TH143206A - Device for Cleaning an Encapsulating Device for Electronic Components - Google Patents

Abstract

DC60 (14/01/57) invention involves components (2) for cleaning the encapsulation device (1) for electronic components consisting of brushes (13) with brush assembly (14), drive (16) for Moving brushes (13), protruding contact components (10) and suction devices (12) the invention is also related to the encapsulation device (1) for components. Electronic equipment provided with such cleaning components (2) and to means for Clean encapsulation devices (1) for electronic components. The invention involves components (2) for cleaning the encapsulation device (1) for electronic components consisting of a brush (13) with a brush assembly (14), a drive (16) for moving the brush (13), Protruding exposed components (10) and devices Suction (12) The invention involves additionally with the encapsulation device (1) for the components. Electronic components are provided with such cleaning components (2) and the means for Clean encapsulation devices (1) for electronic components.

Claims (1)

Disclaimer (all) which will not appear on the advertisement page. : ------ 12/07/2018 ------ (OCR) Page 1 of 3 pages Disclaimer 1. Equipment for cleaning the encapsulation equipment for electronic components. That includes Encapsulation device (1) for electronic components and cleaning components (2), which includes: - brushes (13, 14, 30) supplied with number of brush components (15, 31). Driven (16, 17, 36) for moving brush (13, 14, 30) relative to encapsulation device (1) for electronic components. - exposed protruding components (10, 24, 25, 32, 41, 50) and - drop equipment provided with at least one suction opening (12, 26, 27, 33 , 42, 55, 56) positioned adjacent to exposed components (10, 24, 25, 32, 41, 50), with the drive (16, 17, 36) cut to move the brush. (13, 14, 30) along the protruding part (10, 24, 25, 32, 41, 50), then the protruding brush component (15, 31) is moved. Together by exposed protruding components (10, 24, 25, 32, 41, 50) that are characterized by which Exposed exposed components (10, 24, 25, 32, 41, 50) are \ 'paired to the encapsulation device (1) for the electronic component. And the open end in that suction (12, 26, 27, 33, 42, 55, 56) is rated above. The opposite side of the exposed protruding component (10, 24, 25, 32, 41, 50) 2. The device, as entitled in claim 1, is characterized by the brush component (15, 31). Carry (31) 3. The equipment, as it is entitled to claim 2, is characterized by which the (31) is made of plastic 4. The device according to the right in the 1st or 2nd claim is characterized by that The exposed component (10, 24, 25, 32, 41, 50) extends 5. The device, as held by claim 1 or 2, is characterized by which Exposed exposed components (10, 24, 25, 32,41,50) form multiple designs (52, 53, 54) 6. The device, as held by claim 1 or 2, is characterized by At the brush (13, 14, 30) there is a pattern that extends from the one moving in a longitudinal direction relative to the protruding tangent component (10, 24, 25, 32, 41, 50). The right to claim 1 or 2 is characterized by the driver (16, 17, 36) comprising at least one electric motor (16). Claims 1 or 2 are characterized in that brushes (13, 14, 30) are provided with an open end in at least one supply (34, 35) for gas, page 2 of the number 3. 9. Equipment as held in claim 1 or 2 is characterized by which Cleaning components (2) are also provided with an ionizer 1 0. An encapsulation assembly device (1) for electronic components that are Provide with cleaning components (2) as it holds in any of the right claims on Previous claim Where the encapsulation device (1) for electronic components Was provided too - At least two molded parts (3,20) are moved relative to each other and converted to Bonded electronic components for encapsulation and - tool! Lean (8, 9) for encapsulation material, connected to mold cavity (7) indicated by mold part (3, 20) and enclosing component. Encapsulation electronics 1 1. Enclosures (1) for electronic components As held by claim, Claim 10 is characterized by the exposed exposed component (10,24,25, 32,41, 50) extending outside the contact surface (11, 51) of the section. In the molded parts (3, 20) 1 2. The assembly of the encapsulation device (1) for electronic components. As held by claim 10 or 11, it is characterized by the encapsulation device (1) for electronic components. It consists of a greater number of parts exposed to the protrusion. Come out (10,24,25,32,41,50) 1 3. Method for cleaning the encapsulation device (1) for components electronics This includes the process of going through the process. A) cleaning of the exposed side of molded parts (3, 20) of the encapsulation device (1) for electronic components by moving the brush relative (13, 14, 30) B) brush conductivity (13, 14, 30) comes into contact with exposed protruding components (10, 24, 25, 32, 41, 50), which are matched with encapsulation devices (1) for electronic components and brush travel (13, 14, 30). ) Relative to the exposed component (10, 24, 25, 32, 41, 50), so the brush component (15, 31) of the brush (13, 14, 30) is touched by the exposed component (10, 24 , 25, 32, 41, 50) and brush components (15, 31) move relative to each other and C) extraction of ambient air on opposite sides of exposed protruding components (10, 24, 25, 32, 41). , 50), at least while the throughput process B), therefore, air is vented at the location of the brush components that move together (15, 31) 1 4. The method, as it holds the right to clause Holds the 13th right to be characterized by the brushes (13, 14, 30) being transported inconsistently along the exposed exposed components (10, 24, 25, 32, 41, 50) during the passing process. B) process page 3 of the amount 3 pages 1 5. Method of holding the right to the claim that 13 or 14 is characterized by which step B) and C) passes are performed while the brush (13, 14, 30) approaches the exposed side. Was cleaned of molded parts (3, 20) of the encapsulation device. (1) for ingredients Electronic 1 6. The method by which Claims 13 or 14 are characterized by the procedure. Processing B) and C) were performed while the brushes (13, 14, 30) were eliminated from the exposed contact side. Cleanliness of molded parts (3, 20) of the encapsulation device. (1) for ingredients Electronic ------------ 1. System (system) that includes Shrouds (1) for electronic components and components (2) for cleaning. Which includes: - brushes (13,14,30) provided with a number of brush components (15,31) - drives (16,17,36) for brush moving (13,14,30) With encapsulation device (1) for electronic components - exposed protruding components (10,24,25,32,41,50) and - A suction device provided with at least one suction opening (12,26,27,33,42,55, 56) positioned close to the exposed protruding component (10,24,25 , 32,41,50) where the body Propulsion (16,17,36) has been modified to move the brush (13,14,30) along the exposed components. Protruding (10,24,25,32,41,50), so the protruding brush component (15,31) is moved relative to Together by exposed protruding components (10,24,25,32,41,50) that are characterized by which The exposed protruding components (10,24,25,32,41,50) are paired with the encapsulation device (1) and The open end in that suction (12,26,27,33,42,55,56) is arranged on the opposite side of the component. Touch protruding (10,24,25,32,41,50)