SU836049A1 - Epoxy composition - Google Patents

Description

(54) EPOXY COMPOSITION

This invention relates to fast-curing composite materials based on oligoester acrylates and epoxy resins. The proposed composition is intended for the manufacture of products for structural and electrical insulation purposes, mainly by low pressure casting. In addition, it can be processed by pouring it into open forms and used as an impregnating compound. Oligoether acrylate epoxide Hbie composition 1 is known, which is characterized by a long gelation time (more than 2.5 hours), which excludes the possibility of their processing by high-performance methods, for example, at low pressure installations. A fast-curing composition for the liquid phase molding is also known, comprising an epoxidine oligoacrylate, a resin, and a curing system 2j. The composition of this composition is as follows, wt.%: DL, -Trimethacryl- (biopentaerythritol adipate) (oligoether acrylate 7-1) 25-58 Epoxy-dianine resin ED-2022-40 iso-Methyltetrahydrophthalic anhydride (curing agent iso-MTHFA) 19-34-4, 6-Tris-Dimethylaminomethyl -phenol (UP-606/2 accelerator) 0.5-0.7 Polymerization initiator - dicumyl peroxide 0.3-0.5 The composition of the above composition has a low initial viscosity (not more than 210 cP at 50 ° C) and a short curing belt to form-resistant. .OUR SHEEP (not more than 50 s per 1 mm of the product thickness) required for processing by casting under low pressure. At the same time, it has good physical and mechanical and ––––––––––––––––––––––––––– The disadvantages of the known composition include: 1) low elasticity (elongation at rupture Tie more than%, pre.p tensile strength at stretching 250-300 kgf / / cm, impact strength ks cm / cm2) combustibility (easily ignites and completely burns under phasing). These drawbacks reduce the Fiadezhnosti obtained products and limit their scope.

ciu o

((ll2 --- C-C-OCH: 2 20)

0SSTS p N C-OCH2 (ll20-C C Cll2

1O C

I II I

0-OH2 (1H. In the following ratio of components, in its 7: The condensation product of trichlorophosphazoperchlorethane with ethylene glycol monomethacryate and ethylene glycol 21-35 Epoxy-dynyuva resin 35-42 Supplement i-MTHA 29-35, UP-606 Accelerator -66 Accelerator, -66 Accelerator -66. 0, Dicumyl peroxide 0.3-0. Used oligoether acrylate is obtained by condensation of trichlorophosphazoperchloroethane With monomethacrylate, these lenglycol and ethylene glycol under known conditions of Hz. The use of this oligoarycrylate at the proposed ratio of components allows for difficulty. and elastic material with elasticity (elongation at break increases by 1.34, 5 times, tensile strength by 1.6-2.7 times, specific impact viscosity by 1.1-3.8 times) while maintaining the electrical insulating properties and high-speed mode of curing the known composition. Below are examples of the formulations of the proposed quick-curing composition, wt.%: No. I. The condensation product of trichlorophos-phiperlochloroethane with mons

CCL,

about SNS

one)

Sch 9 The aim of the invention is to reduce the efficiency and decrease the wear rate of the: - composition. The goal is achieved by the fact that the composition containing oligozofiracrylate, epoxy resin, the hardener is czome-meth. Tetrahydrophthalic anhydride, the curing accelerator is 2,4,6-tris (cymethylamipomethyl) phenol and as an oligo ether chromo. trichlorophosphazoperchloroethane with ethylene glycol monomethacrylate and ethylene glycol of the formula ethylene glycol methacrylate (MEG / and ethylene glycol Epoxy diane ED-20 Hardener i-MTHFA Accelerator UP-606/2 Peroxide of dicumyl No. 2. Conduct of condensate trichlorophosphazoperchloroethane with MEG and ethylene glycol Epoxide dianova resin ED-20 Iso-MTHFA hardener Accelerator UTs-606/2 Distressed Uniforms encompany with the MEG and ethylene glycol Epoxydehyde, asparates asparates, trichlorophosphoroperchlorethane with MEG and ethylene glycol Epoxydone, asparates Dicumyl peroxide (R 4. Condensation product of trichlorophosphazo-perchloroethane with MEG and ethyl glycol Epoxy-dianin ED-20 resin Hardener from MTHPA Accelerator UP-606/2 Dicumshg peroxide

The compositions are prepared by mixing the components on a typical mixer at room temperature for 3040 minutes. If necessary, the composition may be introduced mineral or organic filler.

Test specimens are obtained by free pouring into molds heated to 150-160 ° C. The cure time for you to reach a shape-stable state is

, with

Self-burning time when tested by the method of a fire tube, with

Weight loss when tested by the method of the fire tube,%

Destructive voltage (in kgf / s) at:

stretching

compression

bend

The proposed composition can be used for the manufacture of parts for electrically insulating and structural purposes in low pressure casting plants. This metal processing will allow to increase labor productivity by 3-5 times in comparison with the pressing method, and by 8-10 times in comparison with the free filling method, to improve the quality of products. The achieved level of compositional characteristics of elasticity and fire resistance allows to significantly expand the scope of its application beyond

keep equal to 30-50 s per 1 mm of sample thickness. Cured samples are heat treated outside the mold at a temperature of 6 hours.

The properties of the proposed cured composition according to the formulations 1-4 are given in the table. The comparison table also shows the corresponding indicators of the known composition of the prototype.

230

280

220-280

210

230-360

13

ten

ten

14.8

14.1

18.7 95-100

expense of such industries as aircraft, ship and automobile. Formula of invention

Epoxy composition, including oligomethyl acrylate, Epoxy resin, resin, hardener - isomethyltetrahydrophthalic anhydride, curing accelerator - 2,4,6-tris- (dimethylaminomethyl) phenol and the initiator of polymerization - clementum peroxide, as well as a hardening agent, a cpl, anhydrous acid, anhydrous anhydride anhydrite, clenched polyacrylate and increase the elasticity in the cured state of sv.stv contains

in the following ratio tov, wt.%:

Condensation product

trichlorophosphazoperchloroethane with ethylene glycol monomethacrylate and

ethylene glycol

Epoxy Diane Resin

iso-Methyltetrahydrophthalic anhydride

2,4,6-tris-SCM-methylaminomethyl) -phenol

Peroxide dicumila

Sources of information taken into account in the examination

one . Handbook of plastics. Ed. V.M. Kataev et al., M., Khimi, 1975, T. 2, p. 225, 235.

2. USSR author's certificate number 642341, cl. C 08 L, 63/02, 1977fntototype.

3. USSR author's certificate in application number 2374567 / 23-04, cl. From 07 P 9/24, 1976. curing regimen, it is the quality of oligo ether ratchlNO (5Hg 4-S-OCH2CH20) jPH 0-OCH2dH200y Jl5o (Jlfs RK C-OCH2CH20-C-C CH: 2 1U f 0-OH2CH20 - ((Jll2 perchloroethane with monomethac and t-cm:) tylenglycol and these, g1en) 11 cm formula

Claims (1)

Claim An epoxy composition including oligoether acrylate, epoxy resin, hardener - isomethyltetrahydrophthapic anhydride, a curing accelerator - 2,4,6-tris- (dimethylaminomethyl) -phenol and a polymerization initiator - dicumyl peroxide, which is characterized by the fact that cured elasticity J while maintaining the electrical insulating properties and curing time, it contains, as an oligo ester acrylate, the condensation product of trichlorophosphazoperchlorethane with monomethacrylate, these glycol glycol and ethylene glycol of the formula C-OCH ₂ CH ₂ 0) ₂ “PS = C-0CH ₂ dtt ₂ ° ~ _About? <1J J cir _s -p -c = C -os n ₂ Cll ₂ 0-C- 0 = CH ₂ IJ? ^NZ O-CH ₂ CH ₂ O-cc = Cn ₂ in the following ratio of components, wt.%: The condensation product of trichlorophosphazoperchloroethane with monomethacry.pa- volume of ethylene glycol and ethylene glycol 21-35 20 Epoxy resin 35-42 iso-methyltetrahydrophy- left anhydride 29-35.7 2,4,6 — tris— (Dimethyl- nomethyl) phenol 0.7-0.8 Dicumyl Peroxide 0.3-0.5