SU767413A1 - Method of making multilayer fluidic circuit boards - Google Patents
Method of making multilayer fluidic circuit boards Download PDFInfo
- Publication number
- SU767413A1 SU767413A1 SU792710898A SU2710898A SU767413A1 SU 767413 A1 SU767413 A1 SU 767413A1 SU 792710898 A SU792710898 A SU 792710898A SU 2710898 A SU2710898 A SU 2710898A SU 767413 A1 SU767413 A1 SU 767413A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- boards
- layers
- circuit boards
- channels
- fluidic circuit
- Prior art date
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Description
(54) СПОСОБ ИЗГОТОВЛЕНИЯ МНОГОСЛОЙНЫХ ПНЕВМАТИЧЕСКИХ ПЛАТ(54) METHOD OF MANUFACTURING MULTILAYERED PNEUMATIC BOARDS
1 .one .
Изобретение относитс к области пневмоавтоматики и может быть использовано дл изготовлени многослойных пневматических коммуникацион- с ных плат.. .The invention relates to the field of pneumatic automation and can be used for the manufacture of multilayer pneumatic communication boards.
Известен способ изготовлени многослойных пневматических плат, включающий получение слоев с коммутационными каналами и отверсти ми, которые JQ затем герметизируютс по плоскост м с помощью резиновых прокладок Ll.A known method of manufacturing multi-layer pneumatic boards includes obtaining layers with switching channels and openings, which are then sealed by JQ along planes with rubber gaskets Ll.
Наиболее близок по технической сущности к изобратению способ изготовлени многослойных пневматических плат, включающий получение слоев с коммутационными каналами и отверсти ми с последующей герметизацией стыка слоев с помощью склейки 2.The closest in technical essence to the invention is a method of manufacturing multi-layer pneumatic boards, including the preparation of layers with switching channels and holes, followed by sealing of the junction of the layers by gluing 2.
Недостатками этого способа изго-. 20 товлени многослойных пневматических плат вл ютс нарушение проводимости каналов вследствие затекани кле в каналы, нарущение герметичности между коммутационными каналами в сло х 25 плат из-за их старени и, в результате , непродолжительный срок службы приборов,The disadvantages of this method are. The production of multi-layer pneumatic boards is a violation of the conduction of the channels due to the leakage of adhesive into the channels, the leakage between the switching channels in the layers of the boards 25 due to their aging and, as a result, the short life of the devices,
Цель изобретени - повышение срока .службы многослойных пневматических 30The purpose of the invention is to increase the service life of multilayer pneumatic 30
;плат, улучшение герметичности между коммутационными каналами и их проводимости в сло х плат,т.е. улучшение качества плат, что повышает точность qnoco6a.; boards, improving the tightness between the switching channels and their conductivity in the layers of the boards, i.e. improving the quality of the boards, which improves the accuracy of qnoco6a.
Указанна цель достигаетс за счет того, что на склёйваёлйё поверхности заготовок слоев перед склеиванием нанос т углублени на участках, свободных от каналов и отверстий.This goal is achieved due to the fact that on the gluing surface of the workpieces of the layers before gluing put recesses in areas free from channels and holes.
Пример реализации предложенного способа показан на чертеже.An example of the implementation of the proposed method shown in the drawing.
На чертеже прин ты следующие обозначени : 1 и 2 - заготовки слоев с коммутационными каналами и отверсти ми 3; 4 и 5 - склеиваемые поверхности слоев; 6.- углублени .In the drawing, the following notation is accepted: 1 and 2 — blanks of layers with switching channels and holes 3; 4 and 5 - bonded surfaces of the layers; 6.- recess.
Предложенный способ реализуетс следующим образом.The proposed method is implemented as follows.
На поверхности 4 и 5 слоев 1 и 2. с каналами и отверсти ми 3 на места, свободные от каналов и отверстий, нанос т углублени б, которые на чертеже имеют форму лунок, но могут иметь и другую форму. Затем на подготовленные поверхности слоев наносит клей, соедин ют и подвергают обжатию под прессом и нагреву. Благодар нанесенным углублени м клейпри обжатии елоев не выдавливаетс , не затекает в -каналы, а распредел етс равномерно -ПО поверхности и в углублени , что повышает герметичность соединени слоев и улучшает проводимость каналов .On the surfaces 4 and 5 of layers 1 and 2. With the channels and holes 3, spaces free from the channels and holes are applied to the recesses b, which have the form of holes in the drawing, but may have a different form. Then glue is applied to the prepared surfaces of the layers, joined and subjected to compression under pressure and heat. Due to the deposited cavities, the crimp-on-die eaves are not squeezed out, do not flow into the -channels, but are distributed evenly on the surface and into the cavities, which increases the tightness of the connection of the layers and improves the conductivity of the channels.
Многослойные пневматические платы изготовленные указанным способом, могут быть выполнены из любого матерала , например металла, пластмассы.Multilayer pneumatic boards made in this way can be made from any material, for example metal, plastic.
Технико-экономический эффект от внедрени данного предложени достигаетс за счет, уменьшени брака, при изготовлении плат, исключени операций по исправлению плат, а также увеличени срока службы приборов с многослойными платами.The technical and economic effect of the implementation of this proposal is achieved by reducing rejects, in the manufacture of boards, eliminating repair operations on the boards, as well as increasing the service life of devices with multilayer boards.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU792710898A SU767413A1 (en) | 1979-01-08 | 1979-01-08 | Method of making multilayer fluidic circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU792710898A SU767413A1 (en) | 1979-01-08 | 1979-01-08 | Method of making multilayer fluidic circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU767413A1 true SU767413A1 (en) | 1980-09-30 |
Family
ID=20804424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU792710898A SU767413A1 (en) | 1979-01-08 | 1979-01-08 | Method of making multilayer fluidic circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU767413A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4549248A (en) * | 1982-10-20 | 1985-10-22 | Kurt Stoll | Electro-fluidic circuit board assembly with fluid ducts and electrical connections |
| US6216917B1 (en) * | 1999-07-13 | 2001-04-17 | Speedline Technologies, Inc. | Dispensing system and method |
-
1979
- 1979-01-08 SU SU792710898A patent/SU767413A1/en active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4549248A (en) * | 1982-10-20 | 1985-10-22 | Kurt Stoll | Electro-fluidic circuit board assembly with fluid ducts and electrical connections |
| US6216917B1 (en) * | 1999-07-13 | 2001-04-17 | Speedline Technologies, Inc. | Dispensing system and method |
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