SU804269A1

SU804269A1 - Soldering method

Info

Publication number: SU804269A1
Application number: SU792713921A
Authority: SU
Inventors: Игорь Петрович Чекунов; Владимир Ильич Чижиков; Евгений Евгеньевич Смирнов; Иван Александрович Бусыгин; Александр Федорович Лукьянов
Original assignee: Предприятие П/Я В-2190
Priority date: 1979-01-16
Filing date: 1979-01-16
Publication date: 1981-02-15

Description

(54) СПОСОБ ПАЙКИ(54) METHOD OF PIKA

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Изобретение относитс к пайке, а именно к способу повышени технологических характеристик припо и может быть использовано при пайке сборочных единиц готовым припоем в нейтральных газовых средах припо ми, содержащими летучие компоненты.The invention relates to soldering, in particular, to a method for improving the technological characteristics of solder and can be used when brazing assembly units with ready solder in neutral gaseous media with solder containing volatile components.

Основной трудностью пайки готовыми припо ми, в особенности, содержащим компоненты с высокой упругостью испарени (цинк, марганед, кадмий и дв) в среде аргона, азота, гели и других газовых средах вл етс низка их растекаемость по па ному металлу .The main difficulty in brazing with ready-made solders, in particular, containing components with high evaporation elasticity (zinc, manganese, cadmium and two) in argon, nitrogen, gels and other gaseous media, is their poor flow of metal to the metal.

Дл повышени растекани припо обычно примен ют флюсы или покгнлти из чистых металлов.Fluxes or pure metals are usually used to increase solder spreading.

Так, например, рекомендуетс способ улучшени растекани припоев за счет применени покрытий из неметаллических веществ (па льные флюсы) 1Thus, for example, a method for improving the flow of solders through the use of coatings of non-metallic substances (pale fluxes) 1 is recommended.

Флюс в виде покрыти наноситс на заготовки припо перед пайкой. Применение фJ1юca обеспечивает снижение поверхностного нат жени припо , уменьшает испарение легколетучих кс 1понентов и улучшает растекаемость припо в процессе нагрева под пайку. The flux in the form of a coating is applied to the solder blanks before soldering. The use of the fusion system reduces the surface tension of solder, reduces evaporation of volatile components, and improves the flowability of solder during the heating process for brazing.

Недостатком данного способа вл етс повышенна пористость па ных соединений и необходимость удалени остатков флюса после пайки.The disadvantage of this method is the increased porosity of the solder joints and the need to remove flux residues after soldering.

Наиболее близок к предлагаемому способу нанесени металлического покрыти на заготовку припо вл етс способ по улучшению растекани припоев за счет нанесени на заготовку припо на основе меди-динка серебр ного , гальванопокрыти толщиной 3-5мм. Покрытие не только улучшает растекани припо , но и несколько снижает температуру пайки, повышает прочностные характеристики па ного соединени 2).Closest to the proposed method of applying a metal coating on the workpiece is soldering a method for improving the flow of solders by coating copper, copper, silver, and copper-plated solder on the workpiece, electroplating with a thickness of 3-5 mm. The coating not only improves the flow of solder, but also slightly reduces the soldering temperature, increases the strength characteristics of the brazed joint 2).

Недостатком данного способа вл етс высока стоимость и дефектность металла йокрыти -серебра, больша трудоемкость нанесени , а также отсутствие флюсующих свойств покрыти .The disadvantage of this method is the high cost and defectiveness of the metal ikryti-silver, the greater complexity of application, as well as the lack of fluxing properties of the coating.

Цель изобретени - повышение растекани припо и снижение температуры пайки.The purpose of the invention is to increase the flow of solder and reduce the soldering temperature.

Claims

This goal is achieved by taking a self-fluxing alloy powder having a melting point close to that of soldering as a coating. For example, copper-phosphorus powder etc. is used for brazing copper. Solder has a relatively high soldering temperature () and when: soldering in argon and especially in the vacuum vacuum forms insufficient quality compounds due to poor flow through the material due to the intense evaporation of marga ga during the heating process. In order to increase the flow of solder onto the surface of the workpiece (ring), a self-fluxing powder alloy 5A (chromium 12%; silicon 8%, iron 6% boron 0.50%; nickel else) is made in the form of a paste, made on an acrylic resin, dissolved in a solvent. P-5, melting point of alloy 5A-1180 ° C, and melting point) G40NH-1100 ° C. Solder paste is made by thoroughly mixing 5A solder powder with CONNECTION (5% acrylic resin, the rest is solvent P-5) in a stainless container Steshi with hermetically closable lid. Paste pripr, creamy consistency was applied with a thin layer on the workpiece solder with a brush or dipping method. After evaporation of the solvent from the paste, the lippot ring was applied to the joint joint, which was placed in the heating device of the UFT-2 unit for brazing in argon. In the process of heating for brazing, the flux-free coating itself melts and interacts with the G4NH solder ring, this removes the oxide film and reduces the surface tension of the molten solder, in addition, the soldering temperature decreases by 20-25 seconds. Testing showed that the use of a self-flux coating on the solder billet reduced the soldering temperature with G2NOX solder and significantly improved the quality of formation of the solder joints of 12Kh18N10T steel pipelines by improving the flow of G4NOH solder without deteriorating the characteristics of the solder joints. The application of the proposed method in the production will allow improving the quality of the solder joints of pipelines, eliminating defects in non-propelled pipes and sinks. This method can also be used when brazing other assembly units made with ready-made solder containing easily evaporating components in an environment of neutral gases. The invention is a method of brazing with ready-made solder, in which a coating is applied to the surface of the solder blanks, characterized in that, in order to increase the flow of solder and lower the brazing temperature, a self-fluxing alloy with a melting temperature close to that of the solder is used as a coating. Sources of information taken into account in the examination 1. Lotsmanov S, N. Reference to. M., Mechanical Engineering, 1975. 2, Lashko I.F., Lashko-Avakn S.V. the puppy was sweeping. M., Mashgiz, 1959.