TH101075A - Devices and methods for pre-treating electronic components before soldering. - Google Patents

Abstract

DC60 (05/07/16) The invention involves a device for reflow soldering of a workpiece. Solder metal (2), interpolation (3) are applied for component arrangement of workpieces. To be brazed to that through the use of a soldering process and a soldering area (4) where the soldering process is accomplished by heating the workpiece to be provided. Where the fabricated device is characterized as a plasma device (5) for plasma treatment. Where the atmosphere of the workpiece is provided at the source of application of the solder (2) and / or at the origin of the soldering area (4). Moreover, the fabrication involves a method for soldering. A reflow workpiece, where the solder is initially applied onto the workpiece and the workpiece is supplied. There is then a component that will be soldered onto the workpiece, where the provided workpiece is placed. In the soldering area (4), where the workpiece is subjected to a brazing process by heat treatment. The workpiece is provided, and where the fabricated method will have the characteristics that the workpiece will be taken. Atmospheric plasma was treated with plasma devices (5) prior to the application of the solder and / or prior to the soldering process. Edit summary of the invention 05/07/2016 Invention will involve a device for reflow soldering of a workpiece. Solder metal (2), interpolation (3) are applied for component arrangement of workpieces. To be brazed to that through the use of a soldering process and a soldering area (4) where the soldering process is accomplished by heating the workpiece to be provided. Where the device is fabricated It is characterized as being a plasma device (5) for plasma treatment. Where the atmosphere of the workpiece is provided at the source of application of the solder (2) and / or at the origin of the soldering area (4). Moreover, the fabrication involves a method for soldering. A reflow workpiece, where the solder is initially applied onto the workpiece and the workpiece is supplied. There is then a component that will be soldered onto the workpiece, where the provided workpiece is placed In the soldering area (4), where the workpiece is subjected to a brazing process by heat treatment. The workpiece is provided, and where the fabricated method will have the characteristics that the workpiece will be taken. Atmospheric plasma was treated with plasma devices (5) prior to the application of the solder and / or prior to the soldering process. -------------------------------------------------- ---------------------- The invention involves a device for reflow soldering with a solder application (2), a Interpolation (3) for arrangement of workpieces with components to be welded and fabricated. With the workpiece by using the method of soldering, and the soldering area (4) where the process The solder is accomplished by heating a registered workpiece, characterized by a plasma device (5) for plasma operations. At the atmosphere of The workpiece will be prepared for a solder (2) and / or source application. Of the soldering area (4)

Claims (9)

Disclaimer (all) which will not appear on the advertisement page: EDIT 05/07/2016 1. Equipment for reflow soldering with the application of solder (2), preparation device (3) for preparing the workpiece with components to be brazed to. That by the soldering process and the soldering area (4), where the soldering process takes place by providing Heat the prepared workpiece, where the plasma unit (5) for plasma treatment at The workpiece atmosphere is provided at the source of application of the solder (2) and / or at the origin of the soldering area (4), characterized by what the plasma unit (5) will achieve. Been formed to give Suitable for the generation of flames to plasma without potential. 2. The device according to claim 1, which has the characteristics that the plasma unit (5) will have a transport device. This makes it possible for the plasma flame to be immobilized 3. The device according to one of Clause 1 and Clause 2, which is characterized as a plasma unit (5). One or more units will be formations and / or be installed in a manner that will It is possible to conduct plasma on two sides, especially on opposite sides, for example on the top and bottom of the workpiece 4. Method for soldering reflowed workpieces, Where the solder will be applied To begin with the workpiece, the workpiece is then prepared with the components to be soldered on, and the prepared workpiece is inserted into the soldering area (4) where it is. Get carried away Through the brazing process by heating the prepared workpiece, where the workpiece will be It was then treated with atmospheric plasma with the use of a plasma unit (5) before the solder was obtained. The application and / or before the soldering process has been performed, with the characteristics that Potential-free plasma flames will be adopted 5. Method according to claim 4, which has the characteristics that The perforated part that contains the metal The solder will be applied to the workpiece. 6. Methods according to any of Clause 4 and Clause 5, that are characterized by how the plasma flame is formed. By adding gas to a process, in which gas is processed, the process used is gas. Or mixtures of gases in which reducing actions are performed. 7. Methods in accordance with any of Clause 4 to Clause 6, that are characterized by a certain amount of plasma flame, are used for Operation of the workpiece 8. Methods according to any one of Claims 4 to 7, that are unique in that plasma operations will be performed on two areas, in particular. On opposite sides, for example on the top and bottom of the workpiece -------------------------------------------------- --------- 1. Equipment for reflow soldering with the application of solder paste (2), interpolation (3) for the arrangement of the workpiece. Components to be welded and fabricated With the workpiece by using the method of soldering, and the soldering area (4) where the process The solder is accomplished by heating a registered workpiece, characterized by a plasma device (5) for plasma operations. At the atmosphere of The workpiece is prepared to be applied to solder (2) and / or source. Of the soldering area (4) 2. Equipment according to the claim clause 1, the characteristics that the plasma device (5) will be positioned So that the PLMA device is suitable for producing PLMA flame 3. The equipment according to claim 1 or 2, which is unique to the PLASMA (5) device, is a transport system that will make it possible to cause a plasma flame to change at 4. Equipment according to any of the claims 1 to 3, specific characteristics that One or more PLASMA devices (5) will be designed and / or rated. It is believed that the plasma device is feasible to achieve the results of plasma operations. Two-sided, preferably on opposite sides respectively, for example on the top and on Bottom of the workpiece 5. A method for reflow soldering of hard pieces, where the solder is initially applied on it. Workpieces and workpieces are subsequently arranged with components that have been soldered on. Workpiece, where the provided workpiece is inserted into the solder area (4), where the workpiece It has been carried out through a soldering process by heating the workpiece to be supplied, with the characteristics that the workpiece is also subjected to atmospheric plasma treatment. The use of plasma devices (5) before the application of solder and / or before the soldering process. 6. Method according to claim 5, which is unique in that the solder nipple is applied onto the workpiece. 7. The method according to claim 5 or 6, which is characterized by how the plasma flame will be produced. By adding a natural gas to a process, where the gas or gas mixture is to be performed in a manner Reducing is used as a process gas. 8. Methods according to any one of the claims 1 or 7, which are characterized as non-plasma Zad will be used 9. Means according to any clause 5 or 8, that are characterized as a flame. Several types of plasma are used for performing the workpiece 1. 0. A method based on one of the clauses 5 or 8, which is unique to the operation. Two-sided plasmas are accomplished, especially on opposite sides. Respectively, for example, on the top and bottom of the workpiece