SU517078A1 - The method of applying antidinatron coating - Google Patents
The method of applying antidinatron coatingInfo
- Publication number
- SU517078A1 SU517078A1 SU2074273A SU2074273A SU517078A1 SU 517078 A1 SU517078 A1 SU 517078A1 SU 2074273 A SU2074273 A SU 2074273A SU 2074273 A SU2074273 A SU 2074273A SU 517078 A1 SU517078 A1 SU 517078A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- coating
- parts
- applying
- dinatron
- electrodes
- Prior art date
Links
- 238000000576 coating method Methods 0.000 title claims description 20
- 239000011248 coating agent Substances 0.000 title claims description 19
- 238000000034 method Methods 0.000 title claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000003792 electrolyte Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 238000005137 deposition process Methods 0.000 claims 1
- 239000002966 varnish Substances 0.000 claims 1
- 238000000137 annealing Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- -1 for example Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- HZPNKQREYVVATQ-UHFFFAOYSA-L nickel(2+);diformate Chemical compound [Ni+2].[O-]C=O.[O-]C=O HZPNKQREYVVATQ-UHFFFAOYSA-L 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
Landscapes
- Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
Description
1one
Изобретение относитс к способам нанесени антидинатронного покрыти , например, на Ieтaлличecкиe электроды электровакуумных приборов (ЭВП).The invention relates to methods for applying an anti-dinatron coating, for example, to electric metallic electrodes (EVE) electrodes.
Известен способ получени антидинатронного покрыти , например, из углерода на металлических детал х электронных ламп, в частности на электродах, путем электролитического осаждени материала покрыти . Способ состоит в том, что на предварительно окисленные на воздухе поверхности металлическгх деталей методом электрофореза наноситс слой формиата никел , на который затем наноситс также второй слой из окиси никел . Покрытые таким способом детали отжигаютс в водороде.A method is known for producing an anti-dinatron coating, for example, from carbon on metal parts of electron tubes, in particular on electrodes, by electrolytic deposition of the coating material. The method consists in that a layer of nickel formate is applied onto the surfaces of the metal parts previously oxidized in air by electrophoresis, which is then also coated with a second layer of nickel oxide. The parts coated in this way are annealed in hydrogen.
Однако образующа с в результате отжига пориста губчата поверхность адсорбирует остаточные газы, что приводит к длительному I aзooтдeлeншo в процессе откачки и работы прибора. Покрыти из окислов разлагаютс под действием электронной бомбардировки , что приводит к нестабильности вторичноэмиссионных свойств в процессе работы прибора. Кроме того, получаемое покрытие имеет существенно более низкую электропроводность , чем медь, что приводит к ухудшению резонансных систем ЭВП и росту потерь на высокой частоте.However, the porous sponge-like surface formed as a result of the annealing adsorbs residual gases, which leads to a long period of time during pumping and operation of the device. The oxide coatings decompose under the action of electron bombardment, which leads to instability of the secondary emission properties during operation of the device. In addition, the resulting coating has a significantly lower electrical conductivity than copper, which leads to a deterioration of the resonant EEC systems and an increase in losses at high frequency.
Целью изобретени вл етс повышение стабильности антидинатронных свойств покрыти и увеличение электропроводности покрыти до величины, практически не отлича7ощейс от таковой дл меди.The aim of the invention is to increase the stability of the antidinatronic properties of the coating and to increase the electrical conductivity of the coating to a value that is practically no different from that of copper.
Предлагаемый способ нанесени антидинатронного покрыти на металлические электроды путем электролитического осаждени металла с последующим отжигом отличаетс от известных тем, что в электролит, например , меднени ввод т мелкодисперсный порошок материала, имеющего низкий коэффиент вторичной электронной эмиссии, например углерод, и провод т процесс электролитического осаждени при непрерывном перемешивании .The proposed method of applying an anti-dinatron coating on metal electrodes by electrolytic metal deposition with subsequent annealing differs from the known ones in that electrolyte, for example, copper plating, injects fine powder of a material having a low secondary electron emission coefficient, such as carbon, and continuous mixing.
Дл нанесени антидинатронного покрыти берут электролит, например, следующего состава (в вес.%):For the application of an anti-dinatron coating, an electrolyte is taken, for example, of the following composition (in weight%):
CuS048-9CuS048-9
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU2074273A SU517078A1 (en) | 1974-11-10 | 1974-11-10 | The method of applying antidinatron coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU2074273A SU517078A1 (en) | 1974-11-10 | 1974-11-10 | The method of applying antidinatron coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU517078A1 true SU517078A1 (en) | 1976-06-05 |
Family
ID=20600478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU2074273A SU517078A1 (en) | 1974-11-10 | 1974-11-10 | The method of applying antidinatron coating |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU517078A1 (en) |
-
1974
- 1974-11-10 SU SU2074273A patent/SU517078A1/en active
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