SU946834A1 - Apparatus for soldering - Google Patents

Description

(54) DEVICE FOR SICK

one

The invention relates to soldering and can be used, for example, in instrument making, for soldering in hard-to-reach and remote locations.

A soldering device is known which contains a solder rod in the form of a sealed tube filled with a heat-transfer fluid and provided with a heater and a working edge. In this device, the heat carrier during the soldering process does not change the state of aggregation and acts as a thermal battery I.

A soldering device is known that contains a solder rod in the form of a tube sealed with an axial channel with zones of evaporation, condensation and transport, on the inner surface of which a capillary-porous layer soaked in a lightly evaporating heat-transfer fluid is placed.

In this device, in the process of soldering the coolant changes its aggregate state, with the return of the liquid phase of the coolant to the evaporation zone carried out by a capillary-porous layer. The device has the property of super thermal conductivity and provides soldering in hard-to-reach and remote locations 2.

However, the temperature fluctuations of the heater are almost unchanged transferred to the working area, which can negatively affect the performance and quality of the soldering process.

The purpose of the invention is to increase the productivity and quality of the soldering process by stabilizing the heat flux in the working area.

Claims (2)

This goal is achieved by the fact that the soldering device, containing a floating rod in the form of a tube sealed with an axial channel with evaporation, condensation and transport zones, on the inner surface of which a capillary-porous layer soaked with easily evaporating heat-transfer fluid is placed on it, has a cylindrical vortex chamber a capillary-porous layer installed in the transport zone, a diaphragm fixed in the axial channel in front of the vortex chamber and the bypass channel, one end of which is connected to the axial channel ne Power diaphragm, and the other provided with a nozzle, tangentially connected to the inner cavity of the swirl chamber. The drawing shows a device for soldering. The soldering device comprises a solder rod 1 in the form of a sealed tube 2, on the inner surface 3 of which is placed a capillary-porous layer 5 impregnated with easily evaporating heat-transfer fluid 4, forming an axial channel 6 with an evaporation zone 7, a condensation zone 8, equipped with a heater 9, respectively and working edge 10. To increase the productivity and quality of the soldering process by stabilizing the heat flow in the working area, the device is equipped with a vortex chamber 11 with a cylindrical side wall 12, flat face and flaps 13 and 14, radial 15 and central 16 channels connected to the axial channel 6 from the side of evaporation zone 7 and condensation zone 8, a diaphragm 17 installed in the transport zone in front of the radial channel 15, and bypass channel 18, one end 19 of which connected to the axial channel 6 in front of the diaphragm 17, and the other 20 to the nozzle 21 tangentially entering the radial channel 15 into the internal cavity 22 of the vortex chamber 11 covered by a capillary-porous layer 23 connected to the capillary-porous layer 5 of rod 1. Device driver running obraPod following exposure to the heat flux nagrevat .el 9 legkoispar yuschiys liquid coolant 4 impregnated wick-porous layer 5 in the area 7 evaporation. Boils, enters the gaseous phase, the reserve latent heat of vaporization, through the diaphragm 17 in the form of a laminar jet flows from the radial channel 15 into the central channel 16, testing from the side of the vortex chamber And the minimum hydraulic resistance, in zone 8 condensation gives off heat to the working zone and condensing in the liquid phase is transported by capillary forces of the capillary-porous layer 5 of the axial channel 6 and the capillary-porous layer 23 of the vortex chamber 11 back to the evaporation zone 7. When the heat flux changes, for example, increases, the pressure in front of the diaphragm 17 increases, the flux through the bypass channel 18 grows, and from the nozzle 21 a stream flows from the radial channel 15 to deflect it from the radial direction, causing the flow in the vortex chamber 11 to twist and its motion acquires a vortex character. In this case, the vortex axis (its core) coincides with the axis of the central channel 16, the hydraulic resistance of the vortex chamber 11 increases, and the flow through the central channel 16 decreases, respectively, reducing the heat flux in the working area as it increases in the evaporation zone 7. As the heat flux decreases, the hydraulic resistance of the vortex chamber 11 decreases accordingly. The active change in the hydraulic resistance of the vortex chamber 11 makes it possible to stabilize the heat flow in the working area and to improve the performance and quality of the soldering process. The invention of the device for soldering, containing a pale rod in the form of a tube sealed with an axial channel, with zones of evaporation, condensation and transport, on the inner surface of which is placed a capillary-porous layer impregnated with a lightly evaporating liquid coolant, characterized in that increase of productivity and quality of soldering due to stabilization of the heat flow in the working area, the device is equipped with a cylindrical vortex chamber with a capillary-porous layer installed in the transport zone, a diaphragm oh fixed in the axial channel to the vortex chamber and the bypass line having one end connected to the axial channel to the diaphragm, and another. equipped with a nozzle, tangentially connected to the internal cavity of the vortex chamber. Sources of information taken into account in the examination 1. USSR author's certificate number 624739, cl. In 23 K 3/02, 15.05.74. 2. USSR author's certificate number 316537, cl. In 23 K 3/02, 02.03.70 (prototype).