TW200306611A - Apparatus with processing stations for manually and automatically processing microelectronic workpieces - Google Patents

Abstract

A method and apparatus for manually and automatically processing microelectronic workpieces. The apparatus can include a tool having a plurality of processing stations, all of which are manually accessible to a user and an input/output station configured to support at least one microelectronic workpiece for automatic transfer to and from the processing stations. A transfer device is positioned proximate to the input/output station and the processing stations and is configured to automatically transfer microelectronic workpieces between the input/output station and the processing stations. The apparatus can be used for both manual and automatic processing of microelectronic workpieces, either sequentially or simultaneously. The processing stations can be configured to perform on the microelectronic workpiece functions such as material application , material removal, seed layer enhancement, rinsing, drying, annealing, baking, and metrology.

Description

200306611 发明 Description of the invention: The related application cross-references this application and claims the priority of the following US patent applications under review and is incorporated by reference: (A) 10 / 080,914 (perkins Coie Office, case number 29 195 · 8 1 73US), the name "method and device for manual and automatic processing of microelectronic workpieces"; (B) 10 / 080,915 (PerkinS Coie Office, case number 29195.8173US1), name, has Device for processing stations for manual and automatic processing of microelectronic workpieces "; and (C) 10 / 080,910 (Perkins Coie Office, case number and processing micro-February 29195.8173US2 February 2002), name" Microelectronic workpieces " The method of using the device in the electronic workpiece of the conveying device ", all of the above apply for filing on the 22nd. US Patent Application No. 10 / _, 91〇 is part of the following applications: ⑴ US Patent Application No. 09 / 875,300 under review, (Perkins Co., Ltd. (Case No. 29195.8153US), name, a conveying device for processing microelectronic workpieces in a processing machine, and the environment, and a method of using the device in the processing of the microelectronic guard ", which is in 2〇 〇2 "Application on May 5th; and" Under review US Patent Application No. _75,428, "(Perkins Co., Inc. Case No. 29195.8153US1), the name, which has been used to handle the transfer of microelectronic workpieces Device integration tool, which was applied on May 5th, 2001. The above two are successive applications for the following parts ... (3) Examination of China-US 200306611 National Shooting Case No. G8 / 99G , 1 () 7. "Name" is an automatic machine for processing microelectronic workpieces, which was reprinted on December 15, 1997; 美国 US Patent Application No. ⑽⑽, 566, which was filed on August 31, 1999 In the first year of the 1st year, the certificate was issued as U.S. Patent No. 6,318 '957' Name ', an improved automatic machine for processing microelectronic workpieces. It was filed on July 9, 1999, and designated the United States international patent Serial No. PCT / US99 / 15567, Title, Automatic Machine for Microelectronic Workpiece Processing "and the claim in this international patent is from a US patent filed on July 11, 1998 Please file No. 105, priority, name, automatic machine for microelectronic workpiece processing, "(5) U.S. Patent Application No. 09/386, filed on August 31, 1999 , 590 and issued a certificate on November 27, 2001 as US Patent No. 6,322,119, entitled "Improved Automatic Machine for Microelectronic Workpiece Processing", which was applied on July 9, 1999 File and designate consecutive US Patent Application No. PCT / US99 / 15567, named ", An automatic machine for microelectronic workpiece processing", and the international patent application claims priority from the US Patent Application No. 09/1 14, 105 filed on July 11, 1998, the name, The automaton for microelectronic workpiece processing is, and (6) US Patent Application No. 09 / 618,707, filed on July 18, 2000, which was filed on July 15, 1996. Partition of US Patent Application No. 08 / 680,056 and the original case is currently abandoned; all of the above are incorporated herein by reference. In addition, this application is related to the following applications: (a) U.S. Patent Application No. 200306611 filed on June 5, 2001 No. 09/875, 304, Name, ㈣ 干 · 1 distribution Power supply, (b) on June 5, 2001 by)) main tick # Gu Yue Shen U.S. Patent Application No. 09 / 875,365, name avoid "Ding You inch ~ Jiakou Yuecha Adaptable Electrochemical Treatment (c) On June 5, 2001 a) The US Patent Application No. 09 / 875,424 filed by the owner and the applicant on the 5th, and the name of each of them Jia Ming's case was used to transfer components and attach the components in the workpiece processing method "; Mind array and slaves (d) On May 31, 2001 a by the ancient master p μ,

US patent application No. 09 / 872,151, named Cat, which is called “Shenxi”, is used for electrochemical treatment and method of electronic workpieces by 2 T $ ”; and & < Table ( e) U.S. Patent No. 09/849 '505', filed on May 4, 2GG1, "Designation of Adjustable Electrode in a Reactor for Electrochemical Processing of a Microelectronic Workpiece" All the above patent applications indicated by paragraphs ⑷-⑷ are incorporated herein by reference.

FIELD OF THE INVENTION The present invention relates generally to methods and devices for manually and automatically processing microelectronic workpieces. Prior art microelectronic workpieces such as semiconductor components and field emission displays were typically fabricated on and / or within electronic workpieces using several different types of machine tools.) Many such processing machines have a mechanism that can be performed on the workpiece. A single processing station for one or more programs. An example of such a tool is a single-chamber tool 10 200306611 q 〇χ tool available from Semitool Corporation of Kalispell, Montana. This tool can have a Holds a microelectronic 2-piece-container rack and a single-processing chamber for electrochemical processing of the workpiece. A user can load workpieces one by one into the chamber, for example, for testing or certification processes Formulation or other process parameters. Although the foregoing: has a wealth of materials in the jade process environment, one pass of the production level requires greater output than can be provided by a single-chamber tool. Therefore, other processing machines have multiple capabilities Completed on individual guards or batches of workpieces: a series of processing stations for different procedures. For example, it can also be purchased from Semit 00i: T21 () C and Spectrum (Speet_) Automated processes can be provided separately in a batch-to-single-wafer environment. These tools include automated machines that can automatically remove the microelectronic workpiece from the container and move between phases: processing stations The microelectronic workpiece, and the U electronic workpiece returned to the container after processing. Although such tools are very efficient for processing a large number of microelectronic workpieces, when they are used in a project, testing may not meet the requirements Cost-effective or practical. One of the problems with the aforementioned tools is that they basically require a clean room environment in which to operate. Clean rooms are expensive to construct and maintain, and as a result, tool manufacturers attempt to The square footage of the occupied clean room area and the number of microelectronic workpieces that can be processed per hour are maximized. However, despite the best efforts to make small and effective tools, there is continuous pressure to reduce the size of the tool (for example, The tool, footprint, and) increase the efficiency of the tool. When component manufacturers require engineering / testing and production systems These capabilities will in turn require even cleaner rooms, so this pressure becomes even more urgent. 200306611 Another view of existing tools is that they typically include a workpiece transfer mechanism that can move the workpiece within the tool (such as Automatic machines). These transfer mechanisms may not provide sufficient freedom of movement of the workpiece. Although many tools have been developed with six degrees of freedom ', many of these tools have not been used in processing devices for manufacturing microelectronic workpieces This is because the additional degree of freedom increases the complexity of the system. Therefore, the existing transmission mechanism restricts one or more movements of the automatic machine, such as limiting the verticality of the automatic machine.

Straight motion. We should pay attention to maintaining the freedom of movement of the automatic machine while reducing the complexity and the probability of collision between the workpiece and the automatic machine. Summary of the Invention: ΛW% 』丄 忭 < Development and method. One of the several embodiments of the invention is a single processing tool that can be applied to both manual and automatic operations. #By combining these ㈣ in a single tool, the limited clean room area can be fully utilized to complete the

There are many functions on the software. Furthermore, by integrating the work and all or two of them into a gray room environment, the tool footprint can be reduced. As a result, Zhen Gu is able to increase the utilization of expensive and clean space by providing engineering and production capabilities to increase the tool capacity of several embodiments according to several examples. "The Shaolu t tool system includes a stand that can be constructed on the microelectronic workpiece to perform various functions. For example, + Shang Fanchengguang; a measurement station of the characteristics of the workpiece is used to evaluate the microelectronics-such as Seed layer reinforced material ⑽ plus material f's material application station't, a composite layer. These materials can be a single 12 200306611 pole (cathode or anode), a multi-electrode surface set, or a station without electrode device

加 Add in%. In each of the other A and λ rows, the tool can include a material removal station, such as a wood spray station that can guide the flow plate core I / Li to 5 Haik electronic workpieces, or a The small Feng Menggan, Ai Ai station is constructed by a frame that guides two different fluids toward the opposite surface of the microelectronic workpiece. In another embodiment, the tool includes one or more steps ..., a processing station, for example, a quilt constitutes an annealing station that can anneal a metal material applied to an electronic workpiece.

The processing station can be obtained by-an automatic machine (for automatically transferring microelectronic workpieces: 'or leave 4 processing stations) and-a user (for manually transferring the electronic workpiece from the electronic workpiece). The manual operation can be sequentially performed with the automatic operation ^ ^ /, when the dagger is placed near the hood of the automatic machine to obtain the processing station manually by a user, at least the user can be restricted to access The automatic machine. In another aspect of the present invention-the holder carrying the microelectronic workpiece into the processing station can be placed above the hood, & for manual operation and under the hood for automatic operation .

In a more particular embodiment, the one or more processing stations can include a container: and-movably placed adjacent to the container and quilted to form a holder that can carry the microelectronic workpiece. The bracket can be moved between a first transport position and a second transport position spaced from the first transport position. When the microelectronic workpiece is in the first transfer position, the support is oriented to receive the microelectronic workpiece from the transfer device. When the microelectronic workpiece is in the second transfer position, the bracket is configured to receive the microelectronic workpiece from the user manually. 13 200306611 is a transmission device that includes a space above the special arm in this embodiment, and a distance of one or two above the arm, so that the arm can be separated at different heights at different intervals, and Without leaving the workpieces in another embodiment, the automatic machine may support the arms of the first and second terminal controllers. In another aspect, the first terminal controller is at the one distance and the second terminal controller is at the second distance. The first distance is different from that of the first terminal controller compared to the second terminal controller. The collision between the first and second terminal controllers allows the device to carry two workpieces in a superimposed relationship. [Embodiment] The following description discloses details and features of several embodiments of a device for processing microelectronic workpieces. The term, microelectronic workpiece, is used throughout the specification to include a workpiece formed from a substrate, and a microelectronic circuit or part is fabricated on and / or within the substrate. Data storage elements or layers, and / or micromechanical elements. I should note that the details presented below are provided to describe the following embodiments in a manner sufficient to enable those skilled in the relevant industry to make and use the disclosed embodiments. However, for implementing certain embodiments of the present invention, some of the details and advantages described below may not be needed. In addition, the present invention can include other embodiments that still fall within the scope of the present invention but are not described in detail with reference to Figs. 1-26. The related discussion of FIG. 8 and the following are generally related to the application of manual and automatic processing of microelectronic workpieces according to several embodiments of the present invention. More specifically, the diagram is a full view of such a device and is an illustration of the device, which is suitable for manual and automatic transfer of microelectronics. The workpiece can be placed on a stand at one of the processing stations of the device. Figure 5 illustrates an automatic workpiece transfer device (such as an automatic machine), and Figure 5 illustrates a mechanism for removably carrying the stand from above the processing station.

The diagram and the related discussion below relate to processing stations that can be included in the site, and to processes that can be completed by that station. In a # 表 丨 生 = ¾, microelectronic workpieces can be evaluated at a metrology station (Figure 9). The material can be applied to the workpiece at the electrochemical deposition station (Figure 1H4) and / or strengthened and / or refurbished, or at an electrodeless deposition station. Figure 15: Generates such as those disclosed in heading 1 〇 Layer of towel. The workpiece can be etched and cleaned obliquely at a small packaging station (Fig. 16A · B), and / or rinsed at a spraying station (Fig. 17), and annealed in a heat treatment station (Fig. 10). In other embodiments, the device can perform other processing and / or other processing sequences.

The related discussions in Figures 19-26 and below are related to a transfer device for processing microelectronic workpieces. More specifically, Fig. 19 is a general view of a processing tool having a transfer device according to an embodiment of the present invention. Figure 20a-24 illustrates a transmission device according to an embodiment of the present invention, and Figures 25-26 illustrate a transmission device according to another embodiment of the present invention. FIG. 1 is a partially cut isometric view of a device 100 that is constructed by a gantry to handle microelectronic workpieces both manually and automatically according to an embodiment of the present invention. In one aspect of this embodiment, the device 100 can be used in a research 15 200306611 and both a R & D setting and a production setting. For example, in a research and development setting, individual microelectronics can be manually moved into and out of the device 100 for experiments and verification using new methods and processes. The same device 100 can be used in a production setting where a large number of microelectronic workpieces are automatically and efficiently moved into and out of the device in a conventional manner for processing. As explained in more detail below, the manual and automatic processing steps occur sequentially or simultaneously using a single device 100.

The apparatus 100 can include a plurality of processing stations, and each processing station is configured to complete one or more processes on the microelectronic workpiece. Some processing stations (such as the electrochemical deposition, electrodeless deposition, and small packages) include a frame constructed of a container that provides fluid in contact with the guard. In the process, a holder carries the workpiece and comes into contact with the fluid. The workpiece can be loaded on the stand either manually or by a self-conveying device. In one aspect of this embodiment, the apparatus 100 can include a chassis 101 carrying a plurality of processing stations 150. The chassis 101 can carry eight such as

In the processing station 150 disclosed in FIG. 1, or in another way, in other implementations, the chassis 101 can carry other numbers of processing stations 150. The processing station 150 can be aligned along a station axis 151, and the axis can be substantially straight in one embodiment. In another embodiment, the station # i5i can be curved (for example, in the shape of a horse shoe) or have other shapes. In any of these embodiments, the administrative electronic workpiece 1 14 can be manually and / or automatically loaded into the processing station 1 5 according to the requirements for the special processing station 150 at a particular point in time. . . The Hai device 100 can include a whole 16 200306611 or a portion placed around the chassis 010 and a housing 102 surrounding the processing station 150. The housing 102 can have a plurality of surfaces, such as a front surface 103a, a rear surface 103b facing the front surface 1 Γν 〇a, and two between the front surface 103a and the rear surface 103b. Lateral surface 103c. The front surface can be constructed to face a user (not shown) and can include a graphical user interface 107 coupled to the processor 106 to control the electrical unit. operating. The electric unit 105 then supplies power and controls the parts of the device 1000. The front surface 103a can also include an input / output station 110 which is constructed to support the microelectronic workpiece 114 for automatic transfer into and out of the processing station 150. In one aspect of this embodiment, the input / output station can include two inclined platforms 1 and each platform is constructed to form a supportable building to removably carry a plurality of the microelectronic workpieces. Container of 4} i 3. The inclined platform HI can be moved from an outwardly inclined position (for receiving the container 113) to an upwardly facing position (as disclosed in FIG. 1). When the container 113 is in the upward position, the microelectronic workpiece 114 in the container 113 can be passed through the container receiving opening 112 in the housing 102 by an automatic conveying device 13. Get. The automatic transfer device 130 can include an automatic machine 131 supported by a transfer device support 132. The automatic machine 131 can move along a conveying and penetrating guide path 133 to remove the microelectronic workpiece 114 from the container 113 and move the microelectronic workpiece 114 through the container access opening to enter the housing 102 and To the processing station 150. The automatic conveyance mechanism 130 can then return to the microelectronic workpiece 114 and pass through the same or a different container 17 200306611 to access the opening 11 2 to the same or different container 1 1 3. The front surface 103a can also include a bracket surface 115 on which the valley 113 can be placed for manual loading and unloading. In one aspect of this embodiment, the support surface 115 can have a removable section 116 that allows access to the services of the transfer device 130. Alternatively, the transfer device 130 can be obtained from other parts of the device 100. In any embodiment, the user can place the container on the support surface 115, and

And then individually remove the microelectronic workpieces 14 from the container 113 and move them through a manual access opening 104 and into the housing 102. because

Therefore, in one aspect of this embodiment, the manual access opening 104 can be large enough to allow the user to manually obtain any and all of the workpieces of the processing station 150. In a further aspect of this embodiment, the manual access opening 104 is formed by a single-, adjacent opening σ. Alternatively, the manual access opening π 1G4 can include a plurality of smaller adjacent openings, and the opening is by, for example, still allowing the user to obtain all of the vertical partitions of the processing station 150 Separated by. In any of these embodiments, the manual access opening 104 can be placed on a single side (such as the front side) of the device 100 to enable the user to manually move from one side of the device To obtain all of the processing stations 15o. In another aspect of this embodiment, the manual access opening 104 may be permanent. Alternatively, for example, J. For example, during the extension of the early single automated process, the device 100 can include a panel placed above the manual access opening 104 to completely hold the process. Station 150 and the transfer device 130. In this embodiment—and further from the viewpoint, the housing 18 200306611 defines a mini (minO ”clean room environment. In any of these embodiments, as described in more detail below with reference to FIG. 2 A shield 134 can be placed adjacent to the conveying device 13 to prevent interference between the conveying device 13 and the use generated when the user manually obtains the processing station 150. 忒 Housing 102 The rear surface 103b faces the front surface 103a and the rear surface 103b provides a service for accessing the parts in the housing 102. For example, the processing station 150 and related electrical, mechanical , And the chemical system is obtained from the service access opening in the rear surface 103b (not shown in the figure). In one aspect of this embodiment, the service for accessing the device 100 can only pass through the The front surface 103a and the rear surface 103b are provided. Therefore, after the device i00 is assembled, the side surface does not need to have a service access panel and does not need access service. One feature of this embodiment Is because, for example, the device 100 and An access channel is required along the side surface i03c of the housing 102, so the effective footprint of the device 100 can be reduced compared to some conventional tools. In another embodiment, the device 100 can be placed Placed in a clean room environment 120 adjacent to a fire room 121. For example, the gray room environment 121 can include a room separated from the clean room environment 120 by a wall 122 and salty ash to frame Environment 121 can define a generally clean soil environment that does not need to meet clean room standards. The wall 122 can include an opening 123, and the rear surface i03b of the housing 102 can be the front surface 103a and the side The surface 10 hole protrudes into the clean room environment 120 and is placed adjacent to the opening 123. A bolt 124 is placed so as to surround the periphery of the enclosure 10 02 19200306611 at the opening 23 To maintain the space between the clean room environment 120 and the gray room environment 121, this women's volleyball team has several advantages. For example, the effective footprint of the device 100 can be reduced when compared to the conventional device. This is because It is not necessary to provide a passage in the clean room frame 120 adjacent to the rear surface 103b. When the service is completed on the clothes 100, most of the internal parts of the device 100 can be obtained from the gray room environment 121 through the access opening in the rear surface 103b. Therefore, Many service functions can be provided without requiring service personnel to enter the clean room environment i2o, and the clean room environment requires a procedure to spend "put on, clean room clothing" before the personnel enter. In other embodiments, the device 100 can have other positioning devices that can also reduce the effective footprint of the device 100. For example, the device 100 is moved rearwardly through the opening 123 with at least a portion (and optionally, the entire portion) of the side surface 103c contained in the gray room environment 121 and Enter the gray room environment 121. Therefore, the amount of floor space in the clean room required by the apparatus 100 can be less than other tools having a similar number of processing stations. In one aspect of the foregoing embodiment, the side surface 103c does not need to be accessed to operate or service the device 100. Therefore, the side surface 10 does not need to include a quilt to form a regular access panel. Alternatively, the device 100 can be framed to be placed end-to-end with another processing tool, and at least one of the side surfaces 103c can have a frame: the microelectronic workpiece 114 may be automatically removed from The device 100 is transferred to the opening of the connected processing tool. FIG. 2 is a cross-sectional side view of the above-mentioned device 20 200306611 device 100 according to a reference drawing of an embodiment of the present invention. In one aspect of this embodiment, at least one of the processing stations 150 can include a frame constructed to provide a processing fluid, and the flow system is, for example, an electrolytic or non-electrolytic system for metal deposition. Handle fluids. A holder 160 can be placed adjacent to the container 152 and is constructed to hold a single microelectronic workpiece 114 and carry the microelectronic workpiece 114 in contact with the tritium processing fluid. Alternatively, the bracket 160 can be framed to carry multiple microelectronic workpieces 14 at the same time. In still further embodiments, the processing station 150 can have other architectures and can implement other functions, such as rinsing, drying, spraying, measuring, annealing, or coating the microelectronic workpiece 114. Other devices for the processing station 15 and the stand 160 are included in U.S. Patent Nos. 6,136,163 and 6'139,712, both of which are incorporated herein by reference. In some of the foregoing embodiments, the processing station 150 does not include a container, and therefore, the stand 160 can carry the microelectronic workpiece 114 corresponding to other parts of the processing station 150. In one embodiment, the bracket 160 can include a head 161 having a receiving surface 162 (such as an annular ring) placed to receive the microelectronic workpiece 114. The head 61 can be supported by a carrier 164 and can rotate relative to the carrier 164 around a head rotation axis 166 (as indicated by arrow A) between a manual transfer position (disclosed in FIG. 2) and a processing position. . In the manual transfer position, the receiving surface 62 can face upward to allow a user to manually place or remove the microelectronic workpiece 114 on the head 161 or 4 from the head 161. For example, the user can operate a rod 108 with a vacuum end controller to place and remove the microelectronic workpiece 21 200306611 114. In other embodiments, the user can place and remove the microelectronic I-piece 114 by hand. Or the user can use other manual tools. In any of these embodiments, the head 161 is capable of rotating stiffness around the head rotation axis ⑹ from the manual transfer position to the processing station 150. And can be lowered into the container 152 for processing the microelectronic workpiece 114. 〇 In a further aspect of this embodiment, the cradle can include-a cradle base 180 that supports the carrier 164 from a position above the processing station 15o. In one embodiment, the carrier 164 can move relative to the bracket base 180, as described in more detail below with reference to FIG. 6. In another example, the carrier 164 can be fixedly supported from above. In any embodiment, the carrier 164 can include a lifter 165 that can move the head 161 up and down as indicated by arrow b. Therefore, the head 161 can be moved up to the manual transfer position along a guide path, and then rotated and down to the processing station. In another aspect of this embodiment, the shield 134 can be extended to be adjacent to the bracket 160 to at least limit the contact between the user and the transfer device 13 when the user manually obtains the head 161. . For example, the shield Π4 includes an upright portion 135 extending upward to a position above the conveying device 130. The shield 134 further includes a lateral portion ι36 extending laterally above the transport device 130 to the bracket 160. Therefore, the shield 134 can at least restrict the user's access to the transfer device 130, but still allow the user to obtain the head 161 when the head 161 is in the manual transfer position. In a further aspect of this embodiment, the 22 200306611 shield 134 can be transparent to allow the conveying device 13 to be viewed. In operation, the user can place on the support surface 115 of an upright portion 135 of the shield 134. The user can then move the container 113 except for one of the microelectronic workpieces 114 to the holder 160. The bracket 160 moves upward to the manual transfer position. In another embodiment of this embodiment, the head i 6 of the δ-height support 160 can be moved upward until the receiving surface 162 is attached to the lateral portion of the cover 34; 36. The user then reaches (or removes) the microelectronic workpiece 114 above the shield 134 to protect the user from accidental contact with the transfer device. In one aspect of this embodiment, if the transfer device 13 tries to obtain the bracket 16 when the bracket 160 is in the manual transfer position, the head 161 will interfere with the movement of the transfer device 13. Additional protection is provided for the user to manually obtain the stand. ^ In one aspect of this embodiment, the user may alternate between enabling W to set 100 to manual processing and enabling the device 100i automatic processing. Another way 'The device 100 can automatically process some microelectronics # 114 in-more processing stations 150. At this time, the user can manually manually in the processing stations currently occupied by the microelectronic workpieces 114 that are not automatically processed. Other microelectronic workpieces 114. In either embodiment, the user can enter appropriate commands in the user interface 107 to allow manual operation and / or to initiate and guide automatic operations. In any of the embodiments, the same device just automatically processes the microelectronic workpiece 114 in the manner described below with reference to FIG. 3. … Figure 3 is a test plan! The cross-sectional view of the device 100 described in FIG. 2 is not to be placed at the automatic transfer position. The branch can transfer microelectronics 23 200306611 The workpiece 4 enters and / or leaves the transfer device i30. In this implementation, the "δH" automatic transfer position is placed under the plane of the manual transfer position (Figure 2) and under the lateral portion 136 of the shield 134. Therefore, the transfer device f U0 The receiving surface 162 of the head 161 can be accessed. The transmission device fm includes a base 137 supported by the transmission device bracket 132 for moving laterally to the plane of FIG. 3. As soon as the base 137 is connected to the building, The elevator 138 of the arm 139 moves the hand f 139 up and down relative to the green 137. The two terminal controls _ 14〇 (if disclosed as an upper terminal controller 140a and a lower terminal controller 14_ can be attached Up to the arm 139 is rotated relative to the handle 139, which is described in more detail below with reference to Figure 4. Each terminal controller 14 can carry a microelectronic workpiece U4 ', such as a' -vacuum clip or another releasable The clamping mechanism can move toward and away from the head 161. In the automatic operation room, the lifter 165 of the bracket 160 can move the head 161 to the automatic transfer position to accommodate one of the transfer devices. Microelectronic workpiece U4 » 130. After placing the microelectronic workpiece 114 on the receiving surface 162 of the head 161, the lifter 165 can slightly raise the head 161 to provide a vertical gap between the head 161 and the container 152. The head 161 It can then rotate 180 degrees around the head rotation axis 166 (as described above with reference to Figure 2) and the lifter 165 can lower the ^ 161 to the processing station. The foregoing steps are processed to remove The electronic workpiece 114 can be reversed later. The feature described above with reference to FIGS. 1-3 is that the bracket 160 can selectively stop two different positions for accommodating the microelectronic workpiece 114: one is 200306611 for manual placement and A manual transfer position for removing the microelectronic workpiece, and an automatic transfer position for automatically placing and removing the microelectronic workpiece. The number of different positions for manually and automatically transferring the microelectronic workpiece 114 Advantages. For example, when the bracket 160 is in the manual transfer position, the user can be protected from contact with the automatic transfer device, and when the bracket 160 is in the automatic transfer position, the transfer device 13 can take the bracket. 160. The different position may provide a visual cue to the user to indicate when it is appropriate for the user to manually obtain the bracket 160. For example, in the embodiment, the 'user can see the 161 series When placed above the lateral portion 136 of the shield 134, the receiving surface 162 is accessible: for loading and / or unloading. Conversely, when the 帛 i6i system is placed: the shield m When it is below the horizontal feature 136, the user can see that the position is located at the automatic transfer position and cannot manually accommodate or place the electronic workpiece 114. It is not difficult in practical examples, the bracket 160 can be upward and downward Move between the hand positions 詈 Γ: and the automatic transmission position of the child, and rotate between the stations within one mile of the transmission. In other embodiments, the bracket 160 can move between: non-axis movement and / or in any of these three positions in different ways. In some embodiments, the manual transmission position can be adjusted by the user. With two. In another aspect of the embodiment, the k, rotation, for example, a moving shield 134 is protected from accidental contact with the transfer device 130. Only Fig. 4 is an isometric view of a transfer device 13o according to the present invention. In one of the viewpoints of column M, the conveying device 130 includes an automatic machine 131 supported by the conveying device 25 200306611 supporting frame 132 (Fig. 3) to move linearly as indicated by arrow c. Therefore, the automatic machine 13 "moves into and out of: the input / output station 11o (Figure D and either of the processing stations 15o (Figure 1) phase = 'standard. The base 137 of the transport device 13o It can support the elevator 138 J ^ h 'as indicated by arrow D, the upward and downward movement. The elevator 138 can support the arm 139 for rotating movement, as indicated by arrow E. In one embodiment The arm 139 has a single centrifugal convex portion 146 extending from the axis along which the elevator 138 moves, and the convex portion 146 supports the terminal controller 140. Alternatively, the arm 139 can have a plurality of Lu convex portions. The single centrifugal convex portion 146 is less like a plurality of convex device interference with peripheral parts when the arm 139 rotates. In any embodiment, the Y-side terminal controller 140 can be opposite to the arm 139 Rotate individually around a common axis, as shown by arrow F. In one aspect of this embodiment, the robot 丨 3 丨 can be coupled to a coka cable 142 (such as a ribbon cable) A common unit 141. The automatic machine can move linearly as shown by arrow C while There is a limitation from the flexible electric winding 142. In this-embodiment-and further from the point of view, it is necessary that the important part of the control and power circuit for operating the automatic machine 13 1 can be placed in the common unit 141 It is not on the automatic machine 13m itself. The advantage of this device is that the automatic machine 131 can be made smaller and therefore requires less moving space. Fig. 5 is an automatic machine according to an embodiment of the invention 丨A partial cross-sectional view of 31. In one aspect of this embodiment, the upper terminal controller 140a is supported on an inner shaft 144a and the lower terminal 26 200306611 controller 140b is supported on a Zhi Nu Mu is placed on the outer shaft from the inner shaft 144a. The outer shaft 144b "—the outer shaft belt is shown outward in the plane of the" shaft belt office secret # 1 甲 driven ", and The outer shaft belt 145b is driven by an outer shaft pulley (not shown in Fig. 5). The inner two 144a can be face-attached to an inner shaft belt 145a, which is then pre-powered by an inner shaft ▼ wheel 143a. ... because of the upper terminal controller! Directly separated from the lower terminal control H 140b

". Can move without interfering with other people's movements. Borrow two =% controller 140 provides separate power transmission 'Each terminal controller 14 can move independently of others. For example, a terminal controller" 〇 可A microelectronic workpiece 114 is placed on the bracket 160 (Figure 3), but at this time other terminal controllers 140 still retain a microelectronic workpiece 114 for transport to a different bracket 160 or to the input / output Station 11 (Figure 丨).

In other embodiments, the transmitting device 130 can have other architectures. For example, the transport device 130 can carry a single microelectronic workpiece 1 1 * or more than two microelectronic workpieces 114. When the transfer device 130 carries more than one microelectronic workpiece 114, as described below with reference to Figs. 4 and 5, the motion of the mother-political electronic workpiece 114 can be at least partially independent. Alternatively, the conveying device 130 can be configured to be arranged in batches, for example, it can be moved automatically with or without a separate carrier or container structured to be used in the housing. A plurality of microelectronic workpieces 丨 4. According to other embodiments of the present invention, a more detailed view of the transfer device is included in US Patent Application No. 09 / 875,300, which was filed on June 5, 2001 and published PCT Application No. PCT / US99 / 14414. It is incorporated herein by reference. ^ FIG. 6 is a cross-sectional side view of a device 100 having a bracket 160 arranged to be movable relative to the bracket base 180 according to an embodiment of the present invention. As shown in FIG. 6, the carrier 164 of the bracket 160 can be suspended from the bracket base 180, while the bracket base 180 is placed above the head 161 of the processing station 150 and above the container 152. The bracket base 180 can include a guide path 181, and the bracket 160 is along the path between an operating position (the solid line shown in FIG. 6) and an access position (the dotted line shown in FIG. 6). Between moves. ^ In the operating position, the head 161 can be placed as described above so that the child piece 114 can be manually or automatically transmitted into or out of the head. In the pick-up position, the head 161 can be laterally away from the processing station 150 to allow pick-up to the container 152 at noon. Therefore, the user can obtain the container 152 from the front surface 103a of the housing 1 () 2 (for example, for maintenance) when the holder is in the access position. In one aspect of this embodiment, the guide path 181 may be substantially straight and when the head moves relative to the container 152, the guide path 181 is a vertical movement transverse to the head 161. In other embodiments, the guide path 181 can have other architectures. For example, in another embodiment, the guidance path control 181 can be curved. In a further aspect disclosed in the embodiment of FIG. 6, the entire bracket 160 is interrupted from the device 100 and the bracket can be moved and / or removed by an access panel 184 at the rear surface 103b It passes through the rear surface 103b of the housing 102 and is removed. Therefore, the stand 160 can be remotely controlled from the device 100, and the user can have the housing 100 passed through the housing. Table 28 200306611

The other access to the face 103b is to get to the 150 and the container 152. In one aspect of this embodiment, the gujia juice 70 Λ &, wooden stand 180 includes a track device for linear movement of the bracket 160, as described in more detail below with reference to FIGS. Raised. In other embodiments, the stand base 180 can have other structures for moving the stand 160 relative to the chamber 150 and / or relative to the device 100. For example, in other embodiments, the support 160 can be pivoted about one or more axes to allow access to the chamber 150.

Figures 7 and 8 are schematic illustrations of parts of a quilt that constitute $ 160 for assembly and removal according to one embodiment of the present invention. Referring first to FIG. 7, the bracket base 180 can include a pair of guide rails 182 (one of which can be seen in FIG. 7). 'Every-have-' a linear channel 183 aligned along the bracket guide path i8i. The carrier 164 includes a guide element 174 slidably received in the channel 183. Therefore, the carrier 164 can be suspended or at least partially suspended from the guide rail 182.

In a further aspect of this embodiment, the characteristics of the carrier 164 can allow the carrier to be aligned and placed within the device. For example, the vehicle 164 includes a plurality of placers # 170, which are revealed to have an upper placer ball 170a and-to the lower placer ball mb (of which-which can be seen in Fig. 7). The device 100 includes an upper supporting beam coffee having an upper holder ball 169 which is structured to receive the upper placing ball 170a. The device 100 can further include a lower support beam 168b having two lower support brackets 175, which includes a left lower support bracket n5a and a lower support bracket 175b (not shown in Fig. 7) and can be placed in a Receiving the lower placement device ball 29 200306611 In this embodiment, the upper support bracket 169 has a positioning surface 17 arranged so as to be in contact with the upper placement device ball 17Ga. It is adjusted forward and backward as shown by arrow g. When assembled, the forward and backward positions of the upper support bracket 169 can be adjusted until the carrier 164 is vertically aligned. Once the vehicle 164 is properly

Both are accurate. The lock mechanism 1 72 of question 173 can be actuated to hold the upper placer ball ma against the positioning surface 171. In order to move or remove the vehicle 164 ' Instead, the carrier 4 164 is allowed to pivot backwards about the lower placement ball 170b, as indicated by the arrow ㈣ and disclosed by the dashed line in FIG. 7). After the vehicle 164 has been pivoted rearwardly as shown in FIG. 7, the lower placement device # ⑽ can be removed from the lower support bracket 175 and the vehicle 164 can be moved to a more accessible position. 'Behind' and / or removed from the package £ 100, as described above with reference to FIG.

FIG. 8 is a schematic exploded rear view of a portion of a support 1600 of at least a part of a building supported by a guide element m in the device 100. FIG. In this aspect of the embodiment, the guide member 174 can be slidably received in the guide rail 182. In another embodiment, the guide element 174 can include wheels that roll along the guide track 182, and in other embodiments, the shock 100 can include allowable use for the bracket 160 and the support Other arrangements for the relative movement between ❹180. In these embodiments, the optional load and 164 can include-a quilt constitutes a releasable accommodation-an electric winding (not disclosed) 163 卩 and-a quilt constitutes a releasable accommodation of an air duct (not Revealed) Air End 167. The electric terminal 163 and the air terminal 167 are not connected to the device 30 ^ UUJU6611. The stent 16 can be detached from the carrier 164 before. In the viewpoint of an embodiment of the device 100 shown in FIG. 8, the μ ## support bracket 175 (the left lower support and the lower main support ± plus W5a bud branch wood 175b is disclosed) can be constructed. Adjust the horizontal alignment of the vehicle 164. As described above, the left lower support bracket 175a includes a substantially flat twisted surface 176, and a corresponding one of the lower placement ball 17b can be moved along the surface / month. The lower support bracket 175b can include a receiving bracket 177, which

The leather frame is configured to accommodate the other lower placement ball 1 70b and at least restrict the movement of the other lower placement ball to provide additional support for the vehicle i 64. Therefore, the 4 gnar bracket 1 77 can be adjusted laterally using the adjusting screw 1 78 as shown by the arrow I.

One of the features of the 100 embodiment of the device described above with reference to FIGS. 6-8 is that the bracket 160 can be supported by a support base 18 that allows movement of the bracket 160, but the weight of the bracket 160 is still by the device 100 support. Therefore, when accessing under the processing station 150, it may be easier to reposition the bracket 160. Another advantage of this feature is that it is easier to completely remove the stent from the device 100 through the surface of the device 100. Another advantage of one embodiment of the stand 160 is that the stand is carried from above the processing station 150. The advantage of this feature is that the stand 160 does not need to occupy the space under the head 161 and is adjacent to the processing station 150. Instead, this space can be vacated (e.g., to access the processing station 150) or can be occupied by additional support equipment for the processing station 150. Another advantage of this device is that the cables that can provide power and control signals between the bracket 16 and the electric unit 105 can be shorter, because the bracket 1631 200306611 is placed in a more sin Near the electric unit i 〇5. Another advantage of this device is that when the cable is coupled to the support vehicle 164, it can be placed completely above the processing M 150. Therefore, analogs used for the cable to come into contact with chemicals in the processing station 150 can be reduced and / or eliminated. Figures 9-18 illustrate several details of a processing station included in a tool similar to that described in Figures 1-8. -A wide variety of microelectronic workpiece processing techniques can be accomplished simultaneously and / or sequentially using a combination of processing stations such as those described below. In still further embodiments, the processing station can have features in addition to or instead of those described below to provide different and / or additional functions. In a representative process, microelectronic workpieces can be evaluated at a metrology station (Figure 9). Materials can be applied to the microelectronic workpiece at an electrochemical deposition station (Figure U · 14 or an electroless deposition station (Figure 15) and / or strengthened and / or repaired to produce, for example, those shown in Figure 10 The workpiece can be obliquely etched and cleaned in a small packaging room (Fig. 16A · B) and / or sprayed in a spraying station (flushing in Figure, and annealed in a heat treatment station (Figure 18). In other implementations In the example, the delta device can perform other processes and / or other sequences. The measurement station FIG. 9 is a schematic illustration of the measurement station 900 included in one of the one or more processing stations 150 described above with reference to FIG. In one aspect of this embodiment, 'the measurement' 900 & includes a base 91 having one or more brackets 920 that are removably supported to support the microelectronic workpiece 114. When the microelectronic workpiece 114 When carried by the holder 920, a detector 930 is operatively coupled to the microelectronic workpiece 114. The detector 930 can be framed to measure a conductive layer (such as 32 200306611) on the microelectronic workpiece 114 (such as A sub-layer or a cover layer) or other conductivity characteristics In another aspect of this embodiment, the picker 930 can use a chip resistor or capacitor to determine the thickness of the conductive layer. Alternatively, the detector 930 can use light or thermal technology to determine the thickness of the conductive layer. Selected characteristics of the microelectronic workpiece 114. In another embodiment, the detector 930 can include a laser-based non-fixed system, and in this system 'a emitted laser can be sensed in An acoustic response in the layer of the microelectronic workpiece 114. The acoustic response is then related to the thickness. This system is known as a pulsed stimulus thermal scattering (ISTS) system. One such system is in Massachusetts, "Natick," manufactured by Philip Analytical, Inc., named ", Pulse, or ,, Emerald,". Another suitable unit of measure is manufactured by Rudolph Corporation, Flanders, NJ. "Metapulse". In the previous embodiment, the detector 930 can be operatively coupled to an analyzer 940 to analyze and / or otherwise process data received by the detector 930. The analyzer 940 can Coupled to a control 95. The controller 950 is then coupled to one or more other processing stations of the tool (Figure 1) in a chain 960. Therefore, the data obtained at the metrology station 900 can be used to influence the The processing performed by other processing stations is as described in more detail below. In a consistent embodiment, the metrology station 900 can be used in a, feed forward, mode. Therefore, the results obtained by the metrology station 900 Can be used to influence and / or control subsequent processing done on the microelectronic workpiece 114 in a way that takes into account the unique characteristics of the particular microelectronic workpiece 114. Another 33 200306611 alternative mode, 5 Hai The degree set 900 can be used in one, and in this mode, the microelectronics-after being selected; = completed is analyzed after the microelectronic workpiece 114 i, and the results can be used to affect the The same processing is done in the way of other microelectronic workpieces. Examples of feedforward and "feedback" processing are described in more detail below. In a feedforward operation mode, one or more downstream processes can be modified based on the results obtained at the metrology station 900 Alternatively, or in addition, the order of subsequent processing to be implemented can be modified based on the measurement station results. For example, if the thickness or uniformity of a seed layer of the microelectronic workpiece 114 is outside the acceptance limit At this time, the microelectronic workpiece can be transported to an electric ship station (refer to Figure 10a-15 for a more detailed description below) and then to a sub-layer strengthening station (also refer to Figure 10A-15 or below). More detailed description.) Alternatively, if the seed layer is so tolerated that it cannot be repaired or strengthened at the seed layer strengthening station, the cymbal electronic workpiece U4 can be transported to a material removal station ( Refer to Figures 16A-17 for a more detailed description below), and the microelectronic workpiece ΐ4 can be etched in the station. The microelectronic guard 114 can then be returned to the -seed layer strengthening station, such as one located outside 100 A physical vapor deposition (PVD) device. In a real yoke example, the results obtained at the metrology station 900 can be used to affect not only where the microelectronic satellite 114 should go after leaving the metrology, but also affect By the next processing station, the appearance of the processing of the electronic workpiece 114 is completed. For example, the processing used during the deposition and / or blanket metal layer, blanket dielectric layer'® patterned metal layer and patterned dielectric layer replacement Parameters can be established, changed, adjusted, or controlled in other ways based on the results obtained at the measuring station 900 in 2003 3406611. In one embodiment, one can set a parameter (for example, film thickness) Intentionally, changed for compensation of non-uniformity (eg, line width) to produce uniform electrical results. ^ In other embodiments, the user can obtain the results obtained at the metrology station 900 and stop subsequent processing. Until the problem related to the previous processing has been solved. For example, the overlay plating station is found #the thickness of the seed layer is found and stopped when it is below the acceptable tolerance. Alternatively, the application The user can continue the subsequent processing (ie, the plating process) and adjust the subsequent processing steps or processing parameters based on the output from the metrology station _ 2. For example, the user can, < The results obtained are automatically adjusted to achieve acceptable plating uniformity and thickness. In the feedback operation mode, the metrology station 900 can change the processing that is normally performed before the microelectronic workpieces 1 and 4 arrive. For example, after an electrochemical deposition (ECD) process obtains uniformity or other characteristics of the material applied during lameness, the microelectronic workpiece 114 is placed within the metrology station = 0. If the uniformity or other characteristics of the applied material are found to fall out of acceptable tolerances, the processing formula at the excitation station can be adjusted before the electronic workpieces and other electronic workpieces have similar initial characteristics. Second, if at the metrology station 900, it is determined that the microelectronic workpiece 114 with the fixed and known characteristics-the initial seed layer will return unacceptable results from an ECD station at the subsequent processing 1, but when the subsequent processing At 2 o'clock from the CD station with acceptable results, the controller 950 can automatically guide the ECD station to use the processing when other microelectronic workpieces 114 with an initial seed layer are to be processed. 2. In other examples, the metrology station 900 can have other arrangements. Examples used in other examples of the processing station 900 are included in the international application pct / us〇1 / 21579 (Agent Case No. 29195 8U7w〇 ^ on 2001 + July 9 For reference, in any of these implementations, the control H 95G can control the processing performed at any station within the tool 100 (Figure 1). Alternatively, the controller 950 can be controlled by Operatively coupled to a device located outside the tool 100 to control the processing performed within the device. For example, the material f can be removed from the microelectronics in a chemical mechanical planarization (CMp) device placed outside the tool 100 Workpiece 114 is removed. Material application stations Figures 10A-15 are illustrations of stations suitable for applying materials to the microelectronic workpiece. These stations include an electrochemical deposition station (ECD) capable of applying materials in an electrochemical process, and Non-power station capable of applying materials in a non-electrochemical process. ECD stations (described in more detail below in Figure U-14) can be used to apply conductive materials, such as copper, in Lu, platinum, solder balls or gold. The Conductive material can be applied as a new overlay Layers may be used to strengthen or repair existing seed layers. Therefore, any of these stations can function as a sub-layer strengthening / repair station. Examples of treatments and solutions suitable for achieving such functions are included in the international application PCT / US99 / 06036, It was filed on March 22, 1999 and is incorporated herein by reference in its entirety. Alternatively, (eg, by inverting the polarity applied to the poles during metal deposition), these stations can be processed in an electrophoresis It is used to apply insulation materials. The non-power station (refer to 36 200306611 described below in Figure 15) can also be used to apply conductive materials, such as overlay or seed layer repair / reinforcement materials, without applying current. Figure 10A-10E Explain the processing as a sample using a material application station according to an embodiment of the present invention. Starting with Figure 丨 OA, the microelectronic workpiece 114 includes a feature such as a trench! 0 丨 2, which will be filled There is a metal or other conductive material. A thin barrier layer 1010 is deposited on the microelectronic workpiece 114 and in the trench 1012. Alternatively, the barrier layer 1010 can be deposited A dielectric material, such as silicon dioxide. In any embodiment, the barrier layer 1010 can include a nitride button, titanium nitride, or other conductive material that can prevent subsequent placement in the trench 1012. The material is prevented from migrating into other appearance areas of the microelectronic workpiece 114. The barrier layer 1010 can be deposited using known techniques, such as chemical vapor deposition (CVD) or physical vapor deposition (PVD). Now refer to FIG. 10B, An ultra-thin metal seed layer 1011 is deposited on the barrier layer 10 10. In one embodiment, the ultra-thin metal seed layer includes copper, and in another embodiment, the ultra-thin metal seed layer The layer 1011 can include other materials. In one embodiment, the ultra-thin metal seed layer 10i i can be deposited using CVD, PVD, or other techniques. In one aspect of this embodiment, the ultra-thin metal seed layer 1011 can be deposited to a thickness of only about 50 angstroms to about 500 angstroms. Therefore, the void 1013 or other non-uniformity may remain in the seed layer 1011 after the seed layer 1011 is formed. As shown in FIG. 10c, the seed layer 1011 is strengthened by additionally applying a conductive strengthening material 1014 on the ultra-thin metal seed layer 1011 to fill the cavity 1013. Therefore, the 37 200306611 barrier layer ΗΗ0 can be completely or almost completely covered with a conductive material. As shown in FIG. 10D, the cover layer 1G15 is deposited on the reinforced material 1014 and the ultra-thin metal seed layer. 1011 to fill the trench W12. After filling in the trench 1012, part of the barrier layer 1010, ultra-thin metal seed layer 1011, the reinforced material 1014, and the cover layer 1015 located above the trench 1012 can be filled. Removed, leaving a line = through hole 66) 66 'as shown in Figure n. The foregoing steps can be repeated to build up a layer of conductive structure within the microelectronic workpiece 114. The entire station arrangement is illustrated in FIG. 11. A container assembly 1152 with a bracket 1160 and a quilt constitutes a reinforced material and / or cover of the chemical treatment station 1100, as described in reference to FIGS. 10A-10E. Shown above. The bracket 1160 includes a rotation motor 1161, a rotor 1162 coupled to the rotation motor "Η", and a contact assembly ιΐ70 carried by the rotor 1162. The contact assembly 1170 can be configured to be in contact with one of the front side and the rear side of the microelectronic workpiece 114. The rotor 1162 has a backing plate 1163 and a seal 1164. The backing plate 1163 can be located at a first position between the backing plate 1163 and the back side of the workpiece 114 (disclosed in FIG. 11) and the 5th lining plate is away from the workpiece 1 1 4 A micro-electronic workpiece 114 (arrow D) is laterally moved between a second position on the back side (disclosed by the dotted line in FIG. 11). The contact assembly 117 has a support ring 1172, a plurality of contacts 1173 carried by the support ring 1172, and a plurality of shafts extending between the support ring 11 72 and the rotor 丨 丨 62. The contact 38 200306611 1173 can be a coil spring contact or other type of contact, which is connected to a part of the seed layer on the workpiece 114 by a frame structure. Commercially available brackets 1160 and contact assemblies 1170 can be used in the station 1100. Specific applicable brackets 1160 and contact assemblies 1170 are disclosed in U.S. Patent Nos. 6,228,232 and 6,080,691; and U.S. Application Nos. 09/385, 784 09 / 386,803; 09/386197; 09 / 501, 002; 09/733, 608 and 09/804, 696; all of which are incorporated herein by reference. The container assembly 1152 includes an outer container n53 (schematically shown in Fig. 11) and an inner container 1154 (also schematically shown in Fig. 11) placed in the outer container 1153. The inner container n54 carries at least one electrode (not shown in FIG. 11) and guides an electric processing solution to the workpiece 4. The electroprocessing solution, for example, can flow through a weir (arrow w) and enter the external container 1153, and the external container captures the electroprocessing solution and sends it back to a tank. Some embodiments of the inner container 1154 are disclosed and described in detail with reference to Figs. 12-14. In operation, the holder 1160 holds the workpiece 14 at a workpiece processing position μ in the internal state 1154, so that at least one electroplated surface of the workpiece 14 is bonded to the processing solution. An electric coil is established by applying a potential between the electroplated surface of the workpiece 114 (via the contact assembly 1170) and one or more electrodes in the inner container 1154. For example, the contact assembly 710 can be biased with a negative potential relative to the electrode in the inner container 1154 to plate the material onto the workpiece. Alternatively, the contact assembly 1170 can be biased at a positive potential relative to the electrode in the inner container 1154 to (a) remove electricity from the tool 114 or electro-polished material or 39 200306611 (b) Deposition of other metals (ie electrophoretic resists). Generally speaking, therefore, depending on the specific material type used in the electrochemical treatment, the workpiece Η # can be used as a cathode or an anode to remove the material from the workpiece 114 or deposit a material on the workpiece. . Single Electrode Station FIG. 12 is a cross-sectional side view of a container assembly 1252 having an internal container 1254 placed in an external container 1253 according to an embodiment of the present invention. In the perspective of this embodiment, the inner container 1254 has a single electrode 1230 for electrochemical processing of the microelectronic workpiece 114 (represented in FIG. 12 without the support 160). In its embodiment, the container assembly ^ 52 is described in more detail below with reference to FIGS. 3-14. In one aspect of the embodiment disclosed in FIG. 12, the outer container 1253 carries an exhaust ring 122o, which then carries the inner container 1254, and the inner container is annularly moved from the exhaust ring 122o. Placed in the Mainland. The inner container 1254 includes an inner side wall 1256 connected to a net 1257 by a net 1257. The inner container 1254 includes an exhaust port 1221, which may allow gas radiation generated in the inner container 1254 to flow outward. One or more exhaust outlets 1222 within the exhaust ring 1220 may collect the gas and remove it from the container assembly 1252. The internal container 1254 may be coupled to a fluid transfer conduit 232, and an electrolytic treatment fluid may enter through the fluid transfer conduit 1232, as shown by the hoe j. The electrolytic treatment fluid flows upward through the fluid transfer conduit into the inner container 1254 and above a weir 1259. Therefore, the weir 1259 moon dagger is built in the stage of the electrolytic fluid in the container assembly 1252 for contacting the microelectronic workpiece 114. The electrolytic fluid can flow through the weir 259 and pass through the opening 1258 in the net 1257 to enter the area between the inner container 1254 and the outer container 1253. The sleeve 1240 separated by the slit 1241 can direct the fluid downward toward a processing outlet 1242, but still reduces the tendency of the fluid to sputter, and the sputtering tendency can create bubbles in the fluid without being necessary. The fluid can be replaced or recovered after its flow passes through the processing outlet 1242. An overflow outlet 1243 provides protection against overflow of the electrolytic fluid. The electrode 1230 is positioned within the inner container 1254 and is supported on the fluid delivery conduit, for example, it is supported by a more bayonet-type fitting. In one aspect of this embodiment, the electrode worker 23 can be attached to an electrode shield 1231, which protects the lower surface of the electrode 1230 and is attached to the fluid delivery catheter with a first bayonet-type fitting. 1232. The electrode cover 12 3 1 then supports a diffuser 2 2 5 with a second bayonet-type fitting. The diffuser 1235 can adjust the flow of the electrolytic fluid when the electrolytic fluid approaches the microelectronic workpiece 114. In a further aspect of this embodiment, an electric current can be supplied to the electrode 1230 by a cable 1233 housed in a sleeve 1234. And the sleeve 1234 passes through the fluid transfer guide 1232. The electrode 1230 can operate as one of an anode (that is, for plating the microelectronic workpiece 114) and a cathode (that is, for deplating the microelectronic workpiece 114). The container assembly 1252 further includes an auxiliary electrode 1230a 'its quilt structure can be "stolen," which may be electroplated to the contact assembly 1170 (conductive material in the figure in other ways. The foregoing and other embodiments of the container assembly More detailed information is included in U.S. Patent Nos. 6,228,232; 6 41 200306611, 270, 647, and ο Multi-electrode station 6,080,291, all of which are incorporated herein as reference diagrams. One of the characteristics of a child's pole processing station for electrochemically and / or electro-ice deposition and / or removal of material onto the microelectronic workpiece according to the present invention is that it is applied to each electrode The current can be individually controlled to more precisely control the removal or deposition process that occurs at the microelectronic workpiece 114. For example, the current applied to the electrodes is adjusted to take into account the current within the microelectronic workpiece 114 The initial non-uniformity, or refurbished to carefully form a non-uniform sentence deposition layer. Referring first to FIG. 13, the container assembly 1352 includes-placed in a ring-inside the outer container 1353-the inner container 1354. The Internal capacity " 54 can be supplied by an electrolytically treated fluid passing through a fluid conduit 1332 ", the L body flows through the internal valley state 1354 in a manner described in more detail below, and can overflow a Weir 1359 leaves the inner container 354. The fluid can then continue through a spiral drainage channel 1340 positioned between the inner container 1354 and the outer container 1353 to an outlet 1342, and the fluid can pass from the The outlet 1342 is discarded or recovered. The fluid entering the fluid inlet 1332 can continue to pass radially outward through a disc-shaped acceleration channel 1331, and then upwardly through a circularly placed inside the inner bowl chopper 1354. Roughly u-shaped fluid flow region 1332. The mouth-shaped fluid flow region 1332 forms a front chamber 1344, and the fluid flow passes through the edge before entering a main fluid flow chamber 1345 at the center of the inner container 1354. Chamber 1344. A gas at the top of the xj-type fluid flow zone 1332 42 200306611 Channel 1343 collects bubbles in the incoming fluid and guides the bubbles lightly: outwardly to the inner container 1 354 and the outer container 1353 rooms = zones. So 'for At the physical surface of the microelectronic U4: similar things, such as bubbles, in which they can negatively affect the chemical deposition process, are reduced. The fluid continues to advance downward through the _-type fluid flow zone 1332 to a high pressure Zone 1333 then passes through a diffuser 1335 to a nozzle assembly 1334. The nozzle assembly 1334 includes a plurality of positioned to direct the fluid into the main fluid flow chamber 1345 in a generally uniform manner. Flow to 1345 can be partially defined by a round of sidewalls 1 338, and the contoured sidewalls extend upwardly away from the nozzle assembly i 334. . The side wall 13 3 8 of the Hailun Temple is externally shaped to smoothly transform the flow leaving the nozzle assembly 1334 from being directed radially inward to being directed substantially axially. The profile side wall i338 can be either steep or smoothly transitioned to an inclined side wall 1339, which directs at least a portion of the fluid flow radially outward. The final velocity profile can produce a free surface that is initially dome shaped before the microelectronic workpiece 114 is brought into contact with the fluid. The advantage of this arrangement is that the microelectronic workpiece 114 can force any air between the free surface and the microelectronic workpiece 114 to radiate outward, which is less like the processing that would be formed on the microelectronic workpiece 114. Air bubbles at the surface. In an aspect of this embodiment, the inner container 1 354 includes a plurality of electrodes (shown in Fig. 13 as electrodes 1330a-e). For example, the electrode 1330 includes a center electrode 1330e positioned within the main fluid flow chamber 1 3 45. The center electrode 1330e can be positioned adjacent to a Cardelli flow path 1341 connected to the acceleration channel 43 200306611 1331. The fluid flow through the acceleration channel] [331 can draw fluid downwardly away from the center electrode 133o. And the air bubbles are removed from the surface of the center electrode 1330e. The flow through the Cardelli flow path can also control the uniformity of the flow upward through the main fluid flow chamber i 345 and can therefore control the uniformity of the flow hitting the central portion of the microelectronic workpiece 114. The inner container 1354 can further include a plurality of substantially ring-shaped electrodes (four are shown in FIG. 13 as i330a-d). If the microelectronic workpiece 114 is small and does not extend radially beyond the contoured side wall IMS, no electric power is required to be applied to the ring electrodes 133a-d. If the microelectronic workpiece 114 extends radially beyond the contoured side wall 1 338 or more, far ring electrodes 133Oa-d are applied with electricity to provide plating at the outer portion of the microelectronic workpiece 114. The power system applied to the ring electrode 1330ad can be the same in one embodiment. Alternatively, each ring electrode 1330a_d can depend on the initial characteristics of the microelectronic workpiece 114 and / or Depending on the results obtained by this electrochemical deposition process, different powers are received. The electrochemical deposition rate is also represented by the weir 1359 and the weir 1 359 can include a lateral portion 1358 extending radially inwardly over part or all of the annular electrode 1330a-d. The weir 1359 and the lateral portion 1358 can be easily removed from the remainder of the inner container 1354 to repair the extent to which the lateral portion 1358 protects the microelectronic workpiece 114. In other embodiments, the container assembly 1352 can have other arrangements that are not shown in the more detailed arrangements in FIG. 13 and another—the arrangements are included in 200306611 in International Application PCT / US00 / 10210, which was published in 2000. Application was made on April 13th and incorporated herein by reference. FIG. 14 is a schematic illustration of a multi-electrode container assembly 1452 according to another embodiment of the present invention. In one aspect of this embodiment, the multi-electrode container assembly 1452 includes an inner container 1454 that is annularly placed inwardly in an outer container 1453. A spiral drain pipe 1440 between the inner container 1454 and the outer container 1453 is capable of containing fluid overflowing the inner container 1454 and directing the fluid toward a fluid outlet in a manner substantially similar to that described above with reference to FIG. 13 1444. Fluid can pass through a primary fluid inlet 1432a and a secondary fluid inlet 1432b into the internal container 1454. The primary fluid inlet 1432a is coupled to a primary flow channel 1478 that can direct a portion of the fluid within the internal container 1454 to a primary flow guide 1475. The main flow guide 1475 includes a nozzle or orifice 1479 that can direct the flow toward the central axis of the inner container 454. The flow energy continues upward from the main flow guide 1475 toward the microelectronic workpiece 114. The auxiliary fluid inlet 1432 can be coupled to a dispenser 1470 that can direct the auxiliary fluid to a plurality of electrodes. In one aspect of this embodiment, the inner container 1454 includes four electrodes (disclosed in FIG. 14 as 143 ° d). In one aspect of this embodiment, the electrode 1430 can be housed in a field shaping unit 1476 having a corresponding electrode compartment 471 (disclosed as compartments 1471a-1471d) separated by a plurality of partitions 1472. The distributor 1470 can direct the auxiliary fluid into each compartment via a corresponding plurality of distributor channels 1470 (disclosed as distributed states 1470a-1470d). 45 200306611 Therefore, the auxiliary fluid can advance through the dispenser 1470, through the electrode 1430, and upwardly toward the microelectronic workpiece 4a. The field shaping unit 1476 has an effect on the electric field of the ㈣electrode 1430 as if the electrode M30 is located at the exit of each-partition 胄 1471, as shown by the virtual electrode positions 1480a-1480d. Each of the compartments 1471 has an orifice 1474, and the fluid and gas can pass through the orifice 1474. Therefore, the air bubbles trapped in each compartment 147 can be radiated outward through each of the compartments 147m. One embodiment of the container assembly 1452 shown in FIG. 14 is disclosed

Mouth 1474 until they leave the inner container 1454. In another aspect of this embodiment, each compartment 1471 includes an interface element 1477 (which can be eliminated in alternative embodiments). In an embodiment, the interface element 1477 can include a filter that is framed to capture air bubbles and other debris, but still allows the auxiliary fluid to pass through toward the microelectronic workpiece 4. In another embodiment, the interface element 1477 can include

/ U The ionic membrane of the electronic workpiece 114, but still prevents or substantially prevents the auxiliary fluid from passing through towards the microelectronic workpiece 114. Instead, the auxiliary fluid can pass through the orifice 1474 and leave the inner container 1454 through the spiral drainage pipe 1440. Alternatively, the ion membrane can allow the fluid and ions to pass through. In one embodiment where the main and auxiliary flow systems are separated, the main fluid (which contacts the microelectronic workpiece 14) may be a catholyte and the auxiliary fluid (which does not contact the microelectronic worker # 114) It can be a separate anolyte. One advantage of this arrangement is that it eliminates the additive at the anode and therefore requires supplementation of the additive as is often required in a conventional installation. This feature, combined with the viewpoint of the container assembly 1452, the virtual anode, reduces the "strengthening experiment." The demand for the anode is typically a requirement to ensure a consistent black film on the anode to provide a predictable current. Instead, the current distribution is controlled by the architecture of the field shaping unit 1476. In other embodiments, the container assembly 1452 can have other rows. Refer to the further detailed view of the embodiment described above with reference to FIG. 14 and Another arrangement is included in International Application No. PCT / xjSOO / lOKO, which was filed on April 13, 2000 and incorporated herein by reference, and the following U.S. patent applications, all of which are incorporated herein For reference: No. 09/872, 15 1 of Shen Yan on May 31, 2001 (No. 29 195.8158 US for agent case) 'No. 09/80, 4, 96 of the application dated March 12, 2001 (agent Case No. 29195.81 19US); No. 09 / 804,697 filed on March 12, 2001 (No. 29195.8120US for Agent Case); No. 09/875 '3 65 (No. 29195.8156US); May 4, 2001 No. 09/849, 505 of Shen Zhen (Agent Case Case No. 29195.81 57US1); No. 09 / 866,391 filed on May 24, 2001 (Agent Case No. 29195.8157US2); No. 09/866, 463 filed on May 24, 2001 (Agent Case No. 29195 8157US3) ); And No. 10 / 008,636 of Shenyang on September 5, 2001 (agent case No. 29195.8 172US). The non-electric processing station Figure 15 is used for the construction of a frame according to one of the embodiments of the present invention. A schematic cross-sectional view of a portion of a processing station 1 550 without electricity. In one aspect of this embodiment, the processing station 1550 can include one of a supply valve assembly 1580a having a frame structure capable of holding 200306611 nasal teeth. The container assembly 1552 of the electroless processing fluid processing portion 1554. A fluid heater 1583 (shown generally in FIG. 15) may be coupled in fluid communication with the supply valve assembly 1580a to heat the inlet container assembly 1552. In one embodiment, the fluid is heated to a temperature of about 50 C to 80 C (eg, electroless nickel or copper can be electroplated) and in other embodiments, the fluid can be heated to the other Temperature. In another embodiment, the currentless body can The treatment portion 1554 includes a weir 559, and the processing fluid overflowing the weir 1559 is poured into a peripherally extending overflow channel 154. The overflow channel 1540 is passed through an overflow conduit 1538 and Coupled to a waste valve assembly 15 80b to remove processing fluid from the processing station 1550. In one aspect of this embodiment, the supply valve assembly 1550a includes three supply valves 1581 (two of which can be seen in FIG. 15) to supply three different phases in different stages of operation of the processing station 1 50 Handle fluids. A drain valve 1582 is positioned under the supply valve 1581 to discharge the supply valve assembly 1580a more completely. The waste valve assembly 1580b can have an arrangement substantially similar to one of the supply valve assembly 1580a to return the different treatment fluid to a suitable retention tank (not shown in an embodiment, the treatment station 1550 includes an exhaust Catheter 1537 'is positioned to remove gas waste products when a holder 1560 (the outline of which is shown in Figure 15) carrying the microelectronic workpiece 114 is contained within the container assembly 1552. Here In one aspect of an embodiment, the bracket 1560 can be substantially similar to the bracket 116 ′ described above with reference to FIG. N, but does not need to include a contact assembly 1170 (FIG. 11). Therefore, the bracket 48 200306611 1560 can support the micro The electronic workpiece 114 is in contact with the electroless treatment fluid in the container assembly 1552. In the operation member, a heated or unheated electroless treatment fluid can be guided to the processing portion 1 μ4 through the delta water supply valve assembly 1580a. An electroless, wet chemical deposition process can occur at the interface between the microelectronic workpiece 114 and the processing fluid in the processing section 1554 to deposit a conductive material on the microelectronic workpiece 114. The electroless location Can be used to place a variety of conductive materials on the microelectronic workpiece 114, such as seed layer reinforcement and / or repair materials, overlays, or other conductive structures. Another option is to use the station 1550 month b Material is removed from §Hai Microelectronics Workpiece 114. For example, the electroless processing station 1550 or a station having a substantially similar architecture can be used to etch the material from the backside of the wafer. In another device, one from The two-direction guided flow toward one of the microelectronic workpieces 114 can be used to remove material from the microelectronic workpiece 114, as described in detail below with reference to Fig. 16. Removal stations Figures 16A-B are based on this The material removal station 1 650 of the embodiment of the invention is partially explained. The material removal station 1650 or, the stripping unit, can be a sealed chamber for processing, which can complete cleaning and stripping. , Oblique etching, rinsing, and drying operations. In one aspect of this embodiment, the station worker can be used to remove the seed layer material from the front or component side of the microelectronic workpiece 114. Alternatively, The station 1650 can be used from the microelectronics Any of the front / components of the piece 114 or the conductive material and / or the non-conductive material is removed from any of the meniscus / non-component side of the microelectronic workpiece 114. In any of the 2003 200306611 embodiments, the enclosure includes Different fluid flows that are directed to the opposite side of the microelectronic workpiece 丨 14 to control the amount of material removed from the microelectronic workpiece 丨 14 First please refer to FIG. 16A. The station 1650 includes a drive shaft 1663 A bracket 166 of a motor coupled to a rotor 662. The rotor 1662 can include an upper chamber element 670 and a lower chamber element 680. The upper chamber element 1670 is separated from the lower chamber element 1680 (for example, by borrowing The support 1660 is moved upward to allow the microelectronic workpiece 114 to be positioned between the two. The upper chamber element 670 can include an upper chamber wall 1671 'which may define an upper chamber 1672 positioned adjacent an upper surface 1620 of the wafer 114. The lower chamber element 168o can include a lower chamber wall 1681 'which may define a lower chamber 1682 positioned adjacent a lower surface 1621 of the microelectronic workpiece 114. In operation, a first fluid (shown generally by arrow F1) is introduced into the station through an injection nozzle 1684 (such as a multi-port injection nozzle) 650 'through the lower chamber entrance MU and into the lower portion Room 丨 682. A second fluid (shown generally by arrow F2) is introduced into the upper chamber 1 672 through an upper chamber inlet 1673. Referring now to FIG. 16B, the first fluid F1 can advance outward along the lower surface 1621 of the microelectronic workpiece 114, but at this time, the second fluid ^ 2 radiates outward when the microelectronic workpiece 114 rotates Aiming at the upper surface 1620. In one aspect of this embodiment, the upper chamber element 1 670 here includes an exit tube positioned lightly inwardly away from the outer edge 1622 of the microelectronic workpiece 114. Therefore, the first stream 50 200306611 was able to merge with the second fluid and advance through the outlet tube 1675 then 'forward around the periphery of the outer edge ... side. In-another example = can be blocked or moved, so the first flow ... no: J: 5 the upper surface of the microelectronic workpiece 114 1620 ea, Λ ^ some application orders may need to be from the lower surface —The engraving material 'Jen still prevents the rest of the engraving, except that it occurs in the peripheral area 1623, but not on the upper surface. Therefore, the first fluid? Can be selected to include the agent 'and the second fluid F2 & includes an inert gas such as deionized water. The removal of the material f from this peripheral area 1623—the advantage is that it will reduce problems like film flakes and contamination that may occur during subsequent processing of the microelectronic workpiece 114. A more detailed view of m50 is described in the International Application No. PCT / US99 / 〇5676, which was filed on March 15, 1999 and is incorporated herein by reference. Spraying Station FIG. 17 is a schematic outline view of a part of a spraying station 1750 which sprays one or more more selected fluids onto a microelectronic workpiece m according to an embodiment of the present invention, and cuts out an isometric view. In one aspect of this embodiment, the fluid can strip and etch the layer from the microelectronic workpiece 114. For example, oxides, polycrystallites, nitrides, metals, stupid crystals, and other materials can be stripped using etch techniques. In other embodiments, the spraying station can perform other functions, such as cleaning, rinsing, and / or drying the microelectronic workpiece 114 after being etched, or after other processing stages. In the " ^ embodiment, the spraying station 17 5 0 includes a container 17 5 2 and a 51 200306611 support 1760. The bracket 1760 can include a rotor 1762 having a bracket finger 1763 that movably carries the microelectronic workpiece 114. The rotor 1762 can be faced to a rotor 1761 which can rotate the microelectronic workpiece 114 in the container 17 5 2. In a further aspect of this embodiment, the container 1 752 includes a spray nozzle stop 1770 having a plurality of main spray nozzles 1771. In one aspect of this embodiment, the spray nozzle bar 1770 can have a cross-shaped arrangement containing a plurality of main spray nozzles 1771 on each arm of the cross. In other embodiments, the spray nozzle holder 1 770 can have other arrangements. In any of these embodiments, the sprinkler nozzle 1 770 can be coupled to the integrated inlet 1732 to apply fluid to the main sprinkler nozzle 1771. Therefore, the main spray nozzle 1771 can guide the fluid upward toward the microelectronic workpiece 114 when the microelectronic workpiece 114 rotates. A drain pipe 1 744 can collect used fluid for removal from the container 1752. In another aspect of this embodiment, the container 1 752 can further include a side spray nozzle 1772 positioned around the periphery of the container 1752. The side spray nozzle 1772 can be framed so that the microelectronic workpiece 114 can be rinsed after the main spray nozzle 1771 has been actuated, for example, after the microelectronic workpiece 114 has been de-rinsed. The side spray nozzle 1772 can also be coupled to a gas source, for example, an inert gas source to dry the rinsed microelectronic workpiece. Heat Treatment Station FIG. 18 is a schematic side view of a portion of an apparatus 1 800 for heat treating a microelectronic workpiece 114 according to an embodiment of the present invention. In one aspect of this embodiment, the apparatus 1800 includes two heat treatment chambers ^ 03 (there are disclosed 52 200306611 upper chamber 1803a and lower chamber 1803b), which are supported by the apparatus bracket 802. Each chamber 1803 has a base 1 8 1 0 fixed to the bracket 1802 and movable toward and away from the base 1810 to open and close the lip 1820 of the chamber 1803. The workpiece 114 can be supported on a plurality of workpiece holders 1 870 in the chamber 1803. In one aspect of this embodiment, the device 1800 can fire a selected material (such as copper or another metal) of the workpiece 114. Alternatively, the device 1800 can perform other high-temperature treatments, such as reflow of solder on the workpiece 114, hardening or baking the photoresist on the workpiece 114, and / or other benefits from a high temperature And / or require a high temperature treatment. The device 1800 is also capable of cooling the workpiece n4, as explained in more detail below. When the device 1 800 heats and cools the workpiece 114, the support 1 870 can first lower the workpiece 114 into contact with a heating source 1840 during a heating phase of the process. Then, during a cooling phase of the process, a first heating tank 1 86 can rise to engage an opposing surface of the heating source 1 840 to cool both the heating source 1 84 and the workpiece 114. After the cooling stage, the first heating tank 1860 can be lowered to join a second heating tank 1850, wherein the first heating tank I860 is cooled to prepare for another cycle. The lip 1820 can then move away from the base 1810 and the workpiece 114 can be removed. In one aspect of this embodiment, the heating source 1840 may be a resistive film or thick heater positioned between the workpiece 114 and the first heating tank I860, and positioned with the first heating tank Under the heating source 1840. The heating source 184o includes a vacuum orifice 1 84 1 coupled to a working source (not shown) to pull the microelectronics 53 200306611 when heated. The workpiece 114 enters the tightly connected heating source 184o. For example, the heating source 1840 can be supported relative to the base 1810 with a plurality of heating source supports 1844, and at least one of the heating source supports 1844 includes a vacuum channel in fluid communication with the vacuum port 1 841.

The lip 1820 of each chamber 1803 can be coupled to a lip actuator and moved down to an closed position in an open position (shown in FIG. 18). The upper lip-actuated stomach 1821 of the upper chamber is attached to the lid 1830, and the lip actuator Mn of the lower chamber 1803b is attached to the base 1810 of the upper chamber 18G3a. In an embodiment, each lip actuator can include a ring-shaped, air-actuated bellows that can move the lip 1820 when inflated. When the air pressure in the bellows is released, a spring (not shown) can return the lip 1820 to the open (upper) position. When the lip 182G is in the closed position ', the lip 182 () and the base define-a volume of the chamber 1810 surrounding the microelectronic workpiece 114. The lip 1820 includes a cleaning fluid material 1822, which can send a cleaning fluid (such as nitrogen) to the volume of the chamber during processing. The first heating tank i860 may be coupled to a heating tank actuator 1861 'and the heating tank actuator may move the first heating tank upward to engage the heating source 1840. In one embodiment, the heating tank actuator U61 includes an air-driven bellows substantially similar to the lip actuator ΐ82m described above. Alternatively, the heating tank actuator Gu Neng has other structures that can move the first heating # 186G upward to engage the heating source 1840 and move to the ground away from the structure that engages the heating source and drain. In a further point of view of this embodiment, the first heating tank _ package 54 200306611 includes a vacuum supply path 862 connected to a vacuum source (not shown). The vacuum supply path 1862 is coupled to one or more radiating vacuum channels in one of the upper surfaces of the first heating tank 1860 so that when the heating source, the circle, and the first heating tank I860 are to be connected to each other, The first heating tank is pulled in by ⑼ and comes into close contact with the heating source 1840. The upper surface of one of the first heating tanks 1860 can include a compressible, thermally conductive pad to provide a tight thermal connection with the heating source 1840 when the first heating tank I860 is in its raised position.

touch. In another aspect of this embodiment, the lower surface of the first heating tank can include a compressible, shrinkable, thermally conductive pad to provide intimate thermal contact with the second heating tank 1850. In the embodiment, the first heating tank 186G does not have an active cooling element. Instead, the second heating tank 1850 can be actively cooled and can cool the first heating tank 186 when the first heating tank 1860 is disconnected from the heating source 1840 and connected to the second heating tank 1850. 〇, therefore, the first

The heating t 185G can include a cooling fluid supply and a cooling channel 1854 returning a cock (not shown). In other cases, the device has other arrangements. For example, the 800 includes a simpler hot plate device for applications where temperature and environment require such precise control. In other embodiments, the device is a heat source rather than a resistive heater with power applied. The sweat system of another embodiment is disclosed in U.S. Patent Application No. 09 / 733,608 (Nominee Case No. 29195.8U4US), which was declared on December 8th, 2012 and is incorporated herein by reference. Station combination and processing 55 200306611 The Pei 100 described above with reference to FIGS. 1-8 can include various combinations of processing stations, such as those described above with reference to FIGS. 9-18 to complete the microelectronic workpiece 114 Various functions. In one aspect of this embodiment, the edge device 100 can include a plurality of stations, all of which have substantially the same architecture and all of them can perform approximately the same functions. For example, the apparatus 100 can include a material-only removal station substantially similar to that described above with reference to FIG. 16A_B, or a heat-treatment only station substantially similar to that described above with reference to FIG. 18, or substantially similar to the reference drawing Deposition stations above 14 for metal or electrophoretic resist deposition only. In other embodiments, the device 100 can include more than one type of station to

Complete different functions on the microelectronic workpiece 114 in the same device 100. For example, in one embodiment, the device 1001 includes a metrology station, a material application station'-a material removal station ', a spray station, and an annealing station. In other embodiments, the equipment 4 100 @ includes a subgroup of these stations. For example :, In a specific embodiment, the device includes a

The above-mentioned multi-anode material application station is used for electroplating welding to the microelectronic workpiece 114. The device also includes a spraying station substantially similar to that described above with reference to FIG. 17 to process the electronic electronics 114 after the microelectronic workpiece I " comes out of the multi-anode application station. In one aspect of this embodiment, the device can include a pre-aligner, and the quilt frame constitutes a microelectronic workpiece 114 (such as a 6 忖 or 1M) wafer). A more detailed description of suitable pre-alignment benefits is included in US Patent No. 6, 498, which is incorporated by reference in its entirety. 56 200306611 'In the example, the device 100 can include a station combination. For example, = to go to a specific embodiment, this ... ... including the reference figure. The microelectronic workpiece 114 is used to strengthen and / or repair the seed layer. The device 100 can further include a material removal station substantially similar to the one described above with reference to FIG. 丨, and a multi-anode station substantially similar to the one described above with reference to FIG. A blanket material to the micro-workpiece 114, and a substantially similar to that described above with reference to FIG. 18

The cover layer of the microelectronic workpiece m: stands to anneal and is applied to the Luli further embodiment, the device 100 can be framed to form an electrophoretic resist that can be processed on the electronic workpiece 1] 4 μ . For example, the apparatus 100 includes a multi-anode station similar to that described above with reference to FIG. ^ ^ ^ ^ ^ 4 for depositing the electrophoretic resist, and one. In one aspect of this example, the post-treatment of the electrophoretic resist Yufu Kao 2 baking room can have a structure substantially similar to that described above with reference to FIG. 18, and in addition, the baking room system Simpler and more ancient heart, from ^ r

One has a structure similar to that of a hot plate to enhance the accuracy of the microelectronic workpiece 114 from 5 to about 2 Ut. The device can further include a reference similar to FIG. 17 for further processing. The spray station of the above mentioned in any of the foregoing embodiments, 'the microelectronic workpiece may be automatically entered and / or away from the processing station in a leap second in a manual mode, as described above with reference to 1-5 . ^ Above two: Some microelectronic workers # 114 can be automatically moved into and / or away from the selected processing station, but at this time, other tail workpiece 114 can be automatically moved 57 200306611 into the processing station. Alternatively, the device can be dedicated to manual operation and automatic operation in another way. In any of these embodiments, the device 100 can provide a variety of platforms for one test, experiment, or demonstration process, and different processes in two production settings. The operation and characteristics of the conveying device and the conveying device for processing microelectronic workpieces are best understood by knowing the environment and equipment that can be used. Because of this, some embodiments of the processing device in which the transfer device can be used will be described with reference to FIG. ^, And details and features of some embodiments of the special delivery device will be described with reference to FIGS. 20A-26. Selection of Microelectronic Workpiece Handling Device for Automatic Workpiece Conveying Device

FIG. 19 is an isometric view of a processing device 1900 having a workpiece processing * 1930 according to one embodiment of the present invention, and the processing device is used to operate a plurality of microelectronic workpieces 901. In some embodiments, workpiece processing devices similar to those described herein are incorporated into other processing locations, such as the device 100 described above with reference to FIG. 8. The part of the process that was revealed in the selection is cut-away view & to illustrate the selected internal parts. In one aspect of this embodiment, the controller can include a cabinet 1902 with an internal area 1910 that defines a housing, and the exterior is at least partially isolated from an external area 1905. The cabinet 1902 also includes a plurality of orifices 1906, and the workpiece ΐ900 is borrowed through the orifice 1906 to enter and exit between the inner area 1904 and a loading / unloading unit 1910. 58 200306611 The loading / unloading station 1910 can have two container holders 1912, each of which is housed in a protective cover 1913. The container holder 1912 is structured to position the workpiece container 1914 relative to the opening 1906 in the cabinet 19202. The workpiece containers 1914 can each accommodate a plurality of microelectronic workpieces 1 90 1 in a 'mini' clean environment for carrying a plurality of microelectronic workpieces through other environments that do not meet the standards of a clean room. Each workpiece container 1 914 is toothed through the opening 1906 to access the inner area 1904 of the cabinet 1902. The processing device 1900 can also be included in the interior of the cabinet 920 A plurality of processing stations 1920 and a transfer device 1930 in zone 1904. The processing device, for example, can be a plating tool, and the processing station 1920 can be used for electroplating, electroless plating, annealing, cleaning, etching, And / or single wafer chamber for metrology analysis. A suitable processing station 1920 for use in the processing device 1900 is disclosed in U.S. Patent Nos. 228,232 and 6,080,691, and is patented in the U.S. No. 09/385, 784; 09/386 ^ 803; 09/386 ^ 610; 09/386 ^ 197; 09/501. 〇〇2; 09/733 '608; 09/804, 696; A 09 / 804,697, all of which are incorporated by reference for their integrity. The processing station 192G is not limited to electrical mining equipment, and therefore the processing equipment 1900 can be other types of tools. For example, in one embodiment, the The processing station Satoshi is framed to apply a photoresist material to the microelectronic workpiece 1 901. The transfer device 1930 is between the Mobile microelectronics guard between the container 1914 and the processing station 1920. The conveying device 193 () includes a line f shengdao 1 932 ', which is along the inner area 59 200306611 between the processing station j 920 It extends in the length direction. In a specific embodiment disclosed in FIG. 19, a first group of processing stations 1920 is arranged along a first column Ri_R and a second group of processing stations 1920 is arranged. Along a second column R2_i. The linear orbit 1932 extends between the first column and the second column of the processing station 1920. The transfer device 1930 further includes a #automaton carried by the execution channel. State unit 1934. As explained in more detail below, the combination of the linear transmission device 1930 and the processing station 1920 device can provide a good microelectronic workpiece production rate and eliminate workpieces that are carried by the automatic machine unit 1934. An example of a conveying device for processing microelectronic workpieces in a processing machine. Fig. 20A illustrates an embodiment of the automatic machine unit i934 in more detail. The automatic machine unit 1934 includes a conveying unit 2010, a Carried by the transport unit 2010 The arm assembly 2030, and the first and second terminal controllers 2050 carried by the arm group = 2030 (each of which is identified by reference numbers 2050a and 2050b). The conveying unit 2 〇10 can include a shield or cover 2012 having a plurality of plates attached to an inner frame ("out of the head 20A"). An opening 2014 in a top plate of the cover 2012 is to receive a part of the arm assembly 2030. I should note that the conveying unit 20 单元 and the cover 2012 have many different architectures according to the specific embodiment in which the automatic machine unit 1934 is used. The conveying unit 2010 may be, for example, a fixed 'rotary type' or a non-linearly moving base. The transmission unit 2010 can also include a guide member which is constructed to be movable laterally along the execution path 1932. A specific embodiment of the transport unit 2010 disclosed in FIG. 20a includes a guiding force 2 60 200306611 defined by a base plate 2016 and the base plate 2016 slides the automatic machine unit 1934 Coupling to 1932, 5th Avenue. The robotic unit 1934 can therefore be translated (arrow τ) along the lane 1932 to locate the robotic unit 1934 adjacent to a desired processing station 1920 (Figure 19). The arm assembly 2030 can include a waist element 2032 coupled to a lifting assembly (not shown in FIG. 20A). The arm assembly 2030 can also include an arm 2034 having a middle section 2035, a first extension 2036a protruding from one side of the middle section 2035, and a second extension 2036b protruding from the other side of the middle section 2035. The first and second extensions 2036a and 2036b of the arm 2034 can be placed opposite each other as shown in FIG. 20a, or they can extend to each other at a desired angle. In one embodiment, the first and second extensions 2036a and 2036b are integrated with each other, but in another embodiment, the first and second extensions 2036a and 2036b may be separate parts fixed to each other. . In yet another embodiment, the arm 2034 can include a single extension, as described in more detail with reference to Figures 20B, 25, and 26. The arm assembly 2030 can be moved along a lifting path l-L to change the height of the arm 2034 to position the terminal controller 2050 at a desired degree. The lifting path L-L extends approximately laterally to the holding road 1932, and the extension used herein includes an inclined or vertical arrangement. The arm assembly 2030 can also rotate (arrow Ri) around the lifting path LL to locate a distal end 2038a of the first extension 2036a and / or a distal end 2038b of the second extension 2036b adjacent to a desired Workpiece container 1914 or processing station 1920. The first brother and the first extension 2036a-b are roughly like a single unit. 61 200306611 The lifting path L-L rotates because they are integrated or fixed to each other. In this example, the movements of the first and second extensions 2036a-b are therefore interdependent. In another example, the arms 2034 can have extensions that are not fixed and move independently of each other. Selected embodiments for moving the arm assembly 2030 along the lifting path l_l and other components for rotating the arm 2034 about the lifting path L-L are described in more detail below with reference to FIGS. 22 and 23. The terminal controller 2050 is rotatably carried by the arm 2034. In one embodiment, the first terminal controller 2050a is rotatably coupled to the first tip end 2038a to rotate about a first rotation axis ArAi (arrow r2). The second terminal controller 2050b is rotatably coupled to the second distal end 203 8b to rotate about a second rotation axis VIII-2-8 (arrow R3). The first and first rotation axes and A2_A2 can be substantially parallel to the lifting path, but in another embodiment, the axes extend laterally to the lifting path l_l. The first and second terminal controllers 2050a and 2050b can each include a workpiece holder 2052 for holding the workpiece 1901 to the terminal controller 2050. The workpiece holder 2052 disclosed in FIG. 20A is a vacuum chuck, which can hold the workpiece 1901 to the terminal controller 2005 using suction. Another embodiment of the workpiece holder 2052 includes an edge clamp terminal controller, such as those disclosed in the aforementioned patent application, which has been incorporated by reference. As described in more detail with reference to Figs. 21A-21C, (a) an arm rotating around the lifting path, and (b) around a first rotation axis A. The rotating motion of the first terminal controller 2050a, (c) around a second rotation axis a ", the rotating second terminal controller 2050b, etc. are coordinated, so the first and 62 200306611 second terminal controls 2050a and 2050b can each be positioned adjacent to any workpiece container 1914 and adjacent to any one of the cabinets 19G2 (Figure 19)-side = station. The first terminal controller 2050a can be separated 2034-the first-distance Di 'away from the arm and the second terminal controller 20 can be separated from the arm 2034-the second distance d2. As shown in the embodiment of FIG. 20a, the distance D This is because the distance between the first terminal controller is different from that of the second terminal controller 2_. The first terminal controller 2050a can therefore pass through the -th-plane when it rotates around the first rotation axis, and the second terminal controller 2g enters 2_ \ when it rotates around the second rotation axis. It can move through a second plane when rotating. The first and second planes are substantially parallel and fixedly spaced apart from each other so that the terminal controller 2050 'port 2050b does not interfere with each other. However, the first and second planes can have other arrangements (ie, non-planar), as long as They do not interfere in the area above the arm. The first and second terminal controllers 2050a and 2050b can be fixed at a specific height relative to the hand f 2034 using spacers or other types of devices. For example, ㈣―terminal㈣❹ 2050a can be separated from the arm 2 state by the first spacer 2 () 54a 'and the second terminal control 11 2 嶋 can be separated by the second spacer 2054b The first and second spacers 2054a_b can have different thicknesses to open the terminal to control the stomach 2⑮ from the hand f 2034 at a desired distance. The first and second terminal controllers 2050a_b and The arm "M can have a different architecture than that disclosed in Fig. 20A. For example, as shown in FIG. 20B, the arm can have only a single extension 2036 from the waist element 2032 convex 63 200306611 and both the terminal controller 2050a_b can be, Extend, carry so that the first and second terminal controllers 2050a_b are fixed at different heights relative to the hand f 2G34. The terminal controller 2050a_b, for example, can be coupled to the end 2038 of the arm and rotate about a common rotation axis A_A. Having a single-extended other-more detail of the arm is described below with reference to Figs. 21A-21C illustrate one of the devices of processing station 1920 and several more detailed architectures for operating the transmitting device 1930. The processing station 1920 includes a single type of any combination or single wafer unit, which includes (a) a cleaning / etching chamber 1920a, such as CapsuleTM manufactured by the company Semit001; ⑻ an electroless plating chamber 1920b; (c) plating Chamber 192c; (d) Rapid Annealing (RTA) chamber 192 (M; (e) metrology station (not disclosed in FIG. 21A); and / or other types of single wafer processing station. 2 丨 A In a specific embodiment, the first row of the processing station 1920 & includes a plurality of cleaning / etching chambers 192a adjacent to the loading / unloading station 1910, one in the cleaning / etching chamber 192 〇a downstream electroless plating room 1920b, and a plurality of electroplating rooms 1920c downstream of the electroless plating room 1920b. Except for an RTA room 192 () is located on the output side of the loading / unloading station 1910 and in the medium Between the cleaning / etching and sealing chamber 1920a and the plating chamber 1920c, there is no non-electrical chamber. The second row of the processing station 1920 of this particular embodiment & has a similar device. The processing station in FIG. 21A is illustrated Arrangement is only one example of how the processing station 1920 can be arranged in the cabinet 1 902. In the other In the embodiment, 'a measuring station can replace one more other processing station, the processing station relative to 64 200306611; the position of the insertion / unloading station 丨 9 丨 〇 can be changed, and / or other types of processing stations can be used to Some processing stations illustrated in FIG. 21A may not be included in the processing equipment f. For example, the position of the cleaning / money seal to 1920a and the plating room 192 () c can be exchanged, or another Plating to 1920c This replaces the electroless plating chamber 1920b and rta chamber. Figure 21A illustrates one of the transfer devices 1930 after the first workpiece 19u has been loaded on the first terminal controller 2050a. The operation of the second terminal controller 2050a can be similar to the operation of the second terminal controller 2050b. Therefore, for the purpose of simplification, only the movement of the second terminal mode 2050b is described below. The The robot unit 1934 can move the arm assembly 2030 (Fig. 20A), so the second terminal controller 2050b can pick up a second workpiece i9oib from a workpiece container 1914. To do this, the automatic The machine unit 1934 locates the first work piece 201 One of the conveying positions above the path LL, and then the arm, the workpiece 2030 (FIG. 20A) moves vertically until the second terminal controller 2050b is tied at a required height to pass the second workpiece i9〇ib. Bottom. The arm assembly 2030 then rotates the first extension 2036b around the lifting path L_L (Fig. 20A), and / or the second terminal controller 2050b around the second square rotation axis A ^ A2 (Fig. 20A) Rotate until the second terminal controller 2050b is positioned under the second work piece 1901b. When a vacuum system is evacuated through the workpiece holder 2052 (Fig. 20A) to hold the second workpiece 190113 to the second terminal controller 2050b firmly, the arm assembly 2030 can then be raised. The automatic machine unit 1934 can then move along the execution path 1932 by the automatic machine unit H34, and the second extension 203 is rotated around the lift 65 200306611 path LL and / or the second terminal controller 2050b A combination of rotations about the second rotation axis A ^ A2 is withdrawn from the workpiece container 191-4-the second workpiece 1901b. The remaining workpieces in the workpiece container 1914 can be loaded into the terminal in a similar manner by further adjusting the height of one of the workpiece container 1914 and / or the arm assembly 2030 (Figure 20A). On the controller 2050, or these workpieces can be unloaded into other workpiece containers 1914 through the reverse process. In general, moving the arm assembly to the correct height is more necessary than moving the workpiece container, which eliminates the need to guide all the workpieces at a time. After picking up the workpieces 1901, the conveyor 1930 can load or unload the workpieces 1901 that are carried by the robotic unit 1934 in the first row R! Or the second row R in any processing station 1920. The workpiece flow through the processing station 1920 is changed according to the specific application and use of the processing device 9000. In one embodiment, the transfer device 93 can limit one of the terminal controllers to process only clean workpieces and the other terminal controllers to process only dirty workpieces. The cleaning terminal controller can be used to process a workpiece in a workpiece container and remove the workpiece from the cleaning / etching chamber 1920a. The dirty terminal controller can be used to remove workpieces from the plating chambers 1920b and 1920c and then enter the workpieces into the cleaning / etching chamber 1 920a. A process flow for electroplating copper or other materials onto one of the second workpieces of 190 lbs involves placing the second workpiece 1901b not in (a) if the seed layer needs to be strengthened, the electroless plating chamber 1920b is One of (b) 1920c electric mines. After the workpiece 19oib is plated, the transfer device 1930 extracts the workpiece 1911 from the corresponding plating chamber i92oc and typically puts it into a cleaning / etching chamber 1920a. The second workpiece i9oib can then be withdrawn from the cleaning / etching chamber 1920a and placed into other workpiece containers 1914 ("out-wiP,") for finished workpieces. It should be noted that this processing flow system There is only one example of possible flow, and the movement of the workpiece through the processing station is based on the specific structure of the processing device and the processing completed on the workpiece. For example, the workpiece 1901b is in the cleaning / etching chamber 1920a Before being placed in the out-WIP ", it can be transferred to the rapid annealing chamber 1920 (J. Fig. 21B illustrates another structure for operating the transfer device 1930, wherein the workpiece 1901 ab is positioned to move along the track 1932. The second workpiece 1901b is formed by rotating the first terminal controller 20050a around the first rotation axis and rotating the second terminal controller 2050b around the second rotation axis AγΑ2. Until the two terminal controllers are tied above the arm and overlapped above the first workpiece 19a. The arm 2034 also rotates around the lifting path LL, so the arm 2034 and the first and second extensions 2036a-b extends approximately along the direction 1932 The robotic unit 1934 can then be translated along the track 1932 between processing stations. The architecture disclosed in Figure 21B is particularly useful for 300mm wafers to reduce the overall width of the processing device 1900. It will be The minimum floor space occupied by the processing device is required, but many designs for 300mm wafers tend to be larger than the area occupied by 200mm wafers. The area between the processing stations must be able to accommodate larger wafers. By overlapping the workpieces to transport along this track 1932, the open area for transporting the workpieces between the processing station rows is reduced to a large about single-workpiece In addition, the same architecture can be used to process 67 200306611 200mm wafers so that the area of floor space occupied by 300mm wafers, if any, will not be much larger than one 2 〇〇mm wafer tool. After the workpieces 1901a-b are overlapped for moving along the track 1932, the automatic machine unit 1934 can move along the track to a required processing station and the arm assembly 2 〇3〇 Can go along The lifting path moves vertically to position the workpiece at a desired height. Fig. 21C illustrates another structure for operating the transfer device 1930, wherein the automatic machine unit 1934 is loading the second workpiece 19ob 'into the plating room 1920c. The automatic machine unit 1934 slides along the track 1932 until the second extension 203 of the arm 2034 (Figure 21B) is adjacent to the required power station 1920. The arm My then goes around the The lifting path B1 is rotated and the second terminal controller 2500b is rotated around the second rotation axis 8 2_ A2 until the second workpiece 1901 is positioned above one of the inversion heads of the plating station. The automatic machine sheet & 1934 can therefore position each terminal controller 2050a and 2050b on the required side of the cabinet 1902 and at a desired height, so the terminal controllers 2050a and 2〇 50b can pick up any processing station 1920 with the first column R, or the second column &. The 1 request can therefore provide a single-arm and dual-terminal controller, which can be: any workpiece container 1914 and, or a processing station in the cabinet 19202, several embodiments of the transfer device 1930 are It is anticipated that collisions with the workpiece 1901 without complex software calculations or complex mechanical systems are one aspect of these embodiments of the mechanical transfer device 1930 in that they have only two, one arm, and a terminal controller coupled to the arm, Single Ang Terminal Control 68 200306611

The controller is operated on the -th plane and the second terminal controller is operated on a second plane that does not intersect the first plane above the arm. The first and second terminal controllers can be mechanically separated from each other by rotatable spacers to operate in different planes, and the rotatable spacers can separate the first and f second terminal controllers from the arm as the first and second, respectively. The second distance, regardless of the height of the arm itself. The terminal controllers are arranged so that they can rotate freely with respect to the arm, but the workpieces cannot collide with each other. Therefore, this embodiment, which has a #arm transfer device coupled to the terminal controller 193, is expected to reduce collisions between workpieces. Because the terminal controller has a large degree of freedom of movement, several embodiments of the transmission device 1930 are also diversified and used in many different tools. HI transmission device 193G-of the embodiment-the point is that the arm can Translate along the road through the machine, move laterally along a lifting path to change the height of the terminal control H, and rotate around the lifting path. This allows the arm to locate the multiple positions and heights of the terminal controller within the tool. Therefore, the number of processing stations served by a tool

Species: isotypes and arrangements. Another aspect is that the terminal controllers can be placed on opposite ends of the arm, and they can rotate the arm individually. This allows each terminal controller to serve any processing station within the tool. Therefore, several embodiments of the transfer device 1930 can provide a terminal controller with two independent operations within a single automatic machine as early as 70 without the need for complex mechanical parts and software including two separate automatic machine units . Many embodiments of the transfer device 1930 also provide high throughput of a finished wafer. Production volume of one of the machines used to make microelectronic components 69 200306611

Models are measured at w / hr / ft2 processed through the machine. To provide a high throughput perspective, the linear orbit allows the number of processing stations to be arranged in rows and rows that are served by a single automated machine. The processing station and the linear arrangement of the linear path can greatly reduce the floor space required for each processing station compared to the use of a rotating automatic machine system. Even with an overlapping arrangement to transport the workpiece along the lane, the distance between the processing stations can be reduced to approximately a single wafer diameter. This is particularly useful in 300mm applications, as carrying these parts side by side and side by side would require a significant increase in the footprint of the processing tool. Another view that provides a high throughput is that the single-arm, dual-terminal controller automatic machine can quickly get all, or at least most of the processing stations in the tool, because (a) it does not require With a complex collision avoidance algorithm that will slow processing time, and () 3) it can use a high speed motor for a high operating rate. Quick maintenance, multiple automatic machine units and

The combination of arrangements that provide an effective footprint can thus provide a high throughput (w / hr / ft2) for one of the several embodiments of the processing device 100. Fig. 22 illustrates a more detailed embodiment of the automatic machine unit 1934. In this particular embodiment, the conveying unit 2010 and the arm assembly 2030 can be operated in a manner similar to that described with reference to Figure 9.2: above, and thus similar reference numbers represent similar elements in heading 19-22. The automatic machine sheet it 1934 includes a lifter 2212, a lifter 2214 ', and a lifter assembly 2210 that is lightly closed to a lifter platform 2216 of the lifter 2214. The lifting actuator 2212 can be a servo motor, a linear actuator, or another suitable device that can provide precise 70 * 200306611 control of rotary or linear motion. In the embodiment disclosed in FIG. 22, the lifting actuator 2212 may be a servo motor having a driving shaft 2218, and the driving wheel 2219 is attached to the driving shaft 2218. The lifting element 2214 in this embodiment has a ball spiral or a lead spiral which is firmly fixed to a passive wheel 2220. The lifting assembly 2210 also includes a guide, such as a guide rail 2214a. The output from the lifting actuator 2212 is coupled to the driven wheel 2220 via a belt 2222 and the driven wheel 2220 surrounding the driving wheel 2219. The lifting assembly 2210 can further include a nut 2224, and the nut 2224 is threadedly coupled to the lead screw lifting element 2214 and fixed to the lifting platform 2216. The lifting assembly 2210 is operated by applying power to the lifting actuator 22 i 2 to rotate the driving wheel 2219 and generate corresponding rotation of the lead screw lifting element 2214 to raise / lower the lifting platform 2216. The nut 2224 moves vertically according to the rotation of the lifting element 2214 to raise / lower the lifting platform 2216 for adjusting the heights of the first and second terminal controllers 205 0a and 205 0b. It should be noted that the stroke length of the nut 2224 can define the degree of the lifting movement of the arm assembly 2030. In addition, when the nut 2224 is positioned at the lower end of the lifting element 2214, the lifting actuator 2212 is received in a cavity 222 ^ 6 in the lifting platform 2216. Because the lifting actuator 2212 can be positioned directly under the two or two platform 2216, the cavity 22% allows the size of the automatic machine unit 1934 to be tighter and the length of the lifting stroke to be larger. It should be noted that other embodiments of the lifting assembly can be used to raise and lower the arm assembly 2030. For example, 70 pieces of J & H lifting can be a scissors lifting assembly driven by a servo motor 71 200306611, or the driving shaft of the lifting actuator 22 丨 2 can be the lead screw lifting element 2214 to eliminate the wheel and belt of the embodiment of FIG.

The arm assembly 2030 is carried by the lifting assembly 221 () to move along the lifting path L-L. In the embodiment disclosed in FIG. 22, the arm assembly 2030 includes a base 2230 carried by the lifting platform 2216 and a waist motor 2232 carried by the base 2230. The waist element 2032 is coupled to an output shaft 2236 of the waist motor 2232 through a bushing 2237. The waist motor 2232 is fixedly attached to the bushing 2237 so that the rotation of the bushing 2237 can rotate the waist element 2032. A bearing 224 between the bushing 2237 and the edge 2238 allows the waist motor 2232 to rotate the bushing 2237 and rotate the waist member 2032 via the output of the drive shaft 2237.

The arm assembly 2030 can further include a first controller driver 2242 & and a second controller driver b which is carried in the waist element cavity-cavity. The first controller drive 22 'has an output shaft' coupled to a drive wheel, and the drive train is coupled to a driven wheel 2245a by a belt 22-. The second controller driver can be operatively consumed to the second terminal controller 2050b by a similar arrangement. The second controller driving 2242b can, for example, have an output shaft 'connected to a driving wheel 22441 and the driving wheel 2244b is coupled to a passive wheel 2245a by a belt 22 働. In the embodiment disclosed in FIG. 22, the first and second controller drives 2242a * 2242b are-servo motors. The other part of the horn assembly 2030 is in the mountains. However, it is possible to use a dynamic or other type of actuator that accommodates the number 72 200306611 # to operate the terminal controller 205 0a and 2050b. For example, the controller drive 2242 can be a servo motor with a screw gear and its output shaft, and the passive ㉟2245 can be replaced by a gear that is sprayed with the screw gear. The rotation of the screw gear will therefore rotate the terminal control around the rotation axis. The operation of the Hai arm assembly 2030 is by (a) rotating the waist element 2032 and the arm 2034 around the lifting path LL, and (... respectively rotating the first and second terminal controllers 2050a and 2050b rotates around the first and second square rotation axes A, -Α! And A ^ Α2. The waist motor 2232 rotates the waist element 2032 and the arm 2034 around the lifting path lL to position the arm The first and second extensions 2036a and 203 of 2034 are at a desired position relative to the work piece maker 1920 (Fig. 19) and / or the processing station 1920 (Fig. 19). 4First control The driver 2242a rotates the first terminal controller around the first rotation axis A ^ A, and the second controller drives 2242b to rotate the second terminal controller 2050b around the second rotation axis a2-A2. The controller drives 2242a- b is to operate and operate the waist motor 2232 independently of each other, so the terminal controllers 2050a and 2050b can move with the arm 2034 in a compound motion. This movement can thus translate ehai roughly along any desired path Workpiece 1901. Therefore, the waist motor 2232 and the controller drives 2242a and 2242b can be operated in parallel or in series. Operate to provide the required motion of the terminal controller 2500. The 30A automatic machine unit 1934 also includes a plurality of amplifiers to operate the motor carried by the automatic machine unit 1934. In this embodiment, the amplifier can Includes four servo amplifiers 2250 (identified by reference number 225 ° d 73200306611). The magnified state 2250 operates the lifting actuator 2212, the waist motor 2232, and the controller drive 2242a_b. In addition, the conveying unit By includes a servo amplifier 2252 for an orbital motor (not shown), and the orbital motor moves the conveying unit 2010 (FIG. 19) along the lane 1932. The amplifiers 2250 and 2252 are provided by a The disturbance circuit board (not shown in FIG. 22) carried by the conveying unit 2010 is controlled so that many electric wires and electronic circuits for the automatic machine unit 1934 are partially used by the conveying unit 2010. Carry. Some internal wires for the waist motor 2232 and controller drive 2242a_b are carried in a vocal cable track 2254 that moves vertically with the lifting platform 22 丨 6. This reduces the number of passes through the processing device 1900 Number of long wires. Figure 23 reveals the first and second terminal controllers 2050a and 2050b in a workpiece position. In this architecture, the first spacer 2054a is separated from the first terminal controller 2050a. Is the first distance Di and the second spacer 2054b and 1 the arm 2034 is separated into the second distance D2. When the first and second terminal controllers 2050a and 2050b are above the arm 2034, the first workpiece 190a can be stacked below the second workpiece 190b for transport along the track 1932, as described above with reference to FIG. 21B. It should be noted that the first and second terminal controllers 2050a and 2500b can be separated from the arm 2034 by different distances and using different technologies. The particular embodiment disclosed in FIG. 23 uses fixed spacers 2050a and 2054b to provide a distance between the first and second terminal controllers 2500a and 2050b. Fixed differences, thus reducing the need for a complex collision avoidance variant, because the first and second workpieces 1 901 ab are originally 74 200306611 and are held in such a way that they cannot collide with each other or with the self-control unit 1 934 The parts collide twice. FIG. 24 illustrates the connection between the second terminal controller 2050b and the second extension 2036b of the arm 2034 in more detail. In this embodiment, the wheel 2245b is fixedly attached to the spacer 2054b and the adjacent end of the terminal controller 2050b is fixedly attached to the spacer 2054b. The belt 2246b thus rotates the wheel 2245b about the second rotation axis A2-A2. The wheel 2245b is mounted to a rotating fluid passage tube 2300 through a bearing. The fluid passage tube 2300 includes a passage 2304, and a vacuum energy can be exhausted or a pressurized fluid can be exhausted through the passage 2304. The passage 2304 is in fluid communication with the spacer 2054b and passes through the terminal controller 2050b and is in fluid communication with a passage 2038 so that the fluid can pass through the second terminal controller 2050b. In the case of this vacuum terminal controller, a vacuum is exhausted through the passages 2304, 2306, and 2308 to generate a suction force on the workpiece holder 2052 (Fig. 20A). A seal 2310 between the fluid passage tube 2300 and the spacer 2054b prevents air leakage between the two parts. Attention should be paid to the application of another embodiment of applying a vacuum or driving a pressured fluid through a terminal controller using other constructions. In addition, the terminal controllers can be vacuum terminal controllers as disclosed or they can clamp terminal controllers for edges, which can use a fluid under pressure to drive a linear piston to hold the edge of the workpiece against the tab ( See International Patent Application Nos. 09/386, 566; 09/386, 590; 09/386, 568; all of which are incorporated herein by reference. Embodiments of the transfer device 1 930 are expected to have high Reliability. 200306611 4 Conveying device 1 930 reduces the number of parts and the complexity of operating software compared to conveying devices with a plurality of separate automatic mechanical units in a single area. Generally speaking, reducing a system's Complex devices are more reliable and easier to maintain because they require fewer parts. Therefore, the embodiment of the conveyor 1930 is expected to have low maintenance requirements and low downtime due to component failure Figure 25 is an isometric view of a transport unit 2510 having a single arm 2534 extending 2536 according to one embodiment of the present invention. In one aspect of this embodiment, the transport unit 2510 Includes an automatic control unit 2535 supported by a linear track 1932 (Figure 20A) in a linear movement as shown by arrow τ. Therefore, the automatic control unit 2535 is automatically moved into the loading and unloading station 1910 (Figure 19) and any processing station 1920 (Fig. 19). The automatic control unit 2535 includes a base 2537 that supports a upward and downward movement along the lifting path LL, which is indicated by the arrow v and as referenced 20A above, a moving waist element 2532. The waist element 2532 supports an arm assembly 2530 having an arm 2534, and the arm 2534 is rotated with respect to the base 2537 as shown by the arrow. In this embodiment The arm 2534 has a single, centrifugal extension 2536, which protrudes from the λ lifter LL and supports two terminal controllers 225 (the first terminal controller 2005a and the second terminal controller 2 are revealed). 5〇b). The terminal controllers 2250 are independent of each other and rotate around a common axis with respect to the arm 2534 as shown by arrow R2. In one aspect of this embodiment] Hai automatic control unit 2535 with-flexible cable 2542 (Such as a cable) is coupled To a control unit 76 200306611 2541 (the outline is not shown in Figure 25). Therefore, the automatic control unit 2535 can move linearly as before τ without the restriction of the cable 2542. In a further point of view of this implementation and example, it should be required By operating the automatic control unit 2535, important parts of its own control and power can be located in the control unit 2541 instead of the automatic control unit 2535. The advantage of this arrangement is that the automatic control unit το 2535 can be Made smaller and therefore requires less moving space. Fig. 26 is a schematic sectional view of a part of the automatic control unit 2535 according to the embodiment of the present invention. In one aspect of this embodiment, the first terminal controller 2550a is supported on an internal shaft 2545a and the second terminal controller 2550b is supported on an external shaft 2545b that is placed away from the internal shaft 254. . The outer shaft 2545b is driven by an outer shaft belt 254 (outward extension of the plane of the figure%), and the outer shaft belt is then driven by an outer shaft wheel (positioned away from the plane of FIG. 26). The inner shaft 2545 & is coupled to an inner shaft belt 2544a, which is then powered by an inner shaft wheel because the delta terminal controller 2550a leaves the first terminal controller 2550b vertically, each terminal controller 255 〇 Can move without interference from other players. By providing separate power to each end controller 2550, each end controller 2550 can move in motion with the other. —Duo Kao Figure 20B '25 & 26 One of the embodiments of the automatic control unit described above is characterized by the single, centrifugal extension 2536 when the arm is turned' less like a multi-protrusion arrangement with the surroundings Interfering parts. On the contrary, it has the advantages of multiple extensions {they effectively increase the access degree of the automatic control unit. Therefore, the special arm arrangement can be selected based on a specific arrangement of the processing station 1920 and the loading / unloading station 1910, for example. In a specific embodiment, an automatic control unit 2535 having a single extension 2536 can be adapted to a tool having a single column of processing stations, such as described above with reference to FIGS. 1-8. As can be seen from the above description, specific embodiments of the present invention have been described here for illustrative purposes, but without departing from the spirit and scope of the present invention, various modifications can be made. The present invention cannot be limited by it. The scope of the present invention is defined by the scope of patent application. [Brief Description of the Drawings] FIG. 1 is a sectional isometric view of a part of a device for processing microelectronic workpieces which can be manually and automatically processed according to one embodiment of the present invention. Fig. 2 is a schematic cross-sectional side view of a portion of a device substantially similar to the device of Fig. 1 with a holder placed to receive a microelectronic workpiece manually according to one embodiment of the present invention.

Fig. 3 is a schematic cross-sectional side view of a portion of the device of Figs. 1 and 2 having a support positioned to receive a microelectronic workpiece from an automated transfer device according to one embodiment of the invention. Fig. 4 is an isometric view of a portion of an automated transmission according to an embodiment of the present invention. , Zhizhi Line FIG. 5 is a schematic cross-sectional side view roughly along a part of the automated conveyance system 5 disclosed in FIG. 4. Figure 6 and Figure 6 are a schematic view of a stand of a processing station according to one of the embodiments of the present invention. A section with a device that is movable toward 1 is shown. Fig. 7 is a side view of an unintentional cross-section of Qiu Yaoba_1, Daojiu 4 in accordance with one embodiment of the present invention. Figure 8 is disclosed according to one embodiment of the present invention +% month from Figure 7-

A part of the part of the riser-stained A fork supported by the guide structure shows the rear view. FIG. 9 is a schematic explanatory diagram of a measuring station according to an embodiment of the present invention. Fig. 10A is a schematic illustration of a part of a microelectronic workpiece having a conductive material placed thereon according to an embodiment of the present invention. Fig. 11 is a schematic explanatory view of a part of an electrochemical treatment station according to an embodiment of the present invention. Fig. 12 is a partial schematic illustration of an electrochemical processing station according to another embodiment of the present invention. Fig. 3 is a schematic explanatory view of a part of an electrochemical processing station having a plurality of electrodes according to another embodiment of the present invention. Fig. 14 is a schematic illustration of a part of an electrochemical pretreatment station with multiple electrodes and flow paths according to another embodiment of the present invention. A figure 5 is a schematic explanatory diagram of a part of an electrochemical processing station according to an embodiment of the present invention. A Figures 16A-B are schematic illustrations of parts of a frame that constitutes a station that can remove material from a U electronic workpiece according to one embodiment of the present invention. Fig. 17 is a schematic isometric cross-sectional view of a spraying microelectronic worker according to one embodiment of the present invention. FIG. 18 is a schematic cross-sectional view of a portion of a sub-workpiece for heat treatment of microelectronics according to another embodiment of the present invention. . FIG. 19 is an isometric view of a processing device according to one of the embodiments of the present invention, including a processing device for processing the workpiece; a part of the processing device for processing the workpiece; a part of the processing device, which is disclosed in a section Illustrated illustration. 20A and 20B are isometric views of a transfer device for processing a microelectronic workpiece according to an embodiment of the present invention. FIG. 21A is a top view of a processing device for processing a microelectronic workpiece according to an embodiment of the present invention, which discloses a framework for operating a transfer device. Fig. 21B is an isometric view of a part of the transmitting device of Fig. 21 A 4 & Circle 1A, which shows another structure for operating the transmitting device. Fig. 21C is a plan view of one of the conveying devices of Figs. 21A and 21R + Shi Latan, which shows another structure for operating the conveying device. FIG. 22 is an isometric view of a conveying device for processing microelectronic workpieces according to one of the embodiments of the present invention. The components of 1 疋 — 八 in k 中 are shown in cross section.

And other parts are shown schematically. FIG. 23 is a cross-sectional view of the transfer device of FIG. 22. FIG. 24 is a cross-sectional view of the transmission controller of FIG. 22-the terminal controller. Fig. 25 is an isometric view of a conveying unit having a single extended arm according to another-embodiment of the present invention. Fig. 26 is a plan view of an embodiment of the conveying unit shown in Fig. 25; [Description of component symbols] 100, 1 800 device, 15010 processing station, chassis, 151 80 200306611 station shaft, 114 microelectronic workpiece, 102 housing, 103a front surface, 103b rear surface, 103c side surface , 106 processor, 107 user interface, 105 electric unit '110 input / output station, 111 platform, 113, 152 container, 130 automatic transfer device, 112, 104 opening, 132, 160, 920 bracket, 131 automatic machine, 133, 181 guide path, 115 bracket surface, 116 removable section, 134 shield, 120 clean room environment, 121 gray room environment, 122 坌, 124 also, seal, 176, 162 receiving surface, 161 Head, 164 carrier, 166 head rotation axis, 108 rod, 180 bracket stand, 165 lifter, 135 upright part, 136, 1358 horizontal part, 137 base, 139 arm, 140 final controller '140a upper part Terminal controller, i4〇b lower terminal controller, 146 centrifugal projection, 141 common unit, 144a internal shaft, 144b external shaft, 145a internal shaft belt, 145b external shaft belt, 143a internal shaft pulley '184 access panel, 182 Guide track, 183 linear guides, 174 guide elements, upper 170a Placer ball, 170b lower placer ball, 169 upper support bracket, 175 lower support bracket, i75a left lower support bracket, 175b right lower support bracket, 168a upper support beam, 168b lower support beam '171 positioning surface, 173 latch, 172 lock mechanism, 163 electrical end, 167 air end, 177 receiving bracket, 178 screws, 180 support base, 900 measuring station, 93 detector, 940 analyzer, 950 controller, 960 chain '1012 trench' 1010 barrier layer , 1013 holes, 1015 overlay, 1066 through-hole '1161 motor', 1162 rotor, 1170 contact assembly, " M backing plate, 1164 seal, 1152, 1252, 1352 container assembly, 1153, 1253, 1 353 Outer container, 1154, 1254, i 354 inner container, 1220 exhaust ring, 1256 inner side wall, 1222, 1242, '11243, 81 200306611 1342 exit' 1232 '1332 delivery conduit, 1259, 1359 weir, 1230 electrode, 1231 electrode protection Hood, 1235 diffuser, 1234 sleeve, U33 cable, 1340 drainage channel, 1331 acceleration channel, 1 332 fluid flow zone, 1334 nozzle assembly '1343 gas channel, 1345 main fluid flow chamber, 1452 multi-electrode capacity Device assembly, 1453 external container, 1454 internal container, 1440 spiral drain pipe, 1444 fluid outlet, 1432a main fluid inlet '1432b auxiliary fluid inlet, 1475 main flow guide, 1478 main flow channel, 1479 nozzle or orifice, 1432 auxiliary fluid Entrance, 1470 distributor, 1430 electrodes, 1472 splits, 1471 compartments, 1476 field integer unit '1470 distributor channel or distributor, i48〇a_i480d virtual electrode position' 1474 orifice ', 1477 interface element, 1550 processing station , 1580a supply valve assembly '1554 treatment part, 1552 container assembly, 1853 fluid heater' 1559 weir '1540 overflow channel, 1538 overflow conduit, 1580b waste valve assembly' supply valve 1581, 1582 drain valve, 1537 exhaust duct , 1560 bracket, 1650 material removal station, 1663 drive shaft, 1662 rotor, 1670 upper chamber element, 1680 lower chamber element, ι67ι upper chamber wall, 1672 upper chamber, 1681 lower chamber wall, 1621 lower surface, ι682 lower chamber ' 1684 injection nozzle, 1622 outer edge, 1675 outlet tube, 1623 peripheral area '1620 upper surface, 1750 spray station, 1752 container, 1760 holder, 17 63 bracket finger, 1762 rotor, 177] L main spray nozzle, 1770 spray nozzle bar, 1803 heat treatment room, 1802 bracket, 1810 base, 1820 lip, 1870 workpiece holder, 1840 heating source, ι86〇 first heating tank , 1850 second heating tank, 1841 vacuum orifice, room 1 803, 1821 lip-actuated 'upper chamber 1803a, 1830 cover, 1808 chamber volume, 1822 cleaning 82 200306611 fluid pathway, brain power mouth heating tank, 1861 heating Slot actuator, 1854 order channel, 1901 microelectronic workpiece, j internal area, ^ cabinet, -905 outer area, 1910 loading / unloading station, Hu container holder, 19 丨 3 Λ protective shelter, 1914 workpiece container, 1906 orifice, 1920 processing station, 1930 conveying device, 1932 linear guide, 1934, automatic machine unit, 2010 conveying unit, 2030 arm assembly, 2050a first terminal control Device, 205 0b second terminal controller, 2012 cover or cover, opening, 2030 arm assembly, 2016 seat board, 2032 waist element, 2035 mid section, 2034 arm, 2036a first extension, 2036b second extension, 2038a first distal end, 203 8b second distal end, 1920a cleaning / Etching room, 1920c electric mining room '1920b electroless plating room, 1920d RTA room, 2050a first terminal controller, 2050b second terminal controller, 1934 automatic machine unit, 1901a first workpiece, 1901b second workpiece, 2036b Second Extension, 2010 Conveying Unit, 2212 Lifting Actuator, 2214 Lifting Element, 2216 Lifting Platform, 2210 Lifting Assembly, 2212 Lifting Actuator, 2218 Drive Shaft, 2219 Drive Wheel, 2220 Passive Wheel, 2214a Guidance, 2219 driving wheel, Xin 2222 belt, 2224 nut, 2216 lifting platform, 2230 base, 2232 waist motor, 2237 bushing, 2236 output shaft, 2238 edge, 2240 bearing, 2242a first controller drive, 2243 cavity, 2242b first Two controller drives, 2246a belt, 2245a passive wheel, 2254 cable track, 2054b spacer, 2246b belt, 2300 rotating fluid pipe, 2304 channel, 2536 single extension, 2534 arm, 2510 conveying unit, 2535 automatic control unit, 2532 waist Components, 2537 base, 2050a first terminal controller, 205 0b second terminal controller, 2542 flexible cable, 2541 control unit 83 200306611 yuan, 2550a first terminal controller A second terminal controller 2550b, 2545a inner shaft, outer shaft 2545b, 2546b outer shaft belt 2536 extending centrifugation single

84

Claims (1)

200306611 Patent application park:-A device for processing microelectronic workpieces, which includes: a plurality of processing stations, i-a user manually accesses all of the device. A processing unit is used to manually load the microelectronic workpiece for processing; an input / output station is constructed to support at least one microelectronic workpiece for self-elevating into and out of the processing station; a passer device, It is positioned adjacent to the input / wheel outbound station and the "" and the transfer device is automatically movable to transfer the microelectronic workpiece between the input " output station and the processing station. $ 罝 2 · Τ Please refer to the device described in item (1) of the patent, further comprising: removing a prostitute, positioned at least adjacent to the transmission device (n), and at least restricting the user's access to the transmission assembly. The device further includes a shield 'which is positioned at least adjacent to the transfer device to limit at least the user's access to 4 transfer devices' its towel and the material-part of which extends over the transfer' and wherein the bracket When carrying the microelectronic workpiece, the bracket has a quilt that constitutes an accommodating portion for accommodating the microelectronic guard. When the ^ is attached to the first transfer position, the accommodating portion is positioned at: extension: the Part of the shield of the teleporter Underneath, when the bracket is attached to the second delay position, the containing portion is positioned at or above the portion extending over the shield. Place it ... 4 · If the scope of patent application is 1 item The device, wherein the processing station is arranged along a first line that is substantially straight, and wherein the conveying device includes a gantry structure that can be formed along a second line that is substantially parallel to the first line. 200306611 Motive benefit, and wherein the conveying device further includes a housing placed around the at least one processing station, and the housing has a first access opening, and the user can pass through the first access The mouth has manual access to all processing chambers, and the housing has a second access opening that can be accessed by the automatic machine, and the automatic machine can move the micro through the second access opening. The electronic workpiece 'and the second line are positioned between the first line and the first and second access openings. 5. The device described in item 丨 of the scope of patent application, further comprising a Placed so as to surround the housing of the at least one processing station, and the The shell has at least one opening that is positioned to allow manual access to all the processing stations of the device. 06. The device described in item 丨 of the patent application scope further includes a 4 belt and a leather positioning by the chassis. It can be used as a shelf for one of the containers of electronic workpieces, and the user manually removes the microelectronic workpiece from the container and transfers the microelectronic workpiece to at least one processing station. 如 7. If the scope of patent application is 帛The device described by the staff member, wherein the processing station is enclosed; ^ 皮 # constitutes a bracket carrying the microelectronic workpiece, and the bracket is at the first transfer position and the first and the first transfer position. The spaced-apart transfer position is moved, wherein the bracket system is oriented so that when the bracket is positioned in the -transmission position, the microelectronics from the transfer device and the stent frame are oriented. When the bracket is in the second transfer position, the microelectronic workpiece manually received from the user can be accommodated, and the bracket system can be selectively stopped at the first and second transfer positions. Its movement. 86 200306611 8. The device as described in the scope of the patent application, wherein the set includes: ', a conveying device support with a guide path; a base, which is carried by the conveying frame and can be guided. Path movement; ^ 51 an elevator, which is carried by the base and can be moved up and down along a lifting axis; ° an arm, which is carried by the elevator, and the arm is rotated relative to 1 base, The arm has an extension protruding from the lifting shaft: and the first and second terminal control stomachs, which are carried by the feed arm and are rotatably coupled to the extension of the arm, and each— The terminal controller is independently rotated relative to the arm and each terminal controller is constructed to releasably carry a microelectronic workpiece. 9. The device as described in item (i) of the scope of patent application, wherein all the processing materials of the device are manually received from the set_single-side. 10. The device as described in item i of the patent application scope, wherein the location comprises:-a processing container 'whose quilt structure can provide processing fluid; a branch which is movably placed adjacent to the processing container and is structured Carry the microelectronic work piece, and Xi Li_ han 4 Yanmu can be in a first transfer position separated from a processing position, 2 the processing position and one and the processing position, the second: the second Move between the transfer positions, where the wood system is placed to carry the microelectronic workpiece, and when the processing flow system is within 87 200306611 and the bracket is placed there, and m ^ ^ 4 is set, and The processing fluid is in contact with each other, and when the stent is attached to the ^ -Γ ^ ^ + A. The V-position is' the stent is placed toward Kegu, from the inside of the transmission device. An electronic workpiece, and when the bracket is attached. When the transport position of the Hai-Yi-Yi was ordered, plus the τ ° Hai branch system was positioned to accommodate the microelectronic workpiece manually from the user. Stop its movement at the transfer position. η. The arrangement as described in item i of the patent application scope, wherein at least one processing station includes: -The first valley state, whose quilt structure can provide-treatment fluid, and the first container has a weir to define a liquid level of the treatment fluid;-a second container, which is placed to surround the first container to accommodate The flow exceeds the processing fluid of the weir; a workpiece holder which is positioned to carry the microelectronic workpiece so as to be in contact with the processing fluid in a first container; a first electrode holder which is positioned at the first- A container and a structure capable of carrying a first electrode; A second electrode holder, which is carried by the workpiece holder and is positioned to be portable-the second bakelite, and when the microelectronic workpiece is carried by the workpiece 1 frame, the second electrode is in contact with the microelectronic workpiece . 1 2 · The device according to item 1 of the scope of patent application, wherein at least one processing station comprises: at least one container, which is constructed to provide a processing fluid; one or more electrode holders, which are positioned at the first A container and a rack structure capable of carrying a plurality of first electrodes individually or together; and 88 200306611 a workpiece holder positioned at least adjacent to the at least one container to carry the microelectronic workpiece and within the container The processing fluid is in contact with each other, and the 4 workpiece holder is constructed to be able to carry at least a second electrode, and when the workpiece support carries the microelectronic workpiece, the second electrode is in contact with the microelectronic workpiece. 13. The device according to item 1 of the scope of the patent application, wherein at least one processing station comprises: a reaction container comprising: an external container having an external wall; and a first entrance whose frame structure can be introduced into a main body Flow into the external container; at least a second inlet, which is constructed to introduce an auxiliary flow separate from the main flow into the external container; a media field shaping unit in the external container, which is Coupled to the second inlet to accommodate the auxiliary stream, the field shaping unit is framed to accommodate an auxiliary stream passing through at least a portion of the external container separate from the main stream, and the field shaping The unit has at least an electrode compartment, and the auxiliary flow can pass through the electrode compartment. At the same time, the auxiliary flow system is separated from the main flow by%. The electrode compartment system is constructed to accommodate at least one electrode 14. The number of items described in item 1 of the patent application scope includes at least one processing station including: "-": a container whose frame structure can provide-no electrical processing fluid, and the first capacity is Defining the processing fluid-the liquid level; 89 200306611-each device 'is placed around the first container to accommodate the non-electrical processing fluid whose flow exceeds the weir; ^ the bracket' is positioned to carry the microelectronic workpiece So as to be in contact with the processing fluid in the first container; the retention tank is configured to carry the processing fluid in a frame, and the retention tank is in fluid communication with the first container. The device described in item No. 1 of Ru Shenming's patent scope, wherein at least one processing station includes a measuring station, which includes: a bracket, whose frame is configured to releasably carry the microelectronic workpiece; a measuring device, which can detect The microelectronics is structured such that it is positioned at least one characteristic of a conductive material adjacent to the workpiece of the support, a round-out device, which sends a signal corresponding to the microelectronics output. Can be operatively coupled to the measuring device to transmit at least one of the detected characteristics of the conductive material of the workpiece And the bracket frame I6. As the device described in the scope of the patent application, the management station system includes a spraying station, which includes: a container, which is constituted to carry a fluid; the bracket, which is positioned to at least Adjacent to the container, the microelectronic workpiece can be carried; and inside the valley device, and the fluid palm can be "the fluid block has a plurality of directed to the branch, straight, g, spraying the microelectronic with the fluid Workpiece station:.: The device described in the scope of patent application 帛 1, at least ', including a material removal station, the material removal station includes a 90 200306611 part-and = face toward the The rotor of the second part of the first part, and the third knowing circle has a truss forming a chamber volume movably accommodating the microelectronic workpiece, wherein the -part includes -has-is guided into One of the first volume of the chamber volume and the first fluid channel A facing the second part of the volume can be coupled to a first fluid source, and the second part of the wound is guided. Enter a second opening in the volume of the chamber and face the- Two fluid passage, Μ second aperture lines may be bonded to the surface of a second fluid source. 18. The device according to item 1 of the scope of patent application, wherein at least one processing station includes a heat treatment station having a frame structure capable of increasing one temperature of the microelectronic workpiece, the heat treatment station having a heater. 19. The device according to item 丨 in the scope of patent application, wherein at least one processing station includes a heat treatment station, which includes a base; a bracket, which is carried by the base and is movable by the frame. Contact the microelectronic workpiece; a lip adjacent to the base, at least one of the base and the lip are movable relative to each other between a closed position and an open position, and the lip and the θ Hai base are in A heat treatment space is defined in the closed position; a heater, which is positioned between the base and the lip; a first heating tank, which is positioned adjacent to the heater, and can be relative to the heater The heater moves between a first position where the first heating tank is in thermal contact with the heater and a second position where the first heating tank is away from the heater; 91 200306611 ▲ second heating The tank is positioned adjacent to the first heating tank, and the first heating tank is in thermal contact with the first heating tank when the first heating tank is in the second position. 20. The device according to item 丨 of the scope of patent application, further comprising a housing having a first surface including a first access opening and an opposite surface facing the "Heidi surface and containing a second connection The second surface of the access opening, and the first and second access openings are individually sized and positioned to allow manual access to the transfer device and access to the microelectronic workpiece. All processing stations and / or access to the inner area of the casing. 21. The device described in item 1 of the scope of the patent application, further comprising a casing placed around at least one of the processing stations, the The housing has a first surface facing the first direction and a second surface facing the first surface, the first surface having at least one first access opening, and the second surface having at least one second access Orifice, and wherein the shell has a third and a fourth surface, which are located between the first and second surfaces and opposite to each other ', and wherein the third and fourth surfaces are not sized to allow Manual access to the conveyor or The orifice of the processing station. 22. The device according to item 丨 of the scope of patent application, wherein at least one of the application stations comprises: at least one quilt forming a container capable of carrying a processing fluid; or more electrode holders, The plurality of first electrodes are positioned in the container and can be carried separately or together, and the first electrodes are annularly separated from each other; the workpiece holder is positioned at least adjacent to the at least one container 92 200306611 carries the microelectronic workpiece in contact with the processing fluid in the container, and the workpiece holder is constituted by a frame. When the workpiece holder carries the microelectronic workpiece, it can carry at least a second electrode and the The microelectronic workpiece is in contact with each other, and the device further includes a spraying container which is provided with a quilt structure to provide a spraying fluid; a spraying bracket which is positioned adjacent to the spraying container and is configured to be portable by the quilt structure The microelectronic workpiece; A spraying fluid barrier is positioned in the spraying container, and the spraying fluid shed can be closed to the source of the spraying fluid. The spraying fluid barrier has a plurality of fluid nozzles directed toward the bracket to spray on The microelectronic workpiece in the spray fluid. 23. The device as described in the scope of the application for patent, at least one of which is at least one. Application station system—the gantry structure can strengthen and / or repair the microelectronic workpiece. A first application station of a sub-layer 'and at least- The processing station system includes: two removal stations' further wherein at least another processing station system includes a frame Can be a covering layer of conductive material to the second of the microelectronic workpiece ... The station's further and medium 5 s —, k 4 cents a work — the processing station system includes a frame to form a guide that can break the electronic workpiece. Material heat treatment station. 24. The clothes set according to item 1 of the scope of the patent application, wherein at least one shadow == constitutes an electrophoretic deposition-electrophoresis resist material to the micro-electricity, and it is a force. . At least one of the processing stations includes a heat treatment station which has a sub-workpiece and raises the electrophoresis resistance sword; a micro-electricity-treatment station system of a resist material includes-has-temperature, and at least one of the other wooden structures carries a Spraying of spraying fluid 93 200306611 A spraying station of a container, a spraying bracket positioned adjacent to the spraying container and framed to carry the microelectronic workpiece, and a spraying fluid stop positioned at the spraying Inside the container, and the spray fluid barrier can be coupled to one of the sources of spray fluid 'the spray fluid barrier has a plurality of fluid nozzles directed to the holder' to spray the microelectronic workpiece with the spray fluid. 25 · —A device for processing a microelectronic workpiece, comprising: a processing station; A bracket 'is movably positioned adjacent to the processing station and the bracket is configured to carry the microelectronic workpiece, and the bracket is spaced between the first transfer position and the-and the _ transfer position. The second transfer position is moved 'where the bracket is oriented so that when the bracket is in the first transfer position' the microelectronic workpiece from the automatic transfer device can be accommodated, and the 1st bracket is oriented into When the support is attached to the second transfer position, Gurner's active electronic components from the user can be contained, and the support is selectively stopped at the first and second transfer positions. Its movement. Includes 26 self-claiming: the device described in the scope of patent 25 items, wherein the bracket includes a carrier that can be extended upwards from the processing station, and a support supported by the carrier and J moving toward and Stay away from the virtual space; the lifter occupied by S and a broken wood by the lifter's work ^ constitute a receivable part that contains the microelectronics in the workpiece, and the funeral electric rotates. 4 heads can be relative to the carrier and the processing station as described in item 25, wherein when the "Hai bracket cannot receive the automatic transmission 27", such as when the first frame of the patent application is attached to the second transmission position 94 200306611 2 8 · The device as described in item 25 of the scope of patent application, further comprising a guard positioned adjacent to the processing station and the support, and the support is used when the δH support is transmitted on the first transmission. Positioned 'is positioned under at least a portion of the shield, and when the bracket is in the second transfer position, the bracket is positioned above at least a portion of the shield. 29. If applying The device described in the patent scope item 25 further includes An automatic transfer device, wherein the automatic transfer device includes a frame configured to transfer microelectronic workpieces into and out of the bracket when the bracket is tied to the first transfer position; and a shield 'which is positioned adjacent to the automatic At least the transfer device restricts access to the automatic transfer device, and at the same time, the user moves the microelectronic workpiece to the support and leaves the support by hand. 30. The device as described in claim 25, wherein the branch is movable toward and away from the processing station between the first and second transfer positions, and when in the first transfer position, the support system Far from the processing station-the first distance, and when at the second transfer position, the bracket is far from the processing station, and the HE distance is greater than the first distance. 31. According to the device described in the scope of the patent application, the processing between the basin and the second transfer position is toward and away from the processing: and; t, and when in the first transfer position, the bracket is far from the processing station as- The first distance, and when at the first value ^ m, the bracket is far from the sacrifice-the first distance is' the second distance is greater than the first distance. 32. An apparatus for processing a microelectronic workpiece, comprising: 95 200306611 a processing station configured to move the microelectronic workpiece movably; a stand positioned at least adjacent to the processing station, and The bracket is configured to releasably carry the microelectronic workpiece, and the bracket is relative to the processing station between a first transfer position where the bracket is oriented to releasably receive the microelectronic workpiece and a bracket is Orientation can move the microelectronic workpiece between processing positions in the processing station, wherein the bracket is supported relative to the processing station from a position above the processing station. 33. The device according to item 32 of the scope of application for a patent, wherein the processing station includes a container configured to provide a processing fluid, and wherein the bracket is oriented such that when the bracket is in the processing position, The processing fluid may be in contact with the microelectronic workpiece. 34. The device according to item 32 of the scope of patent application, wherein the bracket comprises-a carrier extending upward from the processing container, a support supported by the carrier: movable: ground facing and away from the processing station , And a head carried by the lifting and carrying π, and the head has a quilt constitute a receiving part for releasably accommodating the microelectronic workpiece. 5. The device described in Item 32 of the scope of patent declaration, where the Ge: including-a vehicle extending upwards from the processing station, a movable orientation directed by the support of the vehicle and i Head, "Head :: Lifter, and-by the lifting μ shell-there-quilt constitute releasably to accommodate the micro talent, Γ internal part 'and the head can be relative to the vehicle and the processing The capacity is rotatable between the transport position and the processing position. 36. If the 32nd position in the scope of the patent application is a first transfer position? Among them, / / T 4 further includes a transfer 96 200306611 position 'its quilt When the bracket is in the first transfer position, the microelectronic workpiece can be automatically transferred to the bracket, and the bracket can be moved to the _ brother-transfer position, and when the bracket is in the second transfer position The a frame system is oriented to accommodate a microelectronic workpiece manually from the user, and wherein the frame system is configured to selectively stop its movement at the first and second transfer positions. 37. For the device described in the patent scope 帛 32, the step-by-step package The track is located above the delta processing station, wherein the bracket is at least partially suspended from the track and is oriented along the track toward and away from the processing station. 38. As described in the scope of patent application: 32 items The device further includes a track, which is positioned above the processing station, wherein the bracket is at least partially suspended from the track and is oriented along and away from the processing station; and a releasable lock mechanism It can be engaged with the bracket to limit at least the movement of the 5 Hai bracket along the road. 39. A device for processing a microelectronic workpiece, including: a processing station, the frame is movable Ground to receive the microelectronic workpiece; a bracket positioned at least adjacent to the processing station, and the support frame constitutes releasably carrying the microelectronic workpiece, the bracket is relative to the processing station along the first guide The path moves between the first transfer position and the one: in position, and when the bracket is tied to the first transfer position, the bracket is oriented to releasably receive the microelectronic workpiece, and when the bracket is Bracket system ^ Hai processing position 'When the bracket is oriented to be portable in the processing station, the 97 200306611 = electronic workpiece, wherein the bracket is carried by a support having a second guide path = holder, the bracket can be Move along the second guide path toward and away from the processing station, and the second guide path is oriented transversely to the first guide path. 40. The device according to item 39 of the scope of patent application, wherein The stent holder includes a track positioned above the processing station, and wherein the stent is at least partially from the holding rail and is oriented along the track and away from the processing station. 41. If the scope of a patent application The device according to item 39, wherein the bracket holder includes a track positioned above the processing station, and wherein the bracket is suspended at least partially from the track and the Yanhai bracket system, along the holding path Towards and away from the processing station, and wherein the device further includes a releasable lock mechanism that can be engaged with the bracket to 'at least restrain the bracket from following the lane when the bracket is tied to a selected position Movement. 42. The device according to item 39 of the scope of patent application, further comprising a conveying device capable of moving along a conveying device axis relative to the processing station, and the conveying device is constituted by a frame and can automatically move the microelectronic workpiece. To the processing station and away from the processing station, and the second guide path is horizontal = the conveyer axis. 43. A device for processing microelectronic workpieces, including: a plurality of processing stations; a conveying device, which is positioned adjacent to the processing stations and is constructed to be capable of automatically moving the microelectronic workpieces to the A processing station and leaving the processing station; a casing placed to surround at least one of the processing stations, the foreign service 98 200306611 ^ a first surface facing a first direction and an opposite surface facing the first surface, a _ surface '' The first surface has at least one first access hole, the second surface has at least a second access hole ... the first and second connections are sized and positioned to allow manual access to The transfer device and all processing stations. A material. The device according to claim 43, wherein the casing has a third and a fourth surface, which are located between the first and second surfaces and face each other, i. The third and fourth surfaces do not have a sized orifice that allows manual access to the transfer device or the processing station. 45. The device according to claim 43, wherein the at least one first-access hole The mouth includes a quilt structure which can be aligned with the microelectronic workpiece container, and the at least first access opening is sized to accommodate at least one microelectronic workpiece and at least a part of the conveying device. 46. The device according to claim 43, wherein the at least one access opening includes a first opening that is sized to allow for manual loading and unloading of a microelectronic workpiece. Manual access to all processing stations 47. The device as described in claim 43, wherein the at least one first access aperture includes a first aperture that is sized to allow service access to the transfer device . 48. The device according to claim 43 of the patent application, wherein the at least one first access opening includes: a first access opening whose frame structure can be aligned with a microelectronic workpiece container 99 200306611 And the first orifice is sized to accommodate at least one microelectronic workpiece and at least a portion of the conveying device; the other first access orifice is sized to be manually loaded on a microelectronic workpiece Manual access to all processing stations is allowed during loading and unloading; another first loading port, which is sized to allow service access to the transfer device. 4 9 · The device as described in claim 43, wherein the at least one second access opening includes a service opening which is positioned to allow access to all processing stations carried by the chassis . 50. An apparatus for processing microelectronic workpieces, comprising: a first zone having a first cleanliness; a second zone having a second cleanliness lower than the first cleanliness; A compartment in the first and second sections, the compartment having at least one opening; and a tool for processing microelectronic workpieces, the tool being positioned at least adjacent to the opening and including: a plurality of processing stations; a transfer device, It is positioned adjacent to the processing station and is framed to automatically move the microelectronic workpiece to and from the processing station; a casing placed around at least one of the processing stations, the casing having an orientation A first surface in a first direction and a second surface facing the first surface, the first surface having at least one first access opening, the second surface having at least one second opening, and the The first and second orifices are sized and positioned to allow manual access to the transfer device and all 100 200306611 processing stations, jSl Φ Shi Fang $, 丨, ^ One T ~ One Xi Yidi one hole Mouth can be from The first zone is accessed and a second orifice is accessible from the second zone. 51. The apparatus of claim 50, wherein the tool is hermetically coupled to the compartment. One of the five devices is the same as the device of the 50th in the scope of patent application. In the #, the casing has first and fourth tables φ, which lies in the squares extending between the first and second surfaces and facing each other. And the third and fourth surfaces protrude into the first region. It is assumed that the shock device of the 50th scope of the patent application scope, wherein the shell has second and fourth surfaces, which lies between the first and second surfaces and faces toward each other α. ^ Pairs of directions, and The third and fourth surfaces protrude into the second region. 54. The device according to item 50 of the scope of the patent application, wherein the at least one first orifice comprises: a seat, an f-orifice, and its frame structure can be opposite to the microelectronic workpiece container > And the Haidi orifice is sized to accommodate at least one microelectronic workpiece and at least a part of the conveying device; U electronic parts and another $-孑 dagger which is sized to a microelectronic workpiece During manual entry and unloading, all processing stations can be manually accessed; ^ a first dagger device. Port, which is sized to allow service access to the transmission 5 5 · The device as described in the patent application Fan Shigu No. 50, wherein the housing has a third and a fourth extension and faces each other two It is in the direction of the first and second surface extensions, and the third and fourth surfaces do not have 101 200306611. There are sized apertures that allow manual access to the conveyor or the processing station. 56. A conveying device for processing microelectronic workpieces in an environment of a processing station, comprising: a base unit that can be moved along a guide path; an arm assembly operatively coupled to the base unit to the base The units move together, and the arm assembly includes a movement along a lifting path A single arm having at least a first section protruding from the lifting path; and a first terminal controller and a second terminal controller coupled to the arm so as to be able to run around at least one substantially parallel to The rotation axis of the lifting path rotates, the first terminal controller is separated from the arm by a first distance and the second terminal controller is separated from the arm by a second distance, so that the first and second terminal control The organs are at different heights relative to the arm. 57. The device according to item 56 of the patent application, wherein the base unit comprises a transport unit having a gantry which constitutes a guide element movable along a linear track. 5 8 · According to the device described in Item 56 of the declared patent scope, the first section in the basin is only the section protruding from the lifting path, and wherein the fourth and first terminal control: the device is around a single rotation axis Rotating, further wherein the first terminal is controlled to be tethered above the second terminal controller. 々9. The device according to claim 56 of the stated patent scope, wherein the first and second terminal controllers independently rotate around a common axis. 8. The device described in the scope of application for patent 56 items, further including 102 200306611 control and power circuit, which is constructed to control the first and second terminal controllers, and the control circuit is located away from the base unit The arm and the first and second terminal controllers; and a flexible communication link coupled between the control circuit and the base, the communication link is constructed to allow the Relative motion between the base port and the control and power circuits. 61. The device according to item 56 of the scope of patent application, wherein both the first terminal controller and the second terminal controller are bonded to each other to protrude from the jackpot. The extension of the arm, the first and second terminal controllers rotate independently of each other around a common axis that is substantially parallel to the lifting path, the first terminal controller is separated from the arm by a first distance and the second The terminal guard is separated from the arm by a second distance, so that the first and second terminal controllers are at different heights relative to the arm. 62. The device described in item% of the scope of patent application, ^ The controller is positioned on the second terminal controller, and the rt device includes ... 々 See 4 of them. The arm rotates the first terminal controller; an external drive shaft, which is placed outward: a moving sleeve with Axial-ground orientation, the external drive two and two movements = terminal 6 controller "rotating the second terminal control relative to the arm ^ Hai No. 3: a method for processing microelectronic workpieces, including: one of the guide-processing tools Automatic conveying device to move at least-No. 103 200306611 The microelectronic workpiece arrives, departs from customs or reaches and leaves one of the selected stations of the tool, the selected processing station is the processing of the worker, and several of the processing One of the stations to guide a selected process or execution of a first microelectronic workpiece in the selected processing station; and manually load a second microelectronic workpiece for each station in the tool Entering the processing station and the guiding force y guide the processing of each of the first and fourth political electronic workpieces in the processing station __field 44.f, which includes guiding the processing at the selected processing station.在 此 微电子 In the second microelectronic The execution selection process on the guard piece. The method as described in item 63 of the patent application scope, wherein the execution selection process on the first microelectronic workpiece includes guiding an applied metal in an electric ice to the microelectronics. Electronic workpieces. ▲ The method described in item 63 of the scope of patent application, wherein guiding the selected processing on the 5th and second microelectronic workpieces includes guiding the application of at least a part of the insulating material in the electrophoresis process. To the microelectronic workpiece. 66. The method described in item 63 of the patent application, wherein directing the execution of the selected processing on the first and second microelectronic workpieces includes directing the application of a photoresist material in an electrophoretic process To the microelectronic workpiece, and wherein the method further comprises: raising a temperature of the photoresist material; and rinsing the microelectronic workpiece. 67. The method according to item 63 of the scope of patent application, wherein the guidance is in the first And performing the selected processing on the second microelectronic workpiece includes guiding the application of a welding grate material to the microelectronic workpiece in an electrophoresis process. The method described above, wherein the selected 104 200306611, and the first processing station includes-the frame constitutes a mouth spray station that can rinse the microelectronic workpiece, wherein-the execution of the more processing includes rinsing the second microelectronic workpiece in the spray station 69. The method as described in the scope of application patent No. 63, wherein each of the second microelectronic workpiece includes a seed layer, and it is expected that the first and second microelectronic workpieces will have a seed layer and a post. Bu Zhiyi's fixed treatment system includes strengthening, repairing or strengthening and repairing the seed layer 70. The method described in the scope of patent application 帛 63g, wherein each of the first and second microelectronic workpieces includes a The seed layer, and performing a selected process on the first and second microelectronic workpieces includes a cover layer on the seed layer. 71. The method of claim 63, wherein the selected processing system station includes a material removal station, and wherein the execution system that guides a selected process includes removing the first and second materials from the material removal station. Microelectronic workpiece removal material. 72. The method of claim 63, wherein the selected processing system station includes a heat treatment station, and wherein the method further includes improving one of the first and second microelectronic workpieces in the & processing station temperature. 73. The method as described in item 63 of the Shenwei patent scope, wherein guiding the execution of the selected processing on the first and second microelectronic workpieces includes guiding the application of a dry:% material to the first and second microelectronic workpieces And at least the processing station includes: after applying the welding material to the first microelectronic workpiece, guiding the automatic transfer device to load the first microelectronic workpiece into the spraying station to rinse the first microelectronic workpiece at 105 200306611 Microelectronic workpiece; After adding the edge welding material to the second microelectronic workpiece, manually insert the second microelectronic workpiece into the spraying station to rinse the second microelectronic workpiece; 74. If applying for a patent The method of item 63, wherein directing the execution of the selected processing on the first and second microelectronic workpieces includes directing the application of a reinforced material to the first and second microelectronic workpieces, and at least one of the stations includes A material removal station, another processing station includes a multi anode material% plus station, and another processing station includes a heat treatment station, and the method further includes: Guide the automatic transfer device to load the first microelectronic workpiece into the T mass removal station to remove material from the first microelectronic workpiece, enter the multi-anode material application station to apply a first conductive material to the A first microelectronic workpiece and entering the heat treatment station to anneal the first microelectronic workpiece; ~ Issue 'remove the station to remove material from the second microelectronic workpiece, manually load the second neutrino workpiece into the multi-anode material application station to apply —_Le Yifu guide material to the second The microelectronic workpiece, and the second microelectronic workpiece is manually loaded into the heat treatment station to anneal the second microelectronic workpiece. 75. The method described in item 63 of the scope of patent application, Ganshan ~ $ 丄 y 'wherein guiding the execution of the selected processing on the first and second microelectronic workpieces includes guiding the application of an electrophoretic resist material to the first And the second microelectronic workpiece τ, and at least one of the processing stations includes a heat treatment station, and another processing station $ ^ „0 B with a sprinkler station, and wherein the method further includes 106 10606611 to guide the automatic transfer The device is placed in a heat treatment station to increase the temperature of the first material, and then enter the spraying and loading the first microelectronic workpiece into the electrophoretic resist spray station on the microelectronic workpiece to rinse the first microelectronic workpiece manually. Load the second micro-mine + worker's electricity into the workpiece into the heat treatment station to increase the temperature of the 5 xuan electric ice resist material on the second microelectronic workpiece, and then manually load the material The second micro-mine pre-worker I and Cangyi Electric enter the spraying station to rinse the second microelectronic workpiece. 76. The method of claim 63, wherein manually loading the second microelectronic workpiece includes manually loading the second microelectronic workpiece 'while the automatic transfer device carries the at least one first A microelectronic workpiece. 77. The method according to item 63 of the patent application scope, wherein the selected processing station includes-material application, accounting, and wherein guiding an automatic transfer device includes guiding the bracket when the bracket is in the-transfer position. Automatic transfer device To move the at least-first-microelectronic guard to arrive, leave, or reach and leave one of the brackets of the Haicai yoke plus station, and manually load a second microelectronic workpiece including the When the second transfer position is separated from the first transfer position, the second microelectronic workpiece is manually transferred into the support of the material application station. ^ 78. The method according to item 0 of the scope of patent application, wherein Wave: 4 The first microelectronic workpiece includes passing through the second microelectronic workpiece above a shield positioned adjacent to the automatic transfer system, and the shield at least restricts access to the automatic transfer device. 107 200306611 79. The method as described in claim 63 of the scope of patent application, the performing selected processing on the first and second microelectronic workpieces includes directing a first fluid toward the microelectronic workpiece wall, a surface, and guiding a The second fluid different from the first ^ _ is directed to one of the second tables of the microelectronic workpiece, and the second surface of the microelectronic workpiece faces the first surface opposite to the first surface. 80. 63 The method described in item 1, wherein the execution selected processing on the first and second microelectronic workpieces includes obliquely engraving one of the peripheral areas of the first and second microelectronic workpieces. 81. 63rd rhyme The method described above, wherein the execution of the selected treatment on the first and second: microelectronic guards includes annealing a conductive material applied to the first and second microelectronic workpieces. 82. A processing tool A method for internally processing a plurality of microelectronic workpieces, including: when the bracket is tied to the first transfer position, guiding one of the tools to automatically transfer equipment to move a first microelectronic workpiece to the bracket of the tool; To move the first microelectronic workpiece to one of the tools, a processing station A automatic transfer device to retrieve the first microelectronic timepiece from the bracket is manually connected to a second transfer position different from the first transfer position Transmitting a second microelectronic workpiece to the bracket; and a management station guiding the bracket to move the second microelectronic workpiece to the tool. The method described in item 82 of the patent scope of 83J, wherein when The support 108 200306611 manually transports the second microelectronic workpiece into the second transport position when the second transport position is entered. »The stent system includes when the bracket is transported to the first microelectronic workpiece to reach the bracket. When V is above, the transmission 84. Sending the second microelectronic workpiece according to the method described in item 82 of the scope of the patent application includes: positioning the m-transformer to be adjacent to the top of the 4 cover of the automatic conveying device through the second garment Take it to the automatic conveying device. Electronic workpiece, and the shield is limited to at least 85.-A method for using-having a first plurality of microelectronic workpieces, and supporting: :::, at the two first transfer position phase Separated second transfer position, the side: when the bracket is in a first transfer position, guide the worker to present an automatic transfer device to move the first night to put the electronic workpiece to the worker and the first bracket ; Guide the first multi-twist ^ # fork wood to move the first microelectronic workpiece into the worker and one of the first processing station eight guide the automatic transfer device to retrieve the first micro-electric Putian from the first bracket ^ First microelectronics The workpiece is captured by the automatic conveying device and / or the first branch of J Liri, manually transferring a second microelectronic workpiece to a second bracket of the tool; and a guide-+-M coin-bracket for moving The second microelectronic workpiece reaches a second processing station of one of the tools. 86. The method according to item 85 of the scope of application for a patent, wherein when the 109 200306611 second bracket is in the-separated from the-transfer position: the transfer position 'manually transfer-the second microelectronic workpiece to the The second bracket system includes transferring the second neutrino workpiece when the second bracket is positioned above the first transfer position. 87. A method for using a microelectronic workpiece, including: / mounting the microelectronic workpiece on a bracket, the bracket being held by a bracket holder positioned above a processing station Supported; when the microelectronic workpiece is carried by the bracket, lowering the microelectronic workpiece into the processing station; raising the microelectronic workpiece from the processing position and removing the microelectronic workpiece from the bracket; and along the One of the stent holders guides the path to move the stent away from the processing station. 88. The method as described in claim 87, wherein the processing station is housed in a housing, and wherein the method further comprises removing the bracket from the housing after moving the provincial bracket along the 忒 guide path . 89. The method of claim 87, wherein raising and lowering the microelectronic workpiece includes raising and lowering the microelectronic workpiece along a first axis, and wherein moving the support along the guide path includes The support is moved along a second axis transverse to the first axis. 90. The method according to item 87 of the scope of patent application, further comprising accessing the processing station after leaving the processing station by moving the support along the guide path. 110 200306611 91. If the 87th item of the scope of patent application is applied, the method of releasably holding the support ¥,) {α is further burdened. Hold ... at the selected location of the "follow-by-this" path. 2. A method for processing-microelectronic workpieces in a group with a row, the method including the processing device in the microelectronics: second-hand belt The first-terminal controller to hold _ the first micro-electric second-to-second phase isolation micro-band: Γ pieces in a first, and from the "¥ distance, and positioning the second micro The electronic workpiece is separated by a second distance from a second second arm, the second distance is different from the method described in item 92 of the patent range, and further includes a terminal controller and / or The second terminal controller determines that the first and second microelectronic workpieces are above the arm, so that the U-th electronic workpiece is overlapped with respect to the second microelectronic workpiece. 94. The method of claim 92, further comprising rotating the arm relative to one of the lifting paths of the arm and rotating the first terminal relative to a first rotation axis of one of the lifting paths. The controller positions one of the first terminal controllers adjacent to the processing station. 95. The method of claim 92, further comprising rotating the first terminal controller through a first plane relative to the arm, and rotating the second terminal controller through a second plane relative to the arm. The second terminal controls 111 200306611 state, and relative to the processing station, Lh Mucha turns his arms to position the first and second terminal controllers, where the first flat one, ^ 〇 brother face is not above the arm The father of the district in the area of Yu Haidi ^ a "plane. 9 6 · The method described in item 92 of the patent application scope is omitted, +, and • The method described in item 92 of the present country further includes rotating the -terminal controller and / or the second terminal controller to locate the-and A second microelectronic workpiece is above the arm so that the first microelectronic workpiece is overlapped with respect to the second microelectronic workpiece system; and the arm is moved along a linear path adjacent to the processing station row, and the The movement of the arm can move both the first and second workpieces along the lane. 97. The method according to item 92 of the scope of patent application, further comprising turning the first and second terminal controllers independently of each other around a common axis. Pick up, schema ... as next page 112