TH88087B - A method for creating three-dimensional circuit patterns on a photosensitive film using a technique of varying the light energy from a single light source. - Google Patents

Abstract

------May 22, 2020------(OCR) In creating 3D micropatterns using the adjustable light exposure method, the process is based on photolithography. This involves sample preparation, photoresist film coating, softbake, exposure to different energy levels with a stepper motor, development, and etching. Adjusting the exposure energy results in decreased photoresist film thickness as the energy increases, while the thickness of the underlying film changes proportionally to the thickness of the overlying photoresist film after plasma etching, regardless of the film material. Therefore, adjusting the exposure energy to match the movement of the stepper motor is crucial for achieving optimal micropattern creation. It is possible to create 3D micropatterns with varying film thicknesses and vertical sidewall slope profiles using a single plasma etching and cleaning process. ------------ DC60 (10/10/51) The creation of 3D micropatterns using this adjustable light exposure energy method is based on the normal photolithography process. It begins with sample preparation, photoresist coating, softbake, exposure with a stepper motor at different energy levels in different areas, development, and etching. By adjusting the light exposure energy, it was found that increasing the energy resulted in a thinner photoresist film, and the thickness of the layer below the photoresist changed according to the thickness of the layer above. After the chemical etching process, regardless of the film thickness... Regardless of the material type, adjusting the exposure energy to match the stage movement of the circuit board copier allows for the creation of 3D patterns with varying film thicknesses and vertical sidewall profiles using a single cycle of circuit board cleaning and chemical etching. This method of creating 3D circuit board patterns by adjusting the exposure energy uses a principle based on the normal photolithography process, starting with sample preparation, photoresist coating, softbake, exposure with a stepper machine at different energy levels for each defined area, development, and etching. Adjusting the exposure energy shows that increasing the exposure energy reduces the photoresist film thickness, and the thickness of the layer below the photoresist changes according to the thickness of the layer above. After the chemical etching process, regardless of the film thickness... Regardless of the material type, adjusting the light exposure energy to match the stage movement of the circuit board copier allows for the creation of 3D patterns with varying film thicknesses and vertical sidewall profiles using a single dry chemical etching and cleaning process.

Claims (2)

------22/05/2020------(OCR) 1. A method for creating three-dimensional circuit patterns on a photosensitive film, consisting of the following steps: surface preparation (cleaning), application of the photosensitive film to the surface, curing the photosensitive film, exposure to light using a circuit pattern reduction machine, circuit pattern cleaning, circuit pattern etching, and removal of the remaining photosensitive film. A specific characteristic is the exposure method, where the exposure energy is varied from 100-520 mJ/cm2 in each defined area, and the depth from the surface of the workpiece is directly proportional to the exposure energy. 2. A method for creating three-dimensional circuit patterns on a photosensitive film, as per claim 1, where in the etching step, the etch selectivity obtained from dry plasma etching is related to the change in the photosensitive film thickness (delta-photoresist thickness) obtained by varying the exposure energy after the cleaning process. 1. The method for creating three-dimensional circuit patterns on a photosensitive film consists of the following steps: - Substrate preparation - Coating the photosensitive film onto the substrate - Drying the photosensitive film on the substrate - Ezposure using a stepper motor, characterized by irradiation at different energies in specific areas, where the depth from the substrate surface is directly proportional to the irradiated light energy - Washing the circuit pattern - Etching the circuit pattern to remove the photosensitive film. 2. A method for creating three-dimensional circuit patterns on a photosensitive film, as per claim 1, where the etch-selectiveity obtained from dry etching is related to the Delta-resist thickness obtained by varying the light energy values.