SU799921A2

SU799921A2 - Solder melting monitor

Info

Publication number: SU799921A2
Application number: SU782689916A
Authority: SU
Inventors: Зинаида Владимировна Полищук; Владимир Давыдович Самойлов
Original assignee: Polishchuk Zinaida V; Samojlov Vladimir D
Priority date: 1978-11-30
Filing date: 1978-11-30
Publication date: 1981-01-30

Description

1one

Изобретение относитс к пайке, в частности к устройствам дл выравнивани зоны пайки.The invention relates to soldering, in particular to devices for leveling the soldering zone.

Известно устройство дл контрол момента расплавлени припо , содержащее основание из диэлектрического материала , закрепленные на нем токопроводы , закорачивающие токопроводы, припой и крышку. При нагреве окружающей среды, па емых деталей и контрольного устройства до температур плавлени припо электрическа цепь разрываетс и подаетс сигнал на вторичный прибор 1,A device for controlling the moment of fusion of solder, containing a base of a dielectric material, conductors attached to it, shorting conductors, solder and a cover, is known. When the environment is heated, the parts to be fired and the monitoring device to the melting point of the solder, the electric circuit is broken and a signal is sent to the secondary device 1,

К недостаткам такого устройства относитс одноразовость его использовани и отсутствие приспособлени дл сбора расплавленного припо , а также устройства (приставки) дл выравнивани зоны пайки дл разных па емых масс, в частности изделий электронной техники.The disadvantages of such a device include the one-time use of it and the lack of a device for collecting molten solder, as well as devices (attachments) for leveling the soldering zone for different soldered masses, in particular electronic products.

По основному авт. св. 561637 известен датчик контрол момента расплавлени припо , содержащий основание , которое выпслнено в виде керамической лодочки с трем продольными пазами - центральным, служадим дл сСора расплавленного припо , и боковыми , в которые уложены токопровсды.According to the main author. St. No. 561637, a sensor for controlling the moment of melting of solder is known, which contains a base, which is made in the form of a ceramic boat with three longitudinal grooves — the central one, which serves for melting the soldered solder, and the side, in which current conductors are laid.

и с центрирующими выемками, в кото1 лх одним концом закреплены токопроводыand with centering grooves, in which the conductors are fixed at one end with one end

2 .2

к нёдсстаткам этого устройства относитс отсутствие дополнительного устройства (приставки) дл выравнивани температуры в зоне пайки изделий , с различной массой.The drystats of this device include the absence of an additional device (attachment) for leveling the temperature in the soldering zone of products with different weights.

Цель изобретени - создание устройства (например, приставки), которое могло бы выравнивать температурную зону при пайке изделий электронной техники с различной массой.The purpose of the invention is to create a device (for example, attachments) that could equalize the temperature zone when soldering electronic products with different weights.

Поставленна цель достигаетс тем, что датчик снабжен установленным на его корпусе приспособлением дл выравнивани температуры в зоне пайки, выполненным в виде П-образного основани с отверсти ми в боковых стенках и стержн ми, установленными на крышке основани , на которые одевают металлические пластины с различной толщиной в зависимости от массы па емого издели .The goal is achieved by the fact that the sensor is equipped with a temperature equalization device in the soldering zone, mounted on its housing, made in the form of a U-shaped base with holes in the side walls and rods mounted on the base cover, on which metal plates with different thicknesses are worn. depending on the mass of the melted product.

На чертеже изображено приспособление дл выравнивани температуры в зоне пайки.The drawing shows a device for temperature equalization in the soldering zone.

Устройство содержит основание 1,The device contains a base 1,

Claims

plates 2-11, pins 12. The attachment for leveling the soldering zone is applied as follows: The sensor is fitted with a device before soldering an electronic device so that the base 1, made for example of 12x18H10T steel, GOST 5949-75 1.5 mm thick, rested against the upper part, for example, the lid of the sensor, and the side walls tightly adhered to the side walls of the sensor, and for uniform blowing, for example, of the sensor with hydrogen, during the soldering process, holes with a diameter of 5 mm are provided in the walls. The pins 12, made of steel 12x18H10 T circle caliber 3, GOST 5949-75, for example, 90-100 mm long, having a taper of 0.75 mm radius at one end, serve to hold the plates 2-11, the pins are mounted into base 1 jigs using threading or welding. Plates 2-11 are made of 12X18N YuT steel, GOST 5949-75, depending on the mass of the molded part or assembly or electronic product, the thickness of each plate, which has its own serial number, is chosen experimentally, in particular for furnaces of type ЦЭП-240 241 from 1-10 mm, for powerful furnaces 100-128 kW from 1-100 mm, and the plates can be used in a different number order depending on the mass of the scorched product of electronic equipment. The use of the proposed. Allowance for temperature equalization in the soldering zone makes it possible to unify the sensor for controlling the moment of fusion of solder due to the use of different numbers of plates and to eliminate unwanted temperature transitions in the process of soldering electronic products. The invention of the sensor control moment of fusion of solder on the author. St. No. 561637, characterized in that, in order to equalize the temperature in the soldering zone for parts with different weights, the sensor is equipped with a device for temperature equalization in the soldering zone, made in the form of a U-shaped base with holes in the side walls and rods mounted on the base lid, on which metal plates with different thicknesses are worn, depending on the mass of the molded product. Sources of information taken into account in the examination 1. US patent 235411, cl. 337-404, 1944.

2. Authors certificate of the USSR W 561637, cl. In 23 K 3/00, 1977.