TH170456B - Integrated I Chamber for Thermal Management of Calculation Devices - Google Patents

Abstract

The I chamber may be integrated with one or more computational equipment components to provide. Thermal management Sambor I may include The upper and lower parts that form the I chamber and the ring space. Between the top and bottom that includes the fluid The vapor chamber may be configured to absorb heat from The heat source of the device, subsequently calculated, a uniform heat transfer may cause the outer surface of Calculation devices can achieve almost the same temperature on the outside surface. Which may increase drainage The maximum power of the calculated device for the provided ambient temperature keeps the temperature of the computed device at Or below the safe extent while in use

Claims (1)

1. Complete set of machines A computational device, which is configured to absorb heat from the heat source of the computation device. Where the chamber i is integrated with the compute device's tactile display module (TDM). Which chamber I Also includes: the upper part which is attached to the TDM; The lower part that joins the upper and lower heat source: