SU799023A1 - Currant-conductive composition - Google Patents

Description

(54) CURRENT CONTAINING COMPOSITION

one

The invention relates to electronic engineering, in particular, to conductive compositions containing mainly metals.

A conductive composition containing copper, chromium and titanium 1 is known.

A disadvantage of the known composition is the instability of the electric parameters of the conductive elements made from it, which is due to the presence of large amounts of chromium and titanium, which form oxides and due to the presence of which the conductive elements made of the specified material have high resistivity.

Closest to them is a conductive composition containing copper, manganese and nickel. G21 The disadvantage of the composition is its unreliable adhesion to the substrate, due to the fact that the composition is deeper than the transition layers, which are formed only due to the presence of manganese in the composition.

The purpose of the invention is to ensure the reliability of adhesion to the substrate and the stability of the electrical parameters of the conductive elements.

This goal is achieved by the fact that the conductive composition, mainly for the conductive elements of hybrid integrated circuits containing copper and manganese, additionally contains titanium, copper oxide and nickel oxide in the following proportion of components, wt.%:

60-65

Copper

0

7-9

Manganese

0.5-1 Titanium

20-25

copper oxide

3-8 Nickel oxide

Reducing the amount of any of

5 oxides less than the specified minimum value leads to the fact that the resulting composition does not allow to obtain a satisfactory adhesion of conductive particles to ceramics, and

0 an increase in the amount of oxides greater than the specified maximum amount leads to an increase in the resistance of the conductive layer.

five

The presence in the conductive composition of manganese in an amount less than 7% by weight, and titanium less than 0.5% by weight leads to a deterioration in the wetting of ceramic glass with metal, and an increase in the amount of manganese is more than 9% by weight and

Claims (2)

0 titanium greater than 1 wt.% Increases the resistance of the conductive layer. 1, the inventive nature of the present invention can be illustrated by the following examples. The mixture of components is subjected to a mole in a metal drum in an organic solvent consisting of a mixture of isopropium alcohol and acetone and applied to the substrate and 22XC ceramics by pulverization, after which sintering is performed in a humidified hydrogen atmosphere with a dew point of 4 ° C + -10 ° C at a temperature of 1040 ° -10bO for 3Q minutes. The thickness of the resulting conductive layer is 15-30 microns. Conductive elements with a resistance of 0.02 ohm have the following composition, wt.%: Manganese 7 Titanium 0.7 Oxide. Medium 25 Nickel oxide 7.3 Conductive elements with a resistance of 0.04 Ohm have the following composition, wt.%: Copper65 Manganese 9 Titanium1; Copper oxide 22 Nickel oxide 3 Conductive elements with a resistance of 0.060 m are obtained from the following composition, wt.%: Copper.63 Manganese 8.5 Titanium 0.5 Copper oxide 20 Nickel oxide 8 Thus, the resistance of the resulting conductive elements is 0 , 02-0.06 Ohms, which determines the stability of their electrical parameters. The current conducting composition is mainly for conductive elements of hybrid integrated circuits containing copper and manganese, characterized in that, in order to ensure the reliability of adhesion to the substrate and the stability of the electrical parameters of the conductive elements, it additionally contains titanium, oxides of oxides and oxide Nickel in the following proportion of components, wt.%: Copper60-65 Manganese 7-9 Titanium, 5-1 Copper oxide 20-25 Nickel oxide 3-8 Sources of information taken into account during the examination 1. Author's witness USSR, No. 4334484, cl. H 01 B 1/02, 1974. 2. USSR author's certificate number 498650, cl. H 01 B 1/02, 1976.