SU252806A1 - METHOD OF ELECTROLYTIC ALUMINUM COPDING - Google Patents
METHOD OF ELECTROLYTIC ALUMINUM COPDINGInfo
- Publication number
- SU252806A1 SU252806A1 SU1048076A SU1048076A SU252806A1 SU 252806 A1 SU252806 A1 SU 252806A1 SU 1048076 A SU1048076 A SU 1048076A SU 1048076 A SU1048076 A SU 1048076A SU 252806 A1 SU252806 A1 SU 252806A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- copding
- electrolytic aluminum
- copper
- cadmium
- sulfuric acid
- Prior art date
Links
- 229910052782 aluminium Inorganic materials 0.000 title description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- ARUVKPQLZAKDPS-UHFFFAOYSA-L Copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 4
- AXZWODMDQAVCJE-UHFFFAOYSA-L Tin(II) chloride Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000003792 electrolyte Substances 0.000 description 4
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- QCUOBSQYDGUHHT-UHFFFAOYSA-L Cadmium sulfate Chemical compound [Cd+2].[O-]S([O-])(=O)=O QCUOBSQYDGUHHT-UHFFFAOYSA-L 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 235000011150 stannous chloride Nutrition 0.000 description 2
- 239000010953 base metal Substances 0.000 description 1
- 229910000331 cadmium sulfate Inorganic materials 0.000 description 1
- 229940117941 cadmium sulfate Drugs 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Description
Изобретение относитс к области нанесени гальванических покрытий.The invention relates to the field of electroplating.
Известен способ электролитического меднени алюмини в электролитах, содержащих сернокислую медь и серную кислоту, при плотност х тока до 1 а/дм- и комнатной температуре . Однако такой способ не обеспечивает получени доброкачественных осадков меди при высоких плотност х тока.The known method of electrolytic copper plating in electrolytes containing copper sulphate and sulfuric acid at current densities of up to 1 a / dm and room temperature. However, this method does not provide for obtaining benign copper deposits at high current densities.
Предлагаемый способ отличаетс тем, что дл получени мелкокристаллических осадков меди, обладающих хорошим сцеплением с алюминием, в электролит ввод т сернокислый кадмий и двухлористое олово при следующем соотношении компонентов (в г/л):The proposed method is characterized in that in order to obtain fine crystalline copper precipitates with good adhesion to aluminum, cadmium sulphate and tin dichloride are introduced into the electrolyte in the following ratio of components (in g / l):
медь сернокисла 200-220copper sulfate 200-220
серна кислота (1,82-1,84)50-55sulfuric acid (1.82-1.84) 50-55
кадмий сернокислый0,3-0,4cadmium sulfate0.3-0.4
олово двухлористое0,3-0,4dichloride tin 0.3-0.4
и процесс ведут при плотности тока 1- 5 а/дм2 и температуре 20-22°С.and the process is carried out at a current density of 1-5 a / dm2 and a temperature of 20-22 ° C.
Получаемые осадки меди гладкие, твердые, мелкокристаллические, хорошо сцепленные с основным металлом.The resulting copper precipitations are smooth, solid, fine-crystalline, well adhered to the base metal.
Предмет изобретени Subject invention
Способ электролитического меднени алюмини в электролите, содержащем медь сернокислую и серную кислоту, отличающийс тем, что, с целью получени мелкокристаллических хорошо сцепленных с основой осадков, в электролит ввод т кадмий сернокислый и олово двухлористое при следующем соотношении компонентов (в г/л):The method of electrolytic copper plating in the electrolyte containing copper sulfate and sulfuric acid, characterized in that, in order to obtain fine crystalline precipitates well bonded to the base, cadmium sulfate and tin dichloride are introduced into the electrolyte in the following ratio of components (g / l)
медь сернокисла 200-220copper sulfate 200-220
серна кислота (1,82-1,84)50-55sulfuric acid (1.82-1.84) 50-55
кадмий сернокислый0,3-0,4cadmium sulfate0.3-0.4
олово двухлористое0,3-0,4dichloride tin 0.3-0.4
и процесс ведут при плотности тока 1 - 5 а/дм2. и температуре 20-22°С.and the process is conducted at a current density of 1 - 5 a / dm2. and a temperature of 20-22 ° C.
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU252806A1 true SU252806A1 (en) |
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