SU1753961A3 - Hybrid multilevel electronic module - Google Patents

Description

The invention relates to electronics and can be used in the radio and communications industry and instrument engineering.

The aim of the invention is to increase the packing density of the module and its reliability.

Figure 1 shows one of the options for the design of the Board. ,

Fig. 2 shows a variant using a flexible printed circuit board, Fig. 3 shows a variant of a composite board, Fig. 4 shows a general view of the module, and Fig. 5 shows a cross section of the module using a patch board.

 The module contains a set of parallel-mounted boards, each of which (FIG. 1) may contain unpackaged microcircuits (both active elements 1 and passive 2). In this case, the microcircuits are oriented oriented at 31

with the dimensional material 3 relative to each other and rigid output contacts 4. On the surface of the elements and the board, conductors 5 are applied, which carry out the switching of the elements among themselves, with the output contacts, and these serve to connect the boards among themselves after installation in the module

In the case where the elements are supplied attached to the wiring applied to the flexible bases, the board has the form shown in FIG. 2. Element 4ent 1 contact pads b is electrically connected to wiring 7, applied on a flexible base 8. Ramtaa 9 with external rigid contacts serves as a support for securing the flexible base 8. At the same time, wiring 7 forms board leads for connection inside the module.

A possible variant of the board, assembled from several parts (fig.Z). Each partial charge 10 containing ele

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mediating thermal contact with heatgun 18. A feature of this design is that the conductors 5 are applied to an insulating layer covering the front of the element 1. The design of this module provides an intermediate switching board 19 with rigid planar leads 20. The module is sealed with polymeric material 16 its surface.

The module is assembled in a technological device that provides parallel placement of boards with a given step. In this case, the boards are located between the edges of the heat source and commute along the edges of the modut. The edges are performed only in areas of significant heat generation (determined by calculation).

Replacing convective cooling with thermal conductivity significantly reduces the step between the boards (introduced

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cents 1 and 2, by their conclusions connecting 25 between the boards, the edge of the heat sink with a thickness of 0.5 mm removes up to 4 W of thermal energy with an allowable temperature difference between the element and the environment).

The plateau, and has a small thickness, due to the thickness of the packageless ele-1-menha. The mounting between the elements and output contacts of the board is not made from bulk, but flat conductors deposited on the surface.

Accordingly, the length of the interconnections between the boards and the length of the conductors connecting the elements with the external pins of the module are sharply reduced, which improves the technical characteristics of the equipment.

The monolithic structure of the module has high mechanical properties, which expands the scope of application of this structure.

High reliability is due to the replacement of low-reliable connections (such as a sliding contact) with highly reliable ones (such as vacuum deposition of metal films), as well as a decrease in the number of connections and an effective heat sink.

The use of switching circuit boards to connect the boards together also increases the packing density,

on the circuit, for example, using solder 11 with other partial boards, and free external contacts form the external contacts of the board. In one embodiment, module 12 (Fig. 4) is assembled from boards 13 with hard leads. According to the granules of the module, the boards are electrically connected by conductors mounted on a flexible base 8. In this case, random wiring is provided on the module's edges. In order to increase 35 reliability, the increased terminals of the boards after preliminary coating with sheath 14 are opened and duplicate conductors 15 are applied to the surface of the module. After that, the module is finally sealed with a polymeric material 16. The module design provides for the introduction of the heat sink 17c directly to the heating zones of the heat sink 17c with a heat spreader 18. The module is fixed mechanically to the common cooling system, and the external output contacts 4 of the board 13 have contact with the common switching board, forming external pins module

In order to increase the packing density, it is advisable to use the high thermal conductivity of the substrate of some elements for direct

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spreading device; Figure 5 shows the pop-up of each paired contact, an additional cut section of such a module, where the plug, which is included in the board 13, makes a non-sputtered contact, which is not very reliable.

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Claims (6)

Claim 1. A hybrid multilevel electronic module containing a board in each level, on the surface of which there are chip-free microcircuits, the terminals of which are connected to the corresponding output contacts of the board, while the switching elements are placed on the side faces of the module forming a housing equipped with a heat sink, with And with the fact that, in order to increase the packing density of the module and the reliability of its operation, the contact pads of the open-circuit microcircuits are located on the surface of the boards, the open-circuit microcircuits are oriented They are located on the surface of each of the boards and are connected by conductors connected to the corresponding output contacts of the given board, while the corresponding conclusions of each of the boards are external outputs of the module, and the switching of the boards between them is made by one-piece electrical installation, while the heat sink is made in the form of a comb, between the ribs of which the boards are installed j and the case ^{: of the} module is made monolithic of a hermetizing material < 2. U.odrh under item 1, about l and ch and yu. with the fact that it contains a commutation * circuit boards with planar outputs, which are external outputs I 5 modules. 3. The module according to claim 1, characterized by the fact that the output contacts of the boards are made in the form of rigid beams. 4. The module according to claim 1, with the fact that the boards are made in the form of flexible printed circuit boards, and their conclusions are placed around the perimeter - rigid frames. 5. The module according to claim 1, with the exception of 25 Shch.Iy with the fact that the boards consist of individual parts connected by their output contacts. 6. The module according to claim 1, characterized in that it contains a com- 30 mutation printed circuit boards placed along the edges of the module.