A 2002-12-19 2002-12-19 Supporting member in an over for barking glass substrate TW555713B (en)

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