SU1415285A1 - Microstrip directional coupler - Google Patents

Abstract

The invention relates to the field of radio engineering, namely to power distribution devices between transmission lines. The purpose of the invention is to increase the directivity and reduce power loss. The MICROPOSITIONAL directional coupler contains a dielectric substrate (DP) 1 mounted on a metal base (MO) 2, on the other surface of the substrate four segments of coupled conductors 3 are formed, forming two communication sections 4 connected by tandem. The conductors 3 are connected in cascade by two conductive jumpers 5 arranged cross-wise. In MO 2, opposite to each segment of conductors 3, an opening 6 is made, in which an adjusting screw (PB) 7 is placed. In DP 1, a gap 8 is made between conductors 3 for the entire length of the wall 8. additionally introduced on the opposite surface of the AC 1. The slit 8 eliminates power losses in the dielectric. The high directivity is realized by adjusting the capacitance between the conductors 3. This is achieved by moving the PB 7 in the hole 6, which leads to a change in the capacitance between the end of the PB 7 and the metallization section, 2 sludge. with S cl

Description

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The invention relates to radio engineering, in particular to power distribution devices between transmission lines.

The aim of the invention is to increase the directivity and reduce power loss.

FIG. 1 shows the proposed coupler, top view; in fig. 2 shows section A-A in FIG. one.

The microstrip directional coupler contains a dielectric substrate 1 mounted by one surface on a metal base NII 2, on the other surface of which four segments of connected conductors 3 are formed, forming two communication sections 4 connected in tandem. Each section 4 of the connection is made in the form of two segments, the connected conductors

3 of which are connected in cascade by two conductive jumpers 5, arranged cross-wise. In the metal base 2, opposite to each piece of connected conductors 3, an opening 6 is made, in which an adjusting screw 7 is placed, and in dielectric substrate 1 between connected conductors 3 of each section

4, the entire length of the connection is made a slot 8, the walls of which are covered with a conductive layer-9 connecting the connected conductor 3 and the metallization section 10, additionally inserted on the opposite surface of the dielectric substrate 1 and placed under each connected conductor 3. Wire straight jumpers 5 cross the gap

8 and are located on opposite surfaces of the dielectric substrate 1. A microstrip directional coupler is connected through the input and output arms 1 1.

The microstrip directional tap works as follows.

The high frequency power is applied to one of the arms 11 and spreads along the connected conductors 3 to the output arms. Due to the balanced electromagnetic coupling, the power tap is directed, the power is supplied only to two output arms .11, and one arm is always diverted with respect to the input shoulder. A slot 8 is made between the connected conductors 3, which eliminates the power loss in the dielectric. The high directivity is realized by adjusting the capacitance between the connected conductors 3. This is achieved by moving the adjusting screw 7 in the hole 6, which leads to a change in the capacitance between the end of the adjusting screw 7 and the metallization section 10.

Claims (1)

Invention Formula A microstrip directional coupler containing a dielectric substrate mounted on one surface on a metal base, on the other surface of which four segments of connected conductors are formed, forming two sections of communication, connected in tandem, each section of connection being made as two segments of connected conductors, the connected conductors of which are connected to the cadcade by two conducting jumpers located crosswise, characterized in that, in order to increase the directivity and decrease power loss, in the metal base opposite to each segment of connected conductors there is a hole in which an adjusting screw is placed, and in the dielectric substrate between the connected conductors of each communication section a full slot is made, the walls of which are covered with a conductive layer connecting each the bonded conductor and the metallization section, additionally inserted on the opposite surface of the dielectric substrate and placed under the corresponding bonded conductor, while the conducting jumpers p The slit is intersected and located on opposite surfaces of the dielectric substrate. / f- / 7 fuz.Z