SU1259591A2 - Method of making wiring of semiconductor devices - Google Patents

Description

The invention relates to welding, in particular, to methods of connecting the contact areas of wire weaving in the manufacture of semiconductor devices.

The aim of the invention is to improve the quality of semiconductor devices with high density wire wiring.

FIG. 1 shows a diagram of the method of mounting semiconductor devices; in fig. 2 - characteristic curve and loading of the wire webs h. To destruction.

The method is carried out as follows.

The welding tool 1 together with the wire 2 is combined with the contact pad 3 of the housing A of the device and the first welding point 5 is welded. After that, the jaws 6 unseal and feed the wire 2 welded up and the tool lifts up through the wire channel 7 tool. Simultaneously with the lifting of the instrument, they begin to move the device horizontally, bringing the second contact pad to the instrument. At the same time, the device with the contact pad 8 on the crystal 9 is displaced by the force that is necessary for

at such a rate that the wire 2 through the channel in the needle tool is drawn at the required angle to the plane of the contact pad. The inst, the cop is raised to the required height of the jumper 10, the fixing element 12 forming a welding jumper, for example in the form of a rigid hook, is placed under its working end 11 and fixed stationary relative to the housing of the device.

After fixing the top of the jumper, the tool 1 is lowered to the second contact pad with one hundred percent stretching of the wire 2. In this case, the device is horizontally moved in the direction of the tool 1. As a result of lowering the tool and moving the device, the downward branch of the jumper will be at the same angle as the ascending branch of the jumper. By the time the tool is lowered 1 contact pad 8 fits its working turn 115 then the second welding 13 is performed.

After that, the wire 2 is clamped with the jaws 6 for feeding and breaking the wire,. tap them from inst.unenta 1 to cabftiM wire breakage. Thus, a welding jumper of the required triangular shape is formed with the same angles of inclination of the jumper branches to the horizontal (Fig. 1). Moreover, the locking element 12 is directly at the top of the jumper.

Next, the locking element 12 is converted to the measuring as follows. The hook holder is made in the form of an elastic element (for example, a flat spring made of nickel-beryllium bronze) and, in order to use it as a fixing element, restrict its elasticity by pressing it against the fixed stop by an electromagnet. To use it as a measuring element, the rigid fixation element is liberated from the limitation (it is transformed into a flexible and elastic system — into a measuring sheet). The elastic deforma tion of the fixing element, for example, using strain gauges, is measured.

However, B is due to the fact that the friction in the channel of the tool is not constant.

five

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five

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plastic deformation of the wire during the formation of a jumper may not be sufficient to eliminate the wire and the jumper branches before the second welding.

Simultaneously with the beginning of lifting Mj-Kpoci apo4Horo HHCTpyNseHTa 1, the wire jumper is loaded with element 12, for example, by lowering the device body 4 due to the elastic properties of the elastic element on which the element 12 is fixed, B due to the fact that the force is applied. at the apex of the triangle (Fig, -2), the reactions occurring in the welded joints are equal in magnitude and directed along the axis of the wire with the same angles of inclination to the horizontal, i.e. each welded joint is tested with the same force.

The device case is lowered at a constant speed with simultaneous measurement of the magnitude of the increment of the loading force with a frequency of 1 ms, created by an elastic element, by deflection of aaa tion, for example, using strain gauges.

By knowing the amount of movement of the instrument (moving at a constant speed and measuring the magnitude of the force increment (at 1 ms intervals), the ratio of LRLR is monitored.

When forming a wire jumper in the places of transition of the welded joint to the wire and at the upper inflection point, due to the elastic properties of the welding wire, radii occur. Therefore, with an increase in the loading force at the initial moment, the wire is stretched in the region of elastic deformation, and with a further increase, the wire is bent relative to the first and second welded joints and relative to the fixing element (section ABC of FIG. 2). At the same time. The ratio LP / jif. broken (section BV, FIG. 2). With a further increase in the loading force, the wire jumper transforms into the shape of a clearly defined triangle and the loading force will be proportional to the deformation of the wire (section VG, fig. 2),. When the loading force reaches the values)., At which the plastic deformation of the wire will occur, the secondary violation of the 1 -V ratio (segment of the gas flow) occurs.

and I

Plastic deformation, as a rule, occurs in the transition zone from the welded joint 1 to the welding wire. Further days, the loading force will lead to significant plastic deformation and, subsequently, to a break in the prog). Thus, the loading of the wire jumper to the effort, is greater than. plastic deformation in the transition zone leads to a deterioration in the quality of wire wiring and the possibility of a jumper. The optimum load value is chosen such that at which repeated plastic deformation begins.

In the event of a break, the jumper is re-welded, removing the remaining wire. With satisfactory control, i.e. in the absence of a shave before reaching the force, with which

The LRLR const ratio is also broken, fixing the 1st element 12 is disconnected from the system, removed from under the jumper and retracted to the initial position.

Example. When installing a semiconductor device, the operation of the device in the microwave range and having a distance between the contact pads from 10 1.5 to A, 5 mm and between the terminal of 150 μm used aluminum wire doped with silicon 1% of the mark Ak 09 Fri 27 with a diameter of 27 μm (mechanical properties: relative elongation, tensile strength of 6j39 kgf / mm).

Installation was carried out on the installation of the type of UZS. And with the use of a tool made from a VK6 alloy. 0 The working part of the elastic element, on which the fixing element is fixed, made in the form of a hook, measured 10x30x0.8,

The deformation of the elastic element was measured with the help of strain gauges of type КТЭ7А, interconnected by a bridge circuit and with a measuring system. The height of all jumpers was made equal to 1.5 mm. The angles of inclination of the jumper branches to the horizontal plane were made equal to n in each crossing and were within 15-40.

The loading of the crossing was made by lowering the table at a speed of 1 mm / s while simultaneously raising the micro-welding tool. The force exerted by the elastic element in the top of the bridge is 4 mm long, 1.5 mm high and with angles at the base equal to 37, at the time of repeated violation of the ratio LR / ii const was 3.5 g.

All jumpers with durable, good quality connections were triangular. with equal angles at the base with

There were no cases of closures with poplar and conductor tracks of the device. Jump time and

control of its strength properties averaged 1 Сс

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2,468

Fi5.2.

Editor A. Kondrakhin

Compiled by A. Anokhov Tehred M.Hvdanich

Order 2032 Circulation 634

VNIIPI USSR State Committee

for inventions and discoveries 113033, Moscow, Zh-35, Raushsk nab., 4/5

Production and printing company, Uzhgorod, st. Project, 4

Proofreader V. Booth ha

Subject

Claims (1)

METHOD FOR MOUNTING SEMICONDUCTOR DEVICES by ed. No. 1102154, because of the fact that, in order to improve the quality of semiconductor devices with a high density of wire mounting, the jumper is formed with equal angles at the base, at the fixation point, the jumper is loaded simultaneously with lifting the tool and during the lifting process, the magnitude of the increment of the loading force is measured, depending on the magnitude of the elongation of the bridge, and when repeated plastic deformation is reached, the load is removed. kg sl