SU767869A1 - Apparatus for liquid treatment of parts - Google Patents

Description

The invention relates to process equipment used in the semiconductor industry for the chemical treatment of elongated parts, in particular silicon ingots up to 630 mm in length. An etching device is known that contains a series of sequential treatment baths located at the same level. Along the baths of the mounting rails, on which transporting mechanisms are installed with the possibility of moving 13 the inability to process parts simultaneously in all cameras, which reduces the performance of the device. It is also known a device for the chemical treatment of parts, containing Xc1mery sequential processing with adjacent peg villages, each chamber being equipped with an overload with a strap installed with the possibility of reciprocating movement 2. However, this device has large dimensions; in addition, it is impossible to process parts of a cylindrical shape, such as semiconductor ingots, without any structural changes. The purpose of the invention is to show the percentage of yield of parts that is achieved in a device for liquid processing of parts, mainly silicon ingots, containing sequential processing chambers with partitions, each chamber being provided with a reloading plate mounted for reciprocating movement, each chamber being equipped with two rollers, rigidly fixed in the lower part of the chamber with the possibility of passage between them overloading the strap, and the partitions are equipped with flanging, made with a slope in the direction of successive movement FIG. 1 shows a device for liquid processing of parts at the moment of overload G in FIG. 2 - the same at the time of technological processing.

A device for liquid processing of parts contains, for example, three adjacent cameras 1 of sequential processing with devices for transferring parts from one chamber to another, each of which includes a bar 2 equipped with a drive 3 of reciprocating motion in a vertical plane. In the lower part of each chamber 1, the rollers 4 are rigidly fixed, located symmetrically relative to the bar 2 and with the possibility of its passage between them. The slats 2 have bevels in the direction of sequential processing of parts 5. The partitions 6 between the chambers are provided with flares, which are inclined in the direction of moving the parts. 1 to 5 mm, depending on the diameter of the workpiece 5. The sequential processing chambers 1 are placed in a sealed housing 7, equipped with gateways 8, installed at the loading and unloading positions of the parts 5.

The device works as follows.

Chambers 1 are pre-filled with an appropriate treatment medium. The workpiece 5, for example a silicon ingot with a diameter of 75 mm and a length of 630 mm, is fed through the gateway 8 to Chamber 1. At this moment, the bar 2 is in its extreme upper position. Then the bar 2 begins to fall and the rod 5, resting simultaneously on the bar 2 and the partition 6, moves down until it falls on the rollers. After this, the rollers 4 are given a rotational movement from the drive (not shown conventionally in the drawing). Together with them, the rotation 5 begins to rotate and the process of its processing proceeds, for example, the removal of the damaged layer after the calibration operation of the silicon part 5 on the circular grinding machine. At the end of the processing process in the first chamber 1, the part 5 is fed up to the level 2 the partitions 6 and along the bevels of the strip 2 and the partitions 6, which are currently forming an inclined plane, roll down onto the strip 2 located in the adjacent chamber 1, which is in the upper extreme position, and in this chamber 1 st cycle is repeated. At this time

The next workpiece 5 is fed into the first chamber 1 through the gateway 8. Thus, the parts 5 are loaded and reloaded and parts 5 are processed simultaneously in all the chambers 1.

Unloading the machined part 5 through the gateway 8, installed at the unloading position, to the drive of the machined parts 5.

The use of the proposed device as technological equipment, in particular, semiconductor production, allows the processing of ingots of long length, for example silicon and a length of 630 ml, without increasing the size of the device.

The dimensions of the device for liquid processing of cylindrical parts are reduced 2.5-3 times.

The use of this device allows the operation of etching silicon ingots to remove the broken layer after the calibration operation, which noBoaiaeT is the percentage yield of suitable plates and devices.

Using the proposed device, processing of ingots having a proper length is possible, hence costly material is saved, since it eliminates the need to separate the ingots into separate shorter pieces.

- invention formula

A device for liquid processing of children, mainly silicon ingots, comprising Kag / Lera of sequential processing with partitions, each chamber being provided with an overloading bar installed with the possibility of reciprocating movement, characterized in that, in order to increase the percentage of yield of suitable parts, each da it is equipped with two rollers rigidly fixed in the lower part of the chamber with the possibility of passage of an overloading strip between them, and the partitions are provided with flanging, made with in the direction of moving parts.

Sources of information taken into account in the examination

1. For Japan Japan 48-30213, cl. 12 And 12, pub. 1973.

2. For Japan Japan No. 51-10944, cl. 99 (5) NW, published. 1976 (prototype)

Claims (1)

- Claim A device for liquid processing of parts, mainly silicon ingots, containing sequential processing chambers with baffles, each chamber having an overload bar installed with the possibility of reciprocating movement, characterized in that, in order to increase the percentage of yield of suitable parts, each chamber is equipped with two rollers rigidly fixed in the lower part of the chamber with the possibility of the passage of the overload bar between them, and the partitions \ are equipped with a flange made with an inclination towards moving parts.