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Application filed by Е.П. ШироковаfiledCriticalЕ.П. Широкова
Priority to SU2594389/27ApriorityCriticalpatent/SU703996A1/en
Application grantedgrantedCritical
Publication of SU703996A1publicationCriticalpatent/SU703996A1/en
FIELD: soldering materials. SUBSTANCE: binding agent for soldering paste containing water, organic solvent, polymerized methacrylic acid ester has additionally lanolin at the following ratio of components, weight %: organic solvent taken from the group: benzene, xylene, toluene, acetone, butyl acetate 15-20; polymerized methacrylic acid ester 0.1-5; lanolin 0.1-2, and water - the rest. EFFECT: improved quality of paste.
SU2594389/27A1978-03-281978-03-28Binding agent for soldering paste
SU703996A1
(en)