SU1699022A1 - Heat-sink for cooling of electronic components - Google Patents

Abstract

The invention deviates to electronic equipment, in particular to the design of components of the apparatus, and can be used to cool electronic components, such as semiconductor devices, operating at elevated temperatures. The purpose of the invention is to increase the cooling efficiency by using a triangular lattice of six-sided cooling channels, an optimum ratio of the hydraulic diameter of the channel to the grid step and an optimum ratio of the channel length to the hydraulic diameter of the channel. 3 il.

Description

The invention relates to electronic equipment, in particular to the design of the component parts of equipment and can be used to cool electronic elements, in particular semiconductor devices operating at elevated temperatures.

The purpose of the invention is to increase the cooling efficiency.

To achieve this goal, it is necessary to provide the greatest heating of the cooling medium with a possible lower temperature head (temperature difference between the average temperature of the radiator walls and the average temperature of the cooling medium), as well as to ensure the greatest cooling surface area with the minimum radiator sizes. To do this, it is necessary to apply a triangular lattice for the location of the cooling channels in the hexagonal shape of the latter (lattice of the cell type), to determine the optimal ratio of the hydraulic diameter of the channel d to the lattice pitch h (d / h), to determine the optimal ratio of the channel length to the hydraulic diameter of the latter (D / d) . A D / d experimentally found from 6 to 10. The upper limit is determined by structural and technological considerations. When the ratio D / d is less than 6, the efficiency of the radiator decreases rapidly, and if the ratio D / d is more than 10, the complexity of manufacturing is not justified by an insignificant increase in efficiency compared to the optimum value.

FIG. 1 - front view of the radiator; on FE 2 - the same, top view; in fig. 3 shows a variant of a radiator with a peripheral location of the cooled object and a progressively decreasing diameter of the cooling channels towards the cooled object, top view.

ABOUT

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The radiator contains a base 1 in the form of a thick-walled glass (Fig. 1) or a plate (Fig. 3). The base 1 by means of jumpers 2 is in contact with the shell 3 containing the cooling channels 4. Shell 3 may be any, depending on the specific design and purpose. The cooling channels 4 have a hexagonal shape, in order to create a traction effect, they are made with the walls forming a closed loop to increase the packing density (hence the cooling surface), as well as to reduce the length of the heat-conducting sections located along a triangular grid with step h. The heat resistance of the radiator is represented by a large number of parallel-connected sections (walls) common to adjacent channels over the entire length. This dramatically reduces the thermal resistance of the radiator due to thermal conductivity, and in combination with the developed cooling surface and the radiator as a whole, the cooling channels 4 are made with a variable cross section extending up and down. This expands the technological capabilities of 1 mass production methods (injection molding, stamping), in addition, reduces the mass of the radiator and reduces losses to the edge effect, especially for the incident flow of the cooling medium. Such a radiator has a high transparency for the cooling medium and. being built into the system with forced ventilation requires less ventilation power.

The radiator works as follows.

Heat from the cooled object 5 flows through the thick-walled base 1 to the shell 3 and to the walls of the cooling channels 4. Due to the large length of the latter, the cooling medium receives several times more heating (2-3 times) even at a lower temperature of the radiator than in the known analogues. A density difference is created at the entrance and exit of the channels. This, as well as low aerodynamic resistance to the cooling medium on the radiator side, creates an organized convection flow and increases the efficiency of the radiator, reduces

temperature of the object to be cooled with the same heat output with the known analogues, but with smaller dimensions and mass. Shell 3 (Fig. 3) with

in order to reduce the thermal resistance of the radiator material, it contains near the cooled object cooling channels 4 of smaller diameter. As the heat flux decreases away from the object being cooled, the thermal resistance increases (the wall thickness decreases) by increasing the diameter of the channels. This solution allows for optimal choice of lattice spacing and diameters of the cooling

channels reduce the overall thermal resistance of the radiator and improve its efficiency. The radiator sample is made of a silumin alloy with parameters, 8,. Conducted comparative

test with ribbed and needle radiator of equal size. With equal heat output, the temperature of the radiator case was on average 30-40% lower than the temperature of the finned radiator and 20-25% lower than the temperature of the needle radiator.

Claims (1)

The use of the invention makes it possible to reduce the dimensions of both the radiator and the apparatus as a whole, which includes this radiator, or to achieve a lower temperature of the cooled objects with unlimited apparatus sizes. The radiator is easy to manufacture. Invention Formula A radiator for cooling radioelectronic elements, comprising a base with a mounting platform for accommodating radioelectronic elements with vertical channels formed therein, arranged in a triangular lattice and having the shape of hexagonal cells, characterized in that, in order to increase the cooling efficiency, the bridges of the channel walls are 5 measures }; tapering in the direction from the Center to the ends of the channels with the ratio of the length of the channel to its diameter 6-10 and the ratio of the diameters of the channels to the step of the fpeyroflb lattice, decreasing towards 0 location of electronic elements. Thebes 1 Fig.}