TH18408B - Method for removing shiny wire - Google Patents

Abstract

This invention aims at a method for removing shiny wire scraps. It involves a process of cutting the shiny wire scraps, consisting of metal wire and a shiny coating, while stirring to obtain cut pieces. The shiny coating is then removed from the metal wire. Cut pieces with a length equal to or less than a predetermined value are selected from the rest, and the shiny coating is separated from the selected pieces. This method efficiently and cost-effectively separates the shiny coating from the collected shiny wire scraps without generating harmful gases or similar emissions.

Claims (17)

1. The method for removing shiny wire scraps involves several steps: cutting the shiny wire scraps, which consist of metal wire and a shiny coating, while simultaneously stirring the scraps to obtain smaller pieces and to remove the shiny coating from the metal wire; selecting small pieces of equal or lesser length than the predetermined length, where the predetermined length is 10 times the diameter of the shiny wire scraps; and finally, separating the shiny coating from the selected small pieces. 2. The method described in claim 1 also includes the step of cutting smaller pieces that are longer than the previously specified length while stirring these smaller pieces. 3. The method described in Claim 1, which involves the separation of the glossy coating from selected micro-pieces, is performed using a method chosen from a group of methods including specific gravity separation and electrostatic separation. 4. The method described in Claim 3, whereby the specific gravity separation method is one of the options among a group of liquid separation methods, the suction method, and the centrifuge method. 5. The method described in claim 1 involves performing the cutting procedure while the work is being carried out using a machine equipped with a cutting mechanism. 6. The method as described in claim 5, where the cutting machine has blades arranged at intervals of 20-50% of the diameter of the shiny wire scrap. 7. The method described in claim 1 involves the cutting procedure while stirring the shiny wire scraps and the selection procedure from the small pieces simultaneously. 8. The method described in Requisition 1 involves the process of separating the glossy coating from the small pieces using a flat plate with numerous holes. 9. The method described in claim 8, where numerous holes have a diameter on one side of such planar plate greater than the diameter on the other side of such planar plate. 10. The method for removing shiny wire scraps consists of the following steps: cutting the shiny wire scraps (consisting of metal wire and a shiny coating) into small pieces; removing the shiny coating from these small pieces; selecting small pieces with a length equal to or less than a predetermined length, where the predetermined length is 10 times the diameter of the shiny wire scraps; and separating the shiny coating from the selected small pieces. 11. The method described in claim 10, which also includes the procedure of cutting smaller pieces longer than the previously specified length while stirring such smaller pieces. 12. The method described in claim 10, whereby the process of separating the glossy coating from the selected small pieces is performed by a method chosen from a group of methods including specific gravity separation and electrostatic separation. 13. The method as described in claim 12, whereby the specific gravity separation method is one of the options among the group of liquid separation, suction, and centrifuge methods. 14. The method described in claim 10 involves performing the cutting procedure using a grinder equipped with a cutting tool. 15. The method as described in claim 14, where such cutting machine has blades arranged at intervals of 20-50% of the diameter of the polished wire scrap. 16. The method described in claim 10, in which the process of separating the glossy coating from such small pieces is performed using a flat plate with numerous holes. 17. The method described in claim 16 where numerous holes have a diameter on one side of such planar plate larger than the diameter on the other side of such planar plate.