SU1763128A1 - Method and device for laser treatment - Google Patents

Description

The invention relates to technology and equipment for laser processing.

\ The aim of the invention is to increase productivity in the manufacture of complex parts, simplifying the design of the optical system.

Figure 1 shows a diagram of a device for implementing the method with an optically transparent focusing element; figure 2 - focusing evil ^

2

2. A laser processing device comprising a laser and an optical system with a focusing element, characterized in that, in order to simplify the design of the optical system and increase productivity and durability, the focusing element of the optical system is made in the form of a plate with a microrelief structure deposited on its surface.

3. The device according to claim 2, according to the fact that the plate is made of optically transparent material.

4. The device according to claim 2, with the fact that the plate is made reflective.

5. The device according to claims 2-4, about t l and -; I want her with the fact that microrelay; The ethereal structure on the surface of the plate is made in the form of a continuous relief with parameters depending on the given configuration of the laser radiation, its wavelength and the refractive index of the plate material.

511. ,,, 1763128 A1

cop; in Fig.3 - view A in Fig.2; figure 4 - diagram of a device for implementing the method with a reflective focusing element.

During laser processing, phase modulation of the wave front is carried out! This laser radiation 1 and direct it to the processing zone 2. In this case, the laser radiation 1 is converted into radiation of the desired configuration 3, and its phase modulation is carried out

+ + 7- + .:

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depending on the wavefront and a given distribution of radiation intensity 1 on the workpiece surface 4 (Fig.1,3).

A device for implementing the method comprises a laser 5 and an optical system with a focusing element 6, the latter made in the form of a plate with a microrelief structure 7 applied to its surface.

The plate may be made of optically transparent material or reflective. The micro-relief structure on the surface of the plate can be ^{: |} / 5 is made in the form of a continuous relief with parameters depending on a given configuration of laser radiation 1, its wavelength and refractive index of the material nNastina.

The device operates as follows. 7 7 '

The automatic block 8 is given a program for cutting holes in a part 4 of the required combination and in a multiple of four, 'in addition, input data is provided that provide simultaneous switching on of the ruby laser pulses 5 And the drive' movement, (linear and angular) coordination - Dental table 9 ·

The operator’s job is to fix the part 4 on the work table 9, start the installation in work through block 8, monitor the workpiece 4 through the system 10 and monitor the temperature of the part 4 on the device 11.

If necessary, taking into account the technological features of operations for machining the part and its temperature, the operator delivers the technological medium. To remove the evaporated product of ceramics and stabilize the temperature of the workpiece, they can supply air.

The device can be made with a reflective focusing element 6 (figure 4). Such a device works. ' in the following way. '^;

When punching holes in metal parts, for example, in titanium panels up to 1 mm thick, oxygen is used as a technological medium, which allows, due to the exothermic reaction between the metal and oxygen, to accelerate the process of punching holes with a lower laser power. punching holes

in thicker metal plates, an inert gas, such as helium, is used as a process medium, · preventing the combustion of metal, leading to a violation of the shape of the punched hole.

The reflecting focusing element 6 used in the device is made reflective on a metal base, on the surface of which a micro-relief phase structure is applied over four zones, which converts a laser beam with an inhomogeneous mode structure into four beams with point focusing and a given mode structure. This method and device allows you to: cutting holes of complex shaped section, cutting, welding, heat treatment on a limited surface of parts of complex configuration, marking and cutting of sheet material along a given contour;

when processing non-metallic materials and manufacturing products from plastics and other polymeric materials, the device provides operations for cutting holes of a given population, for marking the required configuration and other operations;

processing (dissection) of the surface layer of boards and other elements of microcircuits to the required depth along a given contour, marking silicon wafers, cutting and cutting ceramic complex substrates;

cutting materials from leather, natural cloth and artificial fabrics, · in the manufacture of "punch cards" for the textile industry;

in the production of building materials made of ceramics, tuff and other hard and brittle materials, they can be processed by vitrifying the surface according to a given pattern, as well as marking the necessary signs and cutting holes of the required combination.

Thus, the ability to process the entire given contour at the same time provides high productivity in the manufacturing process of complex parts, and replacing the system of optical elements, which allows to obtain radiation of the required configuration and phase modulation, with one plate with a microrelief structure, simplifies the design of op1763128

tical system and increase its durability.

An example implementation of the method.

Punched holes with a diameter

¢, 12-0.25 μm 'of the given aggregate in a ceramic part (panel) up to 1 mm thick. The laser setup consisted of a pulsed ruby laser with a power density of 10 * W / cm ² ι in a pulse of 1 ms duration emitting a light beam with a wavelength of Ά = »0.69 μm and collimated to a diameter of 25 mm, an optical system with a reflecting focusing element 1 with a diameter of 25 mm. The processed ke'ramic part was fixed on a movable coordinate table.

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The apparatus also included a process fluid supply system 6 (air, oxygen, inert gas, liquid, etc.), An automatic device in the form of programming with computer ₂ ISRC, surveillance system and workpiece temperature meter.

The focusing element of the optical system was made in the form of an optically transparent plate with a microrelief structure deposited on it with four equally symmetric zones.

The manufacture of the focusing element consisted of the following main steps:

- made the calculation on the computer of the given phase function of the element, allowing to carry out the necessary transformations of a uniform or Gaussian intensity distribution;

*> the amplitude mask of the obtained phase function was manufactured using a scanning precision device for outputting the optical image from the computer onto a transparent base with a photoemulsion layer;

- made the production of the phase mask of the focusing element with the desired relief on the surface of the base by removing (water) undecreased gelatin from the emulsion.

As a result of processing, a predetermined number of holes was obtained simultaneously per pulse.

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figure 2

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Claims (5)

one (21) 3705 61/27 (22) 12.12.83 ) 09/23/92. Bul V 35 (71) Institute of General Physics, USSR Academy of Sciences (72) V.A. Danilov, V.V.Popov, A.M.Prokhorov, I.N.Sisak, D.M. Sagael, E.V. Sisak and V.A. Soyfer (56) USSR Copyright Certificate ff 267778, cl. At 23: 27/00. 1972. USSR Author's Certificate No. 673157, cl. B 23 K 26/00, 1979. (5k) METHOD OF LASER TREATMENT AND DEVICE FOR ITS IMPLEMENTATION (57) 1. A laser processing method in which phase modulation of a laser radiation wavefront is carried out and guided to a treatment zone, characterized in that, in order to increase productivity in the manufacture of complex parts, laser radiation is converted into radiation of a desired configuration, and its phase modulation depending on the wavefront and a predetermined distribution of the radiation intensity on the treated surface. This invention relates to laser processing technology and equipment. The aim of the invention is to increase productivity in the manufacture of complex parts, simplifying the design of the optical system. Figure 1 shows a diagram of an apparatus for carrying out the method with an optically transparent focusing element; figure 2 - focusing 2. A laser processing device comprising a laser and an optical system with a focusing element, characterized in that, in order to simplify the design of the optical system and increase productivity and durability, the focusing element of the optical system is made in the form of a plate with a microrelief deposited on its surface. Here A device according to claim 2, characterized in that the plate is made of an optically transparent material. 4. A device according to claim 2, characterized in that the plate is made reflective. 5. A device according to claims 2-1, characterized in that the micro-relief structure on the surface of the plate is made in the form of a continuous relief with parameters depending on the given configuration of laser radiation, its wavelength and the refractive index of the material of the plate. cop; in FIG. 3, view A in FIG. 2; Fig. 4 is a diagram of an apparatus for carrying out the method with a reflecting focusing element. During laser processing, the phase modulation of the laser radiation wavefront 1 is performed and sent to the treatment zone 2. In this case, the laser radiation 1 is converted into the radiation of the required configuration 3, the phase modulation is performed Xi about W io oo depending on the wavefront and a given distribution of the intensity of radiation 1 on the treated surface of part C (Fig. 1.3). The device for implementing the method contains a laser 5 and an optical system with a focusing element 6, the latter is made in the form of a plate with a microrelief applied on its surface - JQ structure 7. The plate can be made of optically transparent material or reflective. The microrelief structure on the plate surface can be: f5 discharged as a continuous relief with parameters depending on the given configuration of laser radiation 1, its wavelength and the refractive index of the plate material. Jq The device works as follows. The automatic unit 8 is given a program for cutting holes in the part k of the required aggregate and in a multiple of four, in addition, input data is input to ensure the synchronous activation of the ruby laser pulses and the drive of thicker metal plates as an technological medium. gas, such as helium, which prevents the combustion of metal, leading to a violation of the shape of the hole being punched. The reflecting focusing element 6 used in the device is made reflective on a metal base, on the surface of which, in four zones, a blue-relief phase structure is applied that converts a laser beam with a non-uniform mode structure into Four beams with point focusing and a given mode structure. This method and device allows for: cutting holes of complex shaped section, cutting, welding, heat treatment on a limited surface of parts of complex configuration, marking and cutting the sheet material according to a given contour; . : when processing nonmetallic goods and making products from plastic and other polymeric materials, the device provides for the completion of the processing of (linear and angular) leather) of a given set, according to the brand natny table 9. The work of the operator consists of 4 fixing the part 4 on the work table 9, starting the installation the configuration required and other operations; ..:, ...-. ... processing (dissection) of the surface layer of boards and other elements through block 8, monitoring the machined -.- microcircuits to the required depth for the required detail 4 by means of the system- ... -..., -... 10 and contrat T: for the temperature details ..4 on the device 11. W ...:;, G .; . ;. If necessary, taking into account the technological features of operations of fabric-like and artificial materials. this contour, marking silicon wafers, cutting and cutting ceramic substrates of complex shape; By cutting the material out of the skin, after the part and its temperature, the operator feeds the technological medium. Air can be supplied to remove the evaporating ceramic product and stabilize the temperature of the workpiece. The device can be flashed out with a reflecting focusing element 6 (figl). Such a device works as follows. When punching holes in metal parts, for example in titanium panels up to 1 mm thick, oxygen is used in the Quality Environment; that allows g1 (and the expense of the exothermic reaction between metal and oxygen speeds up the process of punching a hole using a laser of lower power. When punching holes fabrics in the manufacture of punched cards for the textile industry; in the production of building materials from ceramics, tuff and other solid and fragile materials, it is possible to process them by vitrifying the surface according to a given pattern, as well as marking the necessary characters and cutting holes of the required aggregate. Thus, the ability to process the entire specified circuit at the same time ensures high performance of the process of manufacturing complex parts, and replacing the system of optical elements to ensure that the required configuration and phase modulation is obtained by a single plate with a microrelief structure simplifies the design of op 50 55 in thicker metal plates, an inert gas, such as helium, is used as the process medium, which prevents the combustion of metal, leading to a violation of the shape of the hole being punched. The reflecting focusing element 6 used in the device is made reflective on a metal base, on the surface of which, in four zones, a blue-relief phase structure is applied, which converts a laser beam with a non-uniform mode structure into Four beams with point focusing and a given mode structure. This method and device allows for: cutting holes of complex shaped section, cutting, welding, heat treatment on a limited surface of parts of complex configuration, marking and cutting the sheet material according to a given contour; . : when processing nonmetallic materials and making products from plastic and other polymeric materials, the device provides for the execution of operations for cutting holes of a given set, according to the brand the configuration required and other operations; ..:, ...-. ... processing (dissection) of the surface layer of boards and other elements microcircuits to the required depth for-- ...-....., -... woolen cloth and artificial this contour, marking silicon wafers, cutting and cutting ceramic substrates of complex shape; .making material in leather, natural fabric and artificial fabrics in the manufacture of punched cards for the textile industry; in the production of building materials from ceramics, tuff and other hard and brittle materials, it is possible to process them by vitrifying the surface according to a given pattern, as well as marking the necessary characters and cutting openings of the required aggregate. Thus, the ability to process the entire specified circuit at the same time ensures high performance of the process of manufacturing complex parts, and replacing the system of optical elements to ensure that the required configuration and phase modulation is obtained by a single plate with a microrelief structure simplifies the design tic system and increase its durability. An example of the method. Punched holes with a diameter of 6.12-0.25 μm of a given set in a ceramic part (panel) with a thickness of up to 1 mm. The laser setup consisted of a pulsed ruby laser with a power density of 10 W / cm per pulse of 1 ms, emitting a beam of light with a wavelength of X 0.69 microns and collimated to a diameter of 25 mm, an optical system with a reflecting focusing element with a diameter of 25 mm The processed ceramic part was fixed on a moving coordinate table. The device also included a process supply system 6 (air, oxygen, inert gas, liquid, etc.), an automatic device made in the form of a computer programmer, a monitoring system, and a device for measuring the temperature of the workpiece. The focusing element of the optical system was made in the form of an optically transparent plate with a microrelief structure deposited on it with four equally symmetric zones. The fabrication of the focusing element consisted of the following main steps: - a calculation was made on a computer of a given phase function of the element, allowing the necessary transformations of the uniform or Gaussian intensity distribution; -production of the amplitude mask of the obtained phase function was carried out using a scanning precision optical image output device from a computer on a transparent substrate with a photoemulsion layer; - production of a phase mask of a focusing element with the required relief on the surface of the substrate was carried out by removing (with water) unclaimed gelatin from the emulsion. As a result of processing, a given number of holes were simultaneously obtained in one pulse. five ///////////// // ////////// fa gg F1 / 2.2 /////////////. fiza