SU539719A2 - Low temperature solder flux - Google Patents
Low temperature solder fluxInfo
- Publication number
- SU539719A2 SU539719A2 SU2181181A SU2181181A SU539719A2 SU 539719 A2 SU539719 A2 SU 539719A2 SU 2181181 A SU2181181 A SU 2181181A SU 2181181 A SU2181181 A SU 2181181A SU 539719 A2 SU539719 A2 SU 539719A2
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- low temperature
- solder flux
- temperature solder
- soldering
- flux
- Prior art date
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
3 3
эвтектикой Pb-Cd-Sn повышаетс незначительно , что позвол ет осуществить пайку при температуре не более 100°G.the eutectic of Pb-Cd-Sn rises slightly, which allows soldering at a temperature not exceeding 100 ° G.
Использование изобретени позвол ет производить пайку Цинка, кадми , свинца, олова и сплавов на их основе при температуре пайки не выше 100°С, что исключает возможность расплавлени соедин емых деталей и способствует повышению качества па ных соединений . Снижение температуры активности флюса дл паЙ1ки осо1болегкоплавкими припо ми особенно важно при исправлении (подпайке) дефектов в па ных соединени х, выполненных припо ми системы Zn-Cd-Pb-Sn, a также при ступенчатой пайке.The use of the invention allows soldering of Zinc, cadmium, lead, tin and alloys on their basis at a soldering temperature not higher than 100 ° C, which eliminates the possibility of melting the parts to be joined and contributes to the improvement of the quality of the solder joints. Reducing the temperature of the flux activity for soldering with solvents of high melting point is especially important when correcting (soldering) defects in the joints made with solders of the Zn-Cd-Pb-Sn system, a, as well as in the stepwise soldering.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU2181181A SU539719A2 (en) | 1975-10-16 | 1975-10-16 | Low temperature solder flux |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SU2181181A SU539719A2 (en) | 1975-10-16 | 1975-10-16 | Low temperature solder flux |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU483219 Addition |
Publications (1)
Publication Number | Publication Date |
---|---|
SU539719A2 true SU539719A2 (en) | 1976-12-25 |
Family
ID=20634599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SU2181181A SU539719A2 (en) | 1975-10-16 | 1975-10-16 | Low temperature solder flux |
Country Status (1)
Country | Link |
---|---|
SU (1) | SU539719A2 (en) |
-
1975
- 1975-10-16 SU SU2181181A patent/SU539719A2/en active
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