SU810750A1

SU810750A1 - Glue

Info

Publication number: SU810750A1
Application number: SU792709036A
Authority: SU
Inventors: Сергей Костандович Григорян; Норайр Манвелович Бейлерян; Межлум Левонович Ерицян
Original assignee: Предприятие П/Я В-2756
Priority date: 1979-01-08
Filing date: 1979-01-08
Publication date: 1981-03-07

Description

1one

Изобретение относитс к области получени клеев на основе эпоксидных смол, используемых в различных отрасл х народного хоз йства, в частности дл склеивани металлических материалов п пластмасс , например дл склеивани деталей в радиопромышленности.The invention relates to the field of producing adhesives based on epoxy resins used in various sectors of the national economy, in particular for bonding metallic materials and plastics, for example for bonding parts in the radio industry.

Известны клеевые композиции на основе эпоксидных смол и целевых добавок, отверждаемые металлорганическими комплексами , папример хелатными соединени ми .металлов 1. Известные клеи отверждаютс при сравнительно высоких температурах - 120°С ц выше и длительное врем - 30-90 мин.Adhesive compositions based on epoxy resins and target additives are cured by organometallic complexes, for example with chelate compounds of metals 1. Known adhesives are cured at relatively high temperatures — 120 ° C above and for a long time — 30-90 minutes.

Известны также клеи на основе эпоксидных смол, отверждаемые аммиными отвердител ми, например диэ1иленамином, полиэтиленамином, гексаметилеидиамином, сложными аминами на основе кубовых остатков , триэтиленамином, дициандиамидом и т. д. 2.Epoxy-based adhesives are also known, which are cured by ammine hardeners, for example, dimethyl amine, polyethylene amine, hexamethylyl diamine, complex bottom amine amines, triethylene amine, dicyandiamide, etc. 2.

Указанные клеи двухкомпонеитные, отверждаютс при 20°С в течение 3 ч или при 25°С в течение 5 сут и имеют сравнительно иизкие прочностные показатели.These adhesives are two-compositeone, cure at 20 ° C for 3 hours or at 25 ° C for 5 days and have relatively low strength properties.

Наиболее близким по технической сущности и достигаемому результату к предложенному вл етс клей, включаюишйThe closest in technical essence and the achieved result to the proposed is glue, including

эпоксидную диановую смолу, бутаднеиакрилоннтрнльный каучук, наполнитель и отвердитель - ариленхинон 3. Известный клей имеет длительное врем и высокую температуру отверждени (20 мин, 170°С). Целью изобретени вл етс снижение температуры и сокращение времени отверждени кле .Diane epoxy resin, butandiacrylonol rubber, filler and hardener - arylenquinone 3. The known glue has a long time and high curing temperature (20 minutes, 170 ° C). The aim of the invention is to reduce the temperature and shorten the curing time of the glue.

Цель согласно изобретению достигаетс тем, что клей, включающий эпоксидную диановую смолу, бутадиенакрнлонитрильный каучук, -отвердитель и наполнитель, в качестве отвердител содержит смесь металлорганического комплекса, органической гидроперекиси и аминоспнрта нрн следующем соотношении компонентов, .мае. %: Эпоксидна дианова смола41,7-86,2Purpose according to the invention is achieved by the fact that glue, including epoxy resin, butadiene-acrylonitrile rubber, α-hardener and filler, contains a mixture of organometallic complex, organic hydroperoxide and amino acid nrn as a hardener, the following ratio of components, may. %: Epoxy Dianova resin 41,7-86,2

БутадиенакрилоннтрильныиButadiene acrylononthrinyl

каучук4,3-22,3rubber4,3-22,3

Наполнитель(J,4-27,9The filler (J, 4-27,9

Металлорганический комплекс2,6-6,7Organometallic complex 2.6-6.7

Органическа гидроперекись0,3-0,7Organic Hydroperoxide 0.3-0.7

Аминоспирт0,2-0,7Aminoalcohol0,2-0,7

В качестве эпоксидной диановой смолы используют, например. ЭД-20, Э-16.For example, epoxy resin Dianova is used. ED-20, E-16.

В качестве бутадиенакрилонитрил15ного каучука используют, нанрнмер, СКН-26-, СКН-18.As butadiene acrylonitrile 15n rubber, nanrnmer, SKN-26-, SKN-18 is used.

Claims

Table 1 As a filler used, for example, kaolin, Aerosnl, asbestos. As the organometallic complex, divalent metal acetates are used — cobalt and nickel, divalent copper acetylacetonate, trivalent manganese anethnanetonate, and cobalt acetylacetonate. As organic hydronerekns use cumene hydronerex n benzoic acid. As the amino alcohol is used, for example, triethanolamine, diethanolamine. Technology for producing glue. With stirring, the calculated amount of SCM-26-1 rubber and nanolitel (kaolin) is added to the epoxy resin preheated to 40 ° C. After homogenization of the medium, a pre-prepared mixture of organometallic complex with ammonia alcohols is added. Then, stirring is continued at this temperature for another 1.5-2 hours, after which the temperature is brought to 20 ° C and the calculated amount of hydroperoxide (cumene) is added. In tab. Figures 1 and 2 show the compositions of glue and their properties as compared with the known ones. ST-3 steel was used as a substrate for the study of indicators. As can be seen from the above, the use of an organometallic complex, hydroperoxide of organic compounds and ammonia alcohol as a hardener during curing of adhesives based on epoxy resins and butadpenacrylonitrile rubber allows the temperature and time of curing of the adhesive to be sharply reduced compared to known hardeners. The manufacturing technology of the glue is simple, the components of the glue are manufactured by the domestic industry, which allows the glue to be introduced into production. The adhesive is intended to be used in the radio engineering industry, where the bonding of metal substrates is carried out at low temperatures (no more than 90 ° C) and short time (no more than 15 minutes). The invention Glue, including epoxy resin Dianova, butadiene-acrylonitrile rubber, hardener and filler, is different from the fact that, in order to reduce the temperature and cure time, it contains as a hardener a mixture of organometallic complex, organic hydroperoxide and aminosirc in the following ratio Components, May. %: Epoxy resin Dianova resin41,7-86,2 Butadiene acrylonine rubber 4,3-22,3 Filling agent 6,4-27,9 Organometallic complex 2.6-6.7 Organic hydroneoxys0-3-0.7 Aminoalcohol0.2-0.7 Sources information taken into account during the examination 1. USSR author's certificate 633277, cl. From 09 J 3/16, 1976.

2. Kardashov D. A. Synthetic adhesives. M., 1976, p. 104-106.

3. USSR author's certificate number 670176, cl. C 09 J 3/16, 1977 (prototype).