SU596649A1 - Master alloy for copper-base alloys - Google Patents

Master alloy for copper-base alloys

Info

Publication number
SU596649A1
SU596649A1 SU762417109A SU2417109A SU596649A1 SU 596649 A1 SU596649 A1 SU 596649A1 SU 762417109 A SU762417109 A SU 762417109A SU 2417109 A SU2417109 A SU 2417109A SU 596649 A1 SU596649 A1 SU 596649A1
Authority
SU
USSR - Soviet Union
Prior art keywords
copper
alloys
increase
ligature
master alloy
Prior art date
Application number
SU762417109A
Other languages
Russian (ru)
Inventor
Герман Сергеевич Белкин
Владимир Иванович Ермаков
Григорий Николаевич Поповский
Андрей Владимирович Ермаков
Сергей Владимирович Терпогосов
Original Assignee
Предприятие П/Я Р-6517
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Предприятие П/Я Р-6517 filed Critical Предприятие П/Я Р-6517
Priority to SU762417109A priority Critical patent/SU596649A1/en
Application granted granted Critical
Publication of SU596649A1 publication Critical patent/SU596649A1/en

Links

Claims (1)

Применение предлагаемой лигатуры упрощает технологический процесс изготовлени  сплавов, на 30% повышает производительность металлургического агрегата, увеличивает стабильность с става сплавов. мФормула изобретенигг Лигатура дл  сплавов на основе меди , содержаща  медь и бор, отлич юща с  тем, что, с целью повышени  степени усвоени  бора расплавом, увеличени  производительности и увеличени  стабильности состава сплавов, лигатура содержит компоненты в виде спрессованной смеси порошков при следующем соотношении, вес.% Медь30-96 БорОстальное. Источники информации, прин тые во внимание при экспертизе 1. Патент США № 3640779,кл.148-32.5, 1972.The application of the proposed ligature simplifies the technological process of the production of alloys, increases the productivity of the metallurgical unit by 30%, increases the stability of the alloys. Formula of the invention Ligature for copper-based alloys containing copper and boron, characterized in that, in order to increase the degree of assimilation of boron by the melt, increase productivity and increase the stability of the composition of the alloys, the ligature contains components in the form of a pressed mixture of powders in the following ratio, weight .% Copper30-96 BorOstalnoe. Sources of information taken into account in the examination 1. US patent No. 3640779, cl.148-32.5, 1972.
SU762417109A 1976-10-29 1976-10-29 Master alloy for copper-base alloys SU596649A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU762417109A SU596649A1 (en) 1976-10-29 1976-10-29 Master alloy for copper-base alloys

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU762417109A SU596649A1 (en) 1976-10-29 1976-10-29 Master alloy for copper-base alloys

Publications (1)

Publication Number Publication Date
SU596649A1 true SU596649A1 (en) 1978-03-05

Family

ID=20681683

Family Applications (1)

Application Number Title Priority Date Filing Date
SU762417109A SU596649A1 (en) 1976-10-29 1976-10-29 Master alloy for copper-base alloys

Country Status (1)

Country Link
SU (1) SU596649A1 (en)

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