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Publication date
Application filed by Р.Р. ГаитовfiledCriticalР.Р. Гаитов
Priority to SU4228456/27ApriorityCriticalpatent/SU1451994A1/en
Application grantedgrantedCritical
Publication of SU1451994A1publicationCriticalpatent/SU1451994A1/en
Electric Connection Of Electric Components To Printed Circuits
(AREA)
Abstract
Способ контроля процесса пайки, включающий определение момента расплавления припоя при нагреве деталей под пайку, отличающийся тем, что, с целью упрощения автоматизации контроля при нагреве дуговым разрядом в вакууме, в качестве параметра, регистрирующего момент расправления припоя, берут электрический ток в цепи нагрева и по его нарастанию судят о плавлении припоя и его растекании.The method of controlling the soldering process, including determining the moment of melting of solder when heating parts for soldering, characterized in that, in order to simplify automation of control when heated by an arc discharge in vacuum, as a parameter recording the time of solder unfolding, its growth is judged on the melting of the solder and its spreading.
SU4228456/27A1987-04-131987-04-13
METHOD OF CONTROL OF THE PROCESS
SU1451994A1
(en)
Method for reducing the energy consumption and minimizing the martensite formation when joining a connecting piece of metal with a metal surface by pin brazing and arrangement forcarrying out the method