SU1293860A1 - Radioelectronic unit - Google Patents

Abstract

This invention relates to the field of radio electronics. The goal is to increase the cooling efficiency of the radio electronic unit (RB). The RB contains a housing 1 in which sub-units 2 are installed with circuit boards 3, on which heat pipes (TT) 4 are fixed with two parallel rows, on the outer surface of which they are times (L

Description

Circuit bins 5, and heat sinks (T). The goal is achieved by the fact that the ends of the TT 4 outside the mounting plates 3 are hermetically connected to at least one of their sides with T having caps 7 and a layer of material with a capillary-porous structure 8 connected to a capillary-porous structure 9 TT 4. The invention allows to improve the isothermal operation of the microinvention, which relates to radio electronics, in particular to electronic computing equipment with cooling systems.

The purpose of the invention is to increase the cooling efficiency.

Figure 1 shows the block, a general view; and figure 2 - view a in figure 1.

The electronic unit includes a housing 1, in which subunits 2 are installed. With mounting plates 3, each of which is made in the form of a multilayer printed circuit board. On two opposite sides of the circuit boards 3, heat pipes 4 are mounted in two parallel rows, mounted on the circuit boards 3, for example, with epoxy glue, microcircuits 5 are mounted on the outer surface of the heat pipes 4.

The heat pipes 4 outside the mounting plates 3 are hermetically connected to at least one of their sides with heat sinks 6 equipped with plugs 7 and a layer of material with a capillary-porous structure 8, connected to a capillary-porous structure 9 of heat pipes 4. The internal cavities of the heat pipes 4 communicate with the coaxial cavities of the heat sinks 6 formed by the housing 10 and the inner 19 and outer 11 tubes of the heat sinks 6 and the plugs 7, which ensure the unification of all the heat pipes 4 and the heat sink 6 by a common steam channel. A layer of material with a capillary-porous structure 8 is placed in the cavity of the heat sink 6 from the inner surface of the housing 10 and the chipset, since all the TTs located on the boards are combined by common hermetic heat drains and form common steam channels providing pressure equalization, and therefore, steam temperatures in all the CTs of each board, and the capillary-porous structure of the CTs allows you to organize a single hydraulic circuit for all the CTs. 2 Il.

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it is divided by partitions 12 from a material with a capillary-porous structure to its outer pipe 11, the latter being adjacent to partitions 12 and, on their side, with the aim of intensifying heat exchange, it is made with fins, for example, in the form of a fine thread. To equalize the vapor pressure inside the heat sinks 6, annular slots 13 in the partitions 12 are used. For ease of assembly, in the manufacture of the housing 10, the heat sinks 6 are made of two parts, connected, for example, by welding. The heat drains 6 are pressed against a portion of their outer walls to a cooler 14 made in the form of a plate, provided with a lid 15 with a sealing gasket 16 and having channels 17 for circulating a liquid refrigerant, which is supplied and discharged by means of a system 18 for supplying a refrigerant. The inner walls of the pipe 11 are in contact, for example, by a sliding fit with inner tubes 19 of the heat sink, made by plugs 20 closed on one side and having the form of guide elements, in particular paraboloids. The open ends of the pipe 19 are fixed in the housing 1 of the block with the possibility of transverse movements relative to their longitudinal axes, provided, for example, by means of bellows 21. Cooler 14 is fixed with screws 22 to stop 23, which, together with end caps 24 bellows 21 and thrust washers 25, fixed on the inner tubes 19, limits the longitudinal movement of the latter, resulting from friction when installing heat

6 on pipes 19, in the process of assembling the block. To supply liquid refrigerant into pipes 19, they were inserted with a gap relative to the inner walls and plugs 20 of tube 26. A channel 27 was made to drain the refrigerant from pipes 19 in block housing 1, closed (mount not shown) with cover 28 with gasket 29. Tubes 26 and channel 27 are connected to a system 18 for supplying a refrigerant. The subplate 2 is fixed on the mounting plate 3 of the electrical connector 30 (the other part is fixed on the unit case (not shown), which provides electrical connection between the subunits 2, the unit and external devices. Heat flow from subunits 2 to the pipe). Bam 19 is thermally conductive in the radial direction from the outer pipe 11 of the heat 6 to the outer surface of the pipe 19. The heat connection of the subunits 2 with the cooler 14

This is accomplished by pressing the housings 10 of the heat-dissipation 6 to the cooler 14, for example, by means of a clamping strap 31 with a damping gasket 32, while the base surface is

 the bone is the surface of the coolers 14, and the pipes 19 occupy the necessary position inside the heat stocks 6, since they are flexibly connected to the body 1 of the unit with the possibility of transverse movements relative to their longitudinal axes due to the deformation of the bellows 21. To reduce thermal resistance, the gaps between the contact surfaces The microcircuits (cases of microcircuits 5 and heat pipes 4; cases 10 of heat sink 6 and cooler 14i with external pipes 11 of heat pipes 6 and pipes 19) are filled with heat conducting paste.

When installing each subunit 2 into the housing 1, the guide element (plug) 20, and then the pipe 19 is inserted into the hole of the outer pipe 11 of the heat sink 6, and the housing 10 of the heat drain 6 moves along the surface of the cooler 14, after which the electrical connection 30 is connected to the network of microcircuits 5 installed on heat pipes 4. The heat released in the cases of microcircuits 5 passes through the layer of heat conducting paste into the heat pipes 4, causing the heat carrier to evaporate from the capillary p5 O

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of the porous structure 9. The heat carrier vapor from the internal cavities of the heat pipes 4 enters the internal cavity of the heat sink 6, and the vapor pressure 5 and hence the temperature is the same in all heat pipes 4 of the subunit 2, since the internal cavities of the heat pipes 4 and heat drain 6 communicate and the capillary-porous structure 8 of the heat sink 6 is provided with annular slots 13. Condensation of the heat carrier vapor occurs from the side of the cooler 14 in the capillary-porous structure 8, which covers the housing 10 of the heat sink 6, as well as on the heated top spine of the outer tube 6, the heat sink 11 adjacent to the tube 19, from where the condensate is withdrawn baffles 12. Skondensirovavshiys coolant by layers of a material of the wick, porous structure 8 and the evaporator 9 is conveyed to the zone of heat pipes 4, and the process is repeated.

The invention allows to improve the isothermal operation of the microcircuits, since all heat pipes located on the boards are united by common hermetic heat drains and form common steam channels, which ensures equalization of pressure, and consequently, the temperature of steam in all heat pipes of each board. At the same time, the appearance of non-condensing gas will not disturb the isothermal operation of the microcircuits, since the increase in pressure and temperature in all heat pipes of the stove will occur simultaneously.

The capillary-porous structure of the heat sinks, connected to the capillary-porous structure of heat pipes located on the boards, makes it possible to organize a single hydraulic circuit for all heat pipes of each staff and reliable supply of each heat pipe with heat carrier.

Claims (1)

Invention Formula An electronic unit containing a corpora, subunits installed in it, made in the form of circuit boards with heat pipes, on one ends of which microcircuits are installed, and the other ends are arranged with thermal contact with heat exchangers that are installed in a housing with thermal contact with a common cooler, It is characterized by the fact that, in order to increase the cooling efficiency, each heat sink is made in the form of two pipes, coaxially located one relative to the other with the possibility of contact between external and internal the surfaces of the inner and outer pipes, respectively, on the outer surface of the outer pipe 1293860 6 A layer of material with a capillary-porous structure is applied, which is connected to the capillary-porous structure of heat pipes, the outer pipe of each heat outlet is rigidly fixed on the corresponding circuit board, and the inner pipe is connected to the case at one end. Editor M. Petrov Compiled by S. Dudkin Tehred A. Kravchuk Proofreader A, Zimokosov Order 398/60 Circulation 802 Subscription VNIIPI USSR State Committee for inventions and discoveries 113035, Moscow, Zh-35, Raushsk nab., 4/5 Production and printing company, Uzhgorod, st. Project, 4