SU1438533A1 - Method and apparatus for cooling heat-emitting electronic components - Google Patents

Abstract

The invention relates to electrical engineering. The method of cooling the heat-generating elements of electrical equipment is implemented in a device in which the supply lines 1 and 2 of liquid and gaseous refrigerant (XA) are connected to a coaxial connection of the supply pipes 3 and 4 for supplying

Description

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with

Jk

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and gaseous XA made of elastic electrically insulating material. The inner tube is fixed by means of a washer 5, the smoothness of the XA problem is controlled by a flow control made, for example, in the form of an electromagnet 6, and mixing takes place in a large volume of the nozzle channel 7 before entering the radiator 8,

The supply of liquid XA to the heat-generating elements is carried out smoothly with a frequency of following a portion of 0.1-1.0 Hz and alternated with the supply of gaseous CD, which is moistened to 100% relative moisture, which is carried out in discrete portions. The method allows to increase the cooling efficiency of the device. 2 sec. : and 2 z. p. f-ly, 5 ill.

t

The invention relates to electrical engineering, mainly to the field of construction of cooling devices for semiconductor devices with

The aim of the invention is to increase the cooling efficiency.

Fig, 1 shows the proposed device in section; Fig. 2 shows a radiator with double-ended spirals to Archimedes; on fig.Z -raerez A-A in figure 2; figure 4 - fitting assembly; on fig.Z - flow control.

The supply lines 1 and 2 of the liquid and gaseous refrigerant are connected to the co-axial inlet pipes 3 and 4, respectively, to supply the liquid and gaseous hlg agent made of elastic electrically insulating material. 20

The inner tube is fixed with a washer 5, the smoothness of the feed

the refrigerant is controlled by a flow controller, made, for example, in the form of an electromagnet 6, and mixing is performed in a larger channel of the choke 7 "before entering the radiator 8.

25

Radiator channels 9 with a constant volume of the gr. Temperature range of 30

yens in vi, multi-pass (for example, double-pass) spirals, in particular, Archimedes, are located in two planes of bones and connected by central holes 10 in the partition 11

 do oppositely spaced spirals. The ratio of the cross section of the hole And the canap. The coaxial pipes fixed to the side surface of the radiator through the g-40 ra pipe are simultaneously supplied with refrigerant.

in two channels of spirals on different planes

bone x. It is possible to feed gas and coolant in parallel through one nozzle into different channels, which are connected to each other through openings 10, in this case it is desirable to use a radiator without a central opening that connects one coil with another.

The nut 7 with nuts has an expanded thawed kienal at the inlet 12 and an annular boring at the end of the cone 13 for inserting the edge of the nozzle. A cap nut K, with a conical generatrix 15 and an annular protrusion 16, which contributes to pressing the nozzle against the end face of the choke 17. This provides a narrowed inlet of the refrigerant to the expanded choke volume. Refrigerant flows and. the gas passes into the expanded volume of the choke where the ring bay G8 is formed at the entrance. The tube is pressed against the fitting by screwing in the cap nut 19 with the support, thereby creating a secure fixing of the unit.

The flow controller is made in the form of an electromagnet with a winding 20 and a housing 21 and a crushing 22 magnet, with control screws 23 and a moving heart NICK 24, which is located between the rubber ball 25, on the one hand, and the coaxial hose 26, on the other. The core returns due to internal pressure in the coaxial inlet pipes.

The method of cooling the elements of the electronic equipment is carried out as follows.

The refrigerant is supplied from line 1, it is passed through the flexible external pipe 3 of the coaxial pipes, while using the flow controller 6 the amount of the refrigerant is smoothly changed

until the required minimum amount of fitting 7 is in front of the radiator kaial, at this moment air is admitted from line 2 through the internal connection A, fixed by figured washer 5, which is re-mesh with a small amount of refrigerant to 100% relative humidity of air in the volume and fed to the radiator, where humid air acts on the film covering the channels of the cooler, contributes to the acceleration of the movement of bubbles, from the surface of the channels heated by semiconductor devices, and also leads to circulating and mixing, resulting in a decrease in heat transfer from the surfaces of the channels of the mixture cooler, Z. then the air supply is blocked and smoothly increases the flow of refrigerant. Alternating portions of refrigerant and air reduce the process of electrolysis and salt formation. For a more efficient heat removal, coolers with a constant volumetric temperature gradient in the form of radiators with high-voltage spirals are used. The force of the coolant jet on the curved waveguide. The new surface increases by 2 times compared to the force in the case of a flat wall.

Claims (4)

1. A method of cooling electric power generation elements, including the supply of liquid refrigerant in discrete portions to heat emitting elements, which is the fact that, in order to increase the cooling efficiency, the flow of liquid refrigerant to heat emitting elements is carried out smoothly with the frequency of the following portion of 0.1-1 Hz and alternate with the supply of gas humidified up to 100% relative humidity 0 five 0 five 0  different refrigerant, which is carried out in discrete portions. : 2. A device for cooling heat sources and electrical elements; containing case with supply and discharge pipes for liquid refrigerant, in which radiators of heat-generating electric elements are placed, characterized in that, with a t.ch.c) eGelectricity cooled, it is equipped with a supply of a shield, and with a mixture of refrigerant eGrfec- and a liquid refrigerant flow controller; channels for liquid and gaseous refrigerant in the form of multiple spirals are arranged in the radiator, which are then located one above the other and connected between each other by a central opening, and e nozzles for gas and liquid refrigerant formed with different diameters from. elastic electrically insulating material, with each inlet pipe for gaseous refrigerant coaxial placed inside the corresponding pipe for liquid refrigerant, and fittings installed on the inlets of the radiator channels and connected to the inlet pipes for liquid and gaseous refrigerant. 3. The device according to claim 2, about t l and This is because the multiple helixes of the radiator channels are made in the form of Archimedes' spirals. 4. The device according to PP.2 and 3, about t - l and h and y p r. e with the fact that the liquid refrigerant 40 flow regulator is fulfilled in a guide placed in a housing with an electromagnet with a motor: with a core that is adapted to be operated with an inlet pipe of liquid agent 5, and regulated abutment, mounted coaxially with the support (, 1M core from its two opposite ends. (pu, 2 17 7J f jL4-i-J, (fy. 76 W figl 0 70 tt2b phage. five