SU1243166A1 - Contact device - Google Patents

Abstract

The invention relates to electronics and can be used in the control of semiconductor devices (PP). The purpose of the invention is poking reliability of contamination. In the process of control, the PP is placed on the latch 11. By means of the pull 13, the strips 4 and the springs, the L-shaped contacts 1 and 2 are supplied to the individual PP, and the electrical parameters of the PP are monitored. Placing the curved ends of the contacts 1 and 2 in the grooves of the movable bar 4, the rigid connection of the ends of the springs 6 with the brackets 7 installed with the possibility of reciprocating movement, makes it possible to reliably press each contact. to conclusions by the force of the spring with the adjustment of this force by changing the length of the springs 6. 3 Il. 0 (L N9 00 Od O)

Description

one

12431

The invention relates to electronics, in particular, to contact devices for monitoring semiconductor devices.

The purpose of the invention is to increase the reliability of contact in the control of semiconductor devices by pressing each contact to the spring force with the adjustment of this force by changing the length of the helical coil springs.

Figure 1 shows the proposed device, side view; figure 2 is the same, top view; FIG. 3 is a section A-A in FIG. one..

The contact device contains a contact 1 and a current contact 2, made in an L-shaped form, divided into AXIS with a dielectric pad 3, which is glued or sprayed to one of the contacts, a movable bar 4 with slots 5, a spring 6, a bracket 7, a housing 8c a guide 9, having a groove 10, a retainer 11, a spring 12, 13 and 12, a screw 14., which secures the bracket 7 to the housing 8.

In the slots 5, the bent ends of the contacts 1 and 2 are freely placed. The grooves 5 fix the contacts 1 and 2 in the position when the dielectric strip 3 is arranged perpendicular to the terminals of the packageless semiconductor devices.

The movable plate 4 and the housing 8 are made of a dielectric material (for example, fluoroplastic, caprolon, etc.).

The contact device works in the following way ..

The mile 13 moves to the right, along with it - the bar 4. The bent ends of the bar 4 move to the right pins 1 and 2, Pins 1 and 2 completely extend from the groove 10 of the guide 9. The latch li moves to the right and overlaps the groove 10. The semiconductor unpackaged device in the accompanying container comes from above under the action of gravitational forces into the groove 10 and stops at the latch 11, after which the ha 13 is released from retention. The springs 12 move the movable Plaka to the left until it touches the core 66J

Pusam 8, Pins 1 and 2 abut against the terminals of unpackaged semiconductor devices, in this case they retreat from the movable bar 4 in the slots 5, the springs.6 stretch and, with their force npi, compress pins 1 and 2 to the terminals of the unpackaged semiconductor 15. After checking the electrical parameters of the semiconductor device, the contacts and 2 are retracted as described above, the latch 11 moves to the left, and the unpackaged semiconductor device in the container falls down under the action of gravitational forces. To ensure the reliability of the contacting device, the force is adjusted with which. corgings 1 and 2 put pressure on the terminals of unpackaged semiconductor devices. The force of the spring 6 is adjusted in the desired limits by moving with subsequent fixing of the bracket 7 on the housing 8, the bracket moving in the direction along the axis of the spring 6. To adjust, unscrew the screw 14, move the bracket 7 to the desired one. side of the slot in it and fix with screw 14.

Claims (1)

Invention Formula The contact device is mainly for the charging of semiconductor devices in a container, comprising a housing made of a dielectric material, movable therein. current and potential contacts, one, the ends of which are connected to spring elements, brackets mounted on the housing with the possibility of moving in the direction of contact, and a movable bar located in the housing, about that, in order to increase the reliability of contact, the contact faces rigidly connected to the spring elements are made bent, grooves are made in the movable bar in which the curved ends of the contacts are placed, with the microscopes installed with the possibility of reciprocating body movement and rigidly connected with the free ends of the spring elements, lvvg FIG. g / 1- / 1. Compiled by A.Zazykina Editor S.Lyzhov Tehred M.Hodanich Proofreader I.Musk Order 3719/58 765Subscription VNIIL of the USSR State Committee for inventions and discoveries 113035, Moscow, Zh-35, Raushsk nab., d.A / 5 Production and printing company, Uzhgorod, Projecto st., 4 Phage.Z