SU1383521A1 - Contact device - Google Patents

Abstract

The invention relates to the field of radio engineering and can be used in control and measurement devices for connecting semiconductor devices with axial flexible wire leads. The purpose of the invention is to increase reliability, simplify the design and expand

Description

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operational capabilities. The contact device comprises a housing 1 with guide holes 2 for the leads 3 of the semiconductor device 4. A fixed insulating plate 5 is attached to the housing 1 on it and the plate: on the insulation plate 6, connected to the housing 1 via a bracket 7 and an axis 8. The plate 6 is pressed against the ledge 9 of the housing 1 by a spring 10. On the plates 5 and 6 the conductors 11 and 12, electrically connected to the contact springs 13. The holes 2, 14, 15 and the cylindrical contact springs 13 are coaxial for each terminal 3, which is freely accommodated in them. One end of each contact spring 13 is attached to one of the current leads 11, and the other end to one of the current leads 12 through a compensating spring lobe 16. On

A movable plate is fixed to a pusher 17, which cooperates with a protective cover 18 provided with a spring latch 19 with a button 20 for releasing the latch. To control the semiconductor device 4, it is placed in the device case 1, and the outputs of the device 4 are free

pass through the guide holes 2- in the housing 1 and through the holes 14 and 15 coaxial with them in the plates 5 and 6. After closing the protective cover 18, the pusher 17, which interacts with the plane of the crack 18, lowers the movable plate 6 downwards. contact elements in the form of coil springs 13 and compensating spring lobes 16 are tensioned,

 providing clamping of the springs 13 to the terminals 3 of the semiconductor device 4, and the lid 18 is already closed is fixed by the latch 19 ,, 2 Cp f-ly, 3 ill.

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The invention relates to radio engineering and can be used in control and measurement devices for connecting semiconductor devices with axial flexible wire leads.

The purpose of the invention is to increase reliability, simplify the design and increase operational capabilities.

FIG. 1 shows a contact device in the off position with an inserted semiconductor device; in fig. 2 - the same in the working position; in fig. 3 shows an embodiment of the contact element of the device consisting of several coaxially arranged cylindrical contact springs.

The contact device includes a housing 1 with guiding holes 2 for the leads 3 of the semiconductor device 4. The housing 1 contains a fixed insulating plate 5 attached to a neg-h and a movable insulating plate 6 connected to the housing 1 through a bracket 7 and an axis 8. Plate 6 pressed to the ledge

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9 bodies 1 by a spring 10 o To the plates 5 and 6 are fixed to the current leads 11 and 12, electrically connected to the contact springs 13 “Holes 2, 14 and 15 and cylindrical

contact springs 13 are coaxial for each pin 3, which is freely placed in them. One end of each contact spring 13 is attached to one of the conductors 11, and the other end is connected to one of the current leads 12 through a compensation spring petal 16. It is fixed on a movable plate. a pusher 17 interacting with a protective cap 18 equipped with a spring latch 19 with a button 20 for releasing the latch 19 ,,

The device works as follows.

In the initial state (Fig. 1), a plug-in semiconductor device 4 is inserted into the contact device, the terminals 3 of which freely pass through the guide holes 2 in the housing 1, through the holes 14 and 15 coaxial with them in the plates 5 and 6. The device semiconductor housing 4 rests on the body 1 pin

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device, and its conclusions 3 are inside the contact coil springs 13 with a gap.

The protective cover 18 is then closed, which with its plane o. puts pressure on the pusher 17 mounted on the movable plate 6. The latter is lowered down. The contact elements in the form of cylindrical springs 13 Extend and press to the terminals 3 of the connected semiconductor device 4 along a helical line (Fig. 2). In this case, the compensating spring-loaded petals 16, tensioning the spring 13, are bent unequally, to compensate for the production variations in the sizes of the leads 3, the difference in the distance traveled due to the indirect motion of the movable insulating plate 6 (Fig. 1 and 2). locked by latch 19.

To remove the semiconductor device, it is necessary to press the button 20, releasing the latch 19, and to open the valve 18 o. Under the action of the spring 10, the plate 6 rises up to the stop against the ledge 9 of the housing 1, and the contact springs 13 compress and release the leads 3 of the semiconductor device 4.

A contact device, for example, for connecting semiconductor devices with flexible leads to the measuring apparatus of the invention as compared to the known one, by placing the leads of the tested semiconductor devices in the holes of the insulating plates and in the contact cylindrical springs connected to the current leads of the movable and fixed plates, provides increased reliability and simplified design, and also makes it possible to perform part of the measuring circuit directly in the housing to stroke device on insulating plates, one of which is used to supply the signal contact elements and the other - for its deprotection of

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Claims (3)

1. A contact device, preferably for connecting semiconductor devices with flexible leads to measuring equipment, comprising an insulating body with movable and fixed insulating plates and with guide holes for the leads of semiconductor devices, a protective cover movably connected to the body and cooperating with a spring-loaded movable insulating plate made in the form of springs contact elements attached to the movable and fixed insulating plates and electrically connected with Connected with insulators mounted on current-carrying leads connecting contact elements with measuring equipment, characterized in that, in order to increase reliability, simplify the design and expand the operating capabilities, the insulating plates are made with holes to accommodate the leads of semiconductor devices and are arranged so that their openings are coaxial with the guiding holes of the housing, the contact springs are cylindrical and arranged coaxially with the holes of the plates, with one end of each pin Ktnoy spring is connected to the current supply of the movable plate, and the other - with the electrical power supply of the fixed plate. 2. A device according to claim 1, characterized in that the ends of the contact springs associated with the current leads of the movable plate are connected to them through compensatory spring-loaded petals. 3. The device according to claim 1, about tl and -7 is such that each contact element is provided with at least one additional cylindrical contact spring located coaxially with the first and fixed similarly to it, each of which is azimuthally rotated one relatively differently at the same angle. / / 12 11 10 1g 17 15 P  S 12