SU1123012A1 - Light-sensitive composition for producing dielectric layers of thick-film microcircuits - Google Patents

Abstract

1. THE LIGHTNING STANDARDS mol.m. 700 and an organic solvent, characterized in that, with a chain of enhanced resolution and improved rheological characteristics when applied to a substrate, the composition contains 1,2-ifaftochino-11 diazide- as a photosensitive component

Description

namely, the photosensitive compositions for the manufacture of dielectric layers of thick-film chips on ceramic substrates using the method of screen printing. Known compositions for photosensitive, pho manufacturing dielektrichesk11h layers toletogepenochnyh chip comprising a lead-glass, polymeric binder based on polyacrylates, acrylate monomers polimerizaidtonnosposobnye row, photoinitiator - zy metilo ether, benzoin ingibito nitrozodimernos Cpd ix, soedine of chromium oxide and the solvent 1. The disadvantage of such a composition is the low-resolution low resolution. With a crowbar of such a composition, it is possible to obtain the size of the channels in the dielectric layer iiioii not less than 75 microns. Closest to the proposed is a photosensitive composition for obtaining a relief image in a glaze layer, comprising pig glass containing 0.43–4.0 µm particle size, photosensitive 1,2-naphthoquinon diazide, novolac (м) gmol () orlaldehyde resin, and organic solvent. 21. A disadvantage of the known composition is the low resolving power (more than 125 µm). In addition, the known composition has rather poor properties, which does not allow it to be used for screen printing. The aim of the invention is to increase the resolution of the ability of the photosensitive composition e; 1 to manufacture dielectric layers of naked film circuits and to improve its rheological characteristics. The aim of the invention is that the photosensitive composition for the production of dielectric layers of thick-film microcircuits, including lead-containing glass: particle size 0.5-2 , 5 microns and a positive photoresist consisting of a photosensitive component, a film-forming component - novolac phenol formaldehyde with ols mol. 700 and an organic solvent, contains 1,2-naphthoquinon-diazide- (2) -5-sulfo-phyrobromo-broth novolac ({knol-formaldehyde resin) as a photosensitive component, as organic, solvent - dioxane and additionally nitrile butadiene rubber structural Formulas CH -, j, -CH CN. Average molecular weight 200QOO-300000, containing 19.5 - 41% by weight of acripic acid nitrile, 59-80.5% by weight of butadiene and aromatic LOL, m-xylene. the ratio of components, wt.%: Lead-containing glass 40,4-60,0 1,2-Naphthoquinone diazide- (2) -5-sulfoester .b novolac resin novolac resin 4,5-8,6 Novolac phenol-formaldehyde resin, mol 7007,5-14,4 Dioxane - 14,2-27,8 Nitrile butadiene rubber 1,0-2,5 Aromatic hydrocarbon, from the indicated p yes 7,8-12,2 In addition to the toga, the composition may also contain 0.1 to 5.0 parts by weight of o6-terpineol or a mixture of oC-terpineol with p-butanol ratio .1: 0.1-1: 1 Introduction to Composites of these components allow the resolution to be increased to 50 microns. In the composition of the use of butadiene-nitrile rubber brand SKI-40 average mol. 200,000-300,000 of the general formula Cn-CIS- - -CHg-cH -1 „. CN, containing 19.5-41 wt.% Nitrile acrylic acid, 59-80.5 wt.% Butadiene. As a positive photoresist, the composition contains a domestic photoresist having the following composition, in wt.%: 1,2-naphthoquinondizzzide- (2) -5-sulfoester bromide on novolac phenol formaldehyde resin 8.63; novolachne phenol-formaldehyde resin mol. m 700 14.37; dioxane 77.0. . In the examples and claims, the content of the photoresist is given by dry residue, since the concentration of the flortresist in the solution is not constant. , As an aromatic hydrocarbon in the composition using toluene, o-xylene or m-xylene. Glass grades C-279, C-bbOa and eC-273 can be used as a swine-containing glass. The choice of glass in the composition is determined by the et: n temperature and the required electrical parameters of the formed dielectric films. The composition of glass does not significantly affect the resolution. The glasses used have the following composition, wt%: SP-273 PbO45.5 SiOj29.5 ZnO18-, 5 Tyu4.0 AtjOj2.5 C-660.a PbO.62.0 .0. The particle size used in the composition of the holding glass of the glass is OiS-2, 5 microns. . Separate the particles into. separate fraction, yes. possibly., : . The integral distribution curve of the glass density of the glass used is determined by the method of sedimentation on. ttrchnoy: centrifuge Analyzette-2G- .- ;. Compositions applied t-on keram. spoons of vacuum-dense ceramic VK. 94-1 based on alumina through a nylon mesh size of hours. 58 to 58 microns. For the appearance of a mesh screen; composition drlzh.ia have z.adannymi rheological; kimi properties. they (the properties of fluidity) - - a certain degree between the deformation, e speed and the applied mechanical stress. Paste must flow through the stencil mesh of the mesh, spread out beyond the limits of the imprint on the substrate, and stretch the threads (strands). From the direction of the tee-plate. Predamal.a composition; satisfies all of this: the requirements. The use of proposed} kompoztsttsii. ceramic substrates using msto. Yes, mesh resolution allows for resolution; 50-65 microns. ... Note 1. In a porcelain lump, 2.64 g of 11.4% of paiCTiaopra in toluene, butane-nitrile rubber of the brand of the average mol. m. ZOOROR structure of the formula | d (1), containing 41 nitrile acrylic kdslhty and 59% butadiene, 15.24 g 45 3% of the rasteror-. (in terms of the rip residue) in dioxane positive photoresist FT1-3 83 and 12.12 g of lead containing is added. glasses of type STs273, containing,%: РВО.45,5; SiO 29., 5; ZnO. 18.5; TiO, i4., 0 and 2.5 size. particles of 0.5-2.5 microns. FP-383 photoresist with sderzh.t. 2.59 g of 1,2-naphthoquinonediazide (; 2) - 5-sulfoester. armored, nokolokolnoy, phenol. furmaldehyde resin., 4.31 novolannoy fedblfrrmdegidnoy resin mol.m. 700 and 8.34. .g dirksaia. The mixture is carefully ground to homogenize and averaging the composition, first in a porcelain lump for 5 minutes and then on a paste-2. .4 grater with caprolon and rolls for 30 min. A photosensitive composition is obtained with a viscosity that provides good rheological properties for application. screen printing house, next to the following, wt.%: .. Lead-containing glass .40,4 Photosensitive compost nent3,6 Novolachna phenol-formahyde resin, they say .. m. 700 14.4 Dioxane27.8 Butadiene nitrile rubber1 0 Toluene 7.8 The obtained photosensitive composition is applied to the ceramic drips through a nylon network of a Jta-deposition unit Sh.1-40-48 and pyitmTtra with air for 20 minutes. The deposition and drying operations are repeated twice to obtain a dried coating having thicknesses of gus p 35 microns. The dried layer of the latex coating composition is built up for 1.5 minutes with a 375W mercury lamp through a photo-template with a topological pattern to determine the resolution containing 25–200 µM wide lines and 25–300 µm between them. The layer is developed with a 0.5% solution of trisodium phosphate, washed with a polished water, dried at 150 ° C for 60 minutes for 10 minutes in a conveyor oven at. The thickness of the entire layer is 21 microns. As a result of this treatment, channels are formed in the bottom layer. The width and thickness of the microscopes measured with a UYM-21 microscope are 1 μm and 60 μm. Example 2h A light-sensitive pooch is prepared in analogy to example 1. Take a 4-, 14 g of an 11.6% solution in Otksnlod Butadiene-Nitrile Rubber-SGHSH-40, similar to Example G, mixed with 10.86 g of 45.3% - a solution (in terms of dry residue). In the dnoxane of the photoresist OP-383, consisting of 1.84 g of 1,2-naphthrinone-dnazid- (2) -5- sulfrafirma of the brewed body-wolf phenolfluorine resin, 3 , 08 g of a phenol-formaldehyde resin and 5.94 g of duxan, after which 15.0 g of lead-containing glass SC-273 with a particle size of 0.5-2.5 μm are added. The composition of the COMPOSITIONS is as follows, in wt%: Lead-containing glass 50.0 Light-emitting component6.2 Novolac phenol-formaldegnd resin mol. m. 70010.3 Dioxane19.7 nitrile butadiene rubber1.6 o-Xylene12.2. The thickness of the dried layer is i 35 µm, the thickness of the burnt layer is 21.2 µm. The resolution of the composition is determined as in Example 1, but with an exposure time of 2 minutes. It makes up. 65 µm. Prl m a r 3. Take a 4.14 g of an 18.1% solution in o-xylene of a butadiene-hydroxy resin, analogous to Example 1, but with an average mol. 200,000, hang from 7.86 g of 45.3% solution (in terms of dry residue) in FP-383 positive photoresist dioxane consisting of 1.35 g of 1,2-naphthochne 101Schiazide- (2) - 5-sul of a framed brominated novolac phenol-formaldehyde resin, 2.25 g of a novolac phenol-formaldehyde resin and 4.26 g of dioxane, Xtrbavl 18.0 g of lead-containing glass SC-273 with a particle size of 5 microns. The composition of the resulting photosensitive lump 11031 EXTERNAL slushy, wt.%: Spinets containing steyuyu 60.0 Light-sensitive component. 4.5 Movolachna fe olformaldedepschna resin mol: m. 7007.5, Dioxap: 14.2 Nitrile-butadiene rubber 2.5 o-Xylol 11.3 1 dcm of the dried layer 35.3 μm, the thickness of the burn layer 21.0 μm. The resolution of the composition is 65 µm with an exposure time of 2.5 minutes. Example 4. A photosensitive room is prepared analogously to example 1 of 2.1 g of a 7.1% solution in toluene of nitrile-butadiene rubber, analogous to example 3,. 12.0 g of 41.2% pactBopa (in terms of cyxyl residue) in dioxane FP-383 positive photoresist, consisting of 1.85 g of 1,2-naphthochion and 11as1ooch- (2) -5-sulphosphir of brominated 1 ovolac phenol-formaldehyde resin, 3.09 g of novolac phenol-formaldehyde resin and 7.06 g of dioxane, 15.9 g of lead-containing glass SC-273 with a particle size of 0.5 -. 2.5 microns. The composition of the comnotation is as follows, in wt%: Svipets containing glass 53.0 Sensitivity and comnotion 6, 2 Iovolac phenol-formaldehyde resin my. m. 70010.3 Dioxane 23.5 Nitrile-butadiene rubber 0.5 Toluene6.5 The thickness of the rapid layer is 35 μm, the thickness of the burnt layer is 21 μm. The resolution of the composition is determined as in Example 1. It is 80 µm and corresponds to the resolution of the known 1COMPOSIDIN. Example 5. A photosensitive composition was prepared analogously to an example from 5.1 g of a 18.8% solution in toluene of a butadiene-nitrile rubber, analogous to example 1, 9.9 g of a 50.0% solution (calculated on the dry residue) in dioxane FG1-383 positive photoresist, consisting of 1.86 g of 1,2-naphthoquinon-diazide- (2) -5-sulphosphir of brominated phenol-formaldehyde novolac. resin, 3.10 g Novolashy phenol-formaldehyde resin, 4.94 g of dioxane and 15.0 g of lead-containing glass SC-273 particle size of 0.5-2.5 microns. The composition of the composition is as follows, wt.%: Glass holding glass 50.0 Photosensitive component 6.2 Novolac phenol formahyde resin, mole, m. 70010.3 Dioxane 16.5 Nitrile-butadiene rubber 3.2 Toluene 13.8 The resulting photosensitive composition has poor rheological characteristics: when applied onto a substrate by screen printing, it clogs the stencil mesh, and the applied layer also has an Uneven crater-like surface. Example 6. A photosensitive composition was prepared analogously to example 1 of 2.64 g of 11.4% pacTjopa in toluene of butadiene nitrile rubber, analogous to example 1, 10.86 g of 45.3 g} of south solution (calculated on the dry residue); dioxane positive photoresist OP-383, consisting of 1.84 g of 1,2-naphthoquinone diazide- {2) -5-sulfoester of the brominated novolac phenol-formaldehyde SMOL, 3.08 g of novolac phenol-formaldehyde resin, 5.94 g of dioxane and 15.0 g lead-containing glass SC-273 size. rum particles 0.5-2.5 microns. Additionally, 1.5 g of si-terpineol is added to the composite. Komnosiad has the following composition, wt.%; Lead-containing glass 50.0 Light Sensitive to your component. nent.6,2 Novolzna phenol-formaldehyde resin a mol.m. 70010.3 Dioxane19.7 Nitrile-butadiene:. rubber .1.0 Toluene .7.8 oi-Terpineal5.0 The thickness of the 1-layer is 35 µm, the thickness of the ignition layer is 21 µm. The resolution of the composition was determined to be 1E. Analogously to primer 1. It is 50 microns. Example 7. A light-sensitive composition is prepared analogously to Example 6, but is used

use a mixture of 0.75 g of o-terpineol and

0,7S g n-butanol,

 The composition of the resulting composition is as follows.

wt.%: Lead containing glass 50.0

Photosensitive Comp .6.2

Novolacna feiolformaldehyde resin mol.m. 70010.3

.Dioksan19,7

. Butadiene nitride rubber 1.0

Toluene; / 7,8

o (1: -Ter1t e.ol.: 2.5

n-Butachol2,5

The thickness of the dried layers was the same as in Example 6. The resolution of the film was determined as in Example 1. It was 50 µm,

P p | - and m. 8. Light-sensitive dielectric detector is prepared similarly to Example 1 of 4.11 g of a 10.9% solution in 1.3 Dimet lbenolaol (m.xnlle) butadiene-nitriphenogram rubber mol.m. 200,000 with terminal M1-methacrylate groups, containing 19.5% of acryl nitrile ACID. 1.1, 80.5%: butadiene and 10.8.6 g of a 45.3% divider - (in terms of dry residue) in a positive dose, photoresist OP-383, composed of 1,84. g 1,2-naf.tkhiirindiazD (2) -5-sulfose: Fnrum plated. novolac feiolformaldetidai .. resin, 3.08 g novolosho.y phenol resin, resin, shgalog1} chrr ave. 1, 5.94 g of dnoxane and 15j0.r SC-273 glass of SC-273 size. rum particles 0.5, -2.5 microns. . Additionally, the composition is entered. 0; 03 g. (If ttergasheol.

Kr.mprz .. has the following composition, wt.% :. ,

.CE.Initsso.rzhaschee glass50.0

Photosensitive - portable 6.2 Novolacna fenrformal-. Dendna Smrla mol.m. 70010.3

Dirks 19.7

Bout NNT / 1N rubber1,5

m-xylene12.2

about - Te rpi n.eol 0,1

The thickness of the dried and burned layers is similar to Example 6. The disrupting clear of the composition is determined by the analogue of example 1. It is 55 microns.

Example 9. The photosensitive composition is prepared analogously to example 1. 2-, 82 g of a 10.67 ° -nr solution in toluene butadiene-1pcs-grilny rubber, ayapsht1chnogr prnme.ru 3, mixes with 10.86 g 45.3% a solution (in terms of dry residue) in dioxane of the FP .-- 383 organic-conscious photoresist, consisting of 1.84 g of 1,2-naphthoquinone nazid- (2) -5-sulfoester of brominated novolac phenol form

dehydrogenous resin, 3.08 g of 1 volvac goy phenol-forming resin, 5.94 g of dioxane and 15.0 g of lead-containing glass SC-273. particle size of 0.5-2.5 microns. Additionally, 1.32 g of a mixture of oi-terpineol and nbutanop are introduced into the composition in a weight ratio of 1: 0.1.

The composition has the following composition, wt.%:

.Sin-containing glass 50,0

Light-sensitive component 6.2 Novolac Phenol-formaldehyde resin mol.m. 70010.3

Dnoksan19,7

Nitrile butadiene rubber1,0

Toluene 8.4

oi - Terpineol.4,0

n-Butanol0.4

The thickness of the dried and augmented layers is similar to Example 6.

The resolution of the compo: eicin onpf is similar to Example 1. It is 50 microns.

Example 10. Preparation of a light-sensitive COMPOSITSI, not containing a solution of nitrile-butadiene rubber in an aromatic carbon type. In the porcelain dish, 1-2.0 t of SC-273 containing glass SC-273 are displaced to the particle size of 0., 5-2.5 μm from 18.0 g of a 19.50% solution (in terms of dry residue) in dirxane of a positive photosensitization OP -383, consisting of 1, .32 g, 1, .2-naphthoquinone diazide- (2) -5-sulfrafirme brrnnrrvannon novolachnogo fenrfrmaldegvdnry resin, 2.19 g of the sterile frillfrrk aldehyde smrly and 144, 4, 144, 144, 4, 3, 1,. cp The mixture is carefully pereterat with the purpose of homogenization and averaging of the composition in the same porcelain stash, as this is given on the roll pastry, see the 1 gr. Rub of ohm from the rolls.

COMPOSITE has the following composition, wt.% LeadSod "neigh glass 40,0

Photosensitive kompr1knt4,40

Novrachla phenol formaldegndna shola mrl. 7007.30 m

Dirksan48,10

It is not possible to apply the pRvn1M layer to the substrate using the net-scan method, since it flows from the squeegee and spreads over the substrate. The above composition of the centrifuge and the processing of the layer are carried out analogously to example 1. The resolution of the composition determines the analogy of HP to example 1. It is 100 microns.

The proposed photosensitive composition for the manufacture of dielectric layers of thick-molded microcircuits has a higher diffusion capacity than that known for obtaining a channel

.9112301210

in the dielectric layer width of microns. This offered composition has good

allows to significantly increase the density with rheological characteristics, that the polarization of the position of elements in thick-film microscopes is applied by screen printing with the designs, thereby increasing the degree of integration of traditional equipment for

Chip up to the third level .5 of making thick-fiber microcircuits.

Claims (3)

1. A LIGHT-SENSITIVE COMPOSITION FOR MANUFACTURE OF DIELECTRIC LAYERS OF THICK-FILMED ICES on ceramic substrates of alumina using the method of screening, including lead-containing glass with a particle size of 0.5-2.5 microns and a positive photoresist, consisting of a photocarbon resin, a photo-sensitive film-forming component, which is a photocarbon resin .m. 700 and an organic solvent, characterized in that, in order to increase the resolution and improve the rheological characteristics when applied to a substrate, the composition contains as a photosensitive component 1,2-naphthoquinone diazide- (2) -5-sulfo ester of brominated novolac phenol-formaldehyde resin, as an organic solvent, dioxane and additionally butadiene-ytrile rubber of the structural formula CN average mol.m. 200000-300000, containing ¹ 19.5-41 wt.% Nitrile, acrylic acid, 59-80.5 wt.% Butadiene and an aromatic hydrocarbon selected from the series toluene, o xylene, m-xylene in the next FDI components, wt. %: Lead glass 1,2-Naphthoquinondiazide- (2) -5- - sulfonated ether brominated novolac phenol-formaldehyde resin Novolac phenol-formaldehyde resin mol. m. 700 Dioxane Nitrile butadiene rubber Aromatic hydrocarbon from the specified series 2. Composition by π. 1, about t l the ratio of 40.4-60.0 4.5-8.6 7.5-14.4 14.2-27.8: 1.0-2.5 7.8-12.2 and the part with the fact that it additionally contains 0.1-5.0 parts by weight. c. 1.0 1 1123012