SU1202299A1 - ELECTROLYTE FOR DEPOSITING PLATINUM METAL METALS - Google Patents

ELECTROLYTE FOR DEPOSITING PLATINUM METAL METALS

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Publication number
SU1202299A1
SU1202299A1 SU3495802/02A SU3495802A SU1202299A1 SU 1202299 A1 SU1202299 A1 SU 1202299A1 SU 3495802/02 A SU3495802/02 A SU 3495802/02A SU 3495802 A SU3495802 A SU 3495802A SU 1202299 A1 SU1202299 A1 SU 1202299A1
Authority
SU
USSR - Soviet Union
Prior art keywords
electrolyte
metal chloride
platinum metal
platinum group
depositing platinum
Prior art date
Application number
SU3495802/02A
Other languages
Russian (ru)
Inventor
Н.А. Салтыкова
А.М. Молчанов
А.Н. Барабошкин
Н.О. Есина
В.А. Дмитриев
Н.И. Тимофеев
Original Assignee
Институт электрохимии Уральского научного центра АН СССР
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Институт электрохимии Уральского научного центра АН СССР filed Critical Институт электрохимии Уральского научного центра АН СССР
Priority to SU3495802/02A priority Critical patent/SU1202299A1/en
Application granted granted Critical
Publication of SU1202299A1 publication Critical patent/SU1202299A1/en

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  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)

Abstract

Электролит для осаждения металлов платиновой группы, преимущественно платины и палладия, содержащий хлорид металла платиновой группы и хлорид щелочного металла, отличающийся тем, что, с целью получения сплошных покрытий с пониженной пористостью, он дополнительно содержит хлорид алюминия при следующем соотношении компонентов, мол.%:Хлорид металла платиновой группы - 0,05 - 1,0Хлорид алюминия - 40 - 70Хлорид щелочного металла - ОстальноеThe electrolyte for the deposition of platinum group metals, mainly platinum and palladium, containing platinum group metal chloride and alkali metal chloride, characterized in that, in order to obtain continuous coatings with reduced porosity, it additionally contains aluminum chloride in the following ratio of components, mol%: Platinum group metal chloride - 0.05 - 1.0 Aluminum chloride - 40 - 70 Alkali metal chloride - The rest

SU3495802/02A 1982-07-21 1982-07-21 ELECTROLYTE FOR DEPOSITING PLATINUM METAL METALS SU1202299A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SU3495802/02A SU1202299A1 (en) 1982-07-21 1982-07-21 ELECTROLYTE FOR DEPOSITING PLATINUM METAL METALS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SU3495802/02A SU1202299A1 (en) 1982-07-21 1982-07-21 ELECTROLYTE FOR DEPOSITING PLATINUM METAL METALS

Publications (1)

Publication Number Publication Date
SU1202299A1 true SU1202299A1 (en) 1999-07-10

Family

ID=60542269

Family Applications (1)

Application Number Title Priority Date Filing Date
SU3495802/02A SU1202299A1 (en) 1982-07-21 1982-07-21 ELECTROLYTE FOR DEPOSITING PLATINUM METAL METALS

Country Status (1)

Country Link
SU (1) SU1202299A1 (en)

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