SU1067080A1 - Stabilizer of chemical copper-plating solutions - Google Patents

Abstract

The use of a diaeolin of the general formula; As a stabilizer of a solution; | a ruve for chemical copper plating.

Description

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O 00 The invention relates to chemical copper plating and can be used in the metallization of dielectric metals and in the manufacture of printed circuit boards. It is known to use a stabilizer of pyridine derivatives, in particular, 2.2 dipyridine as a stabilizer of solutions for chemical copper plating of dielectrics containing copper salt, complexing agent, sodium hydroxide, sodium carbonate f17. However, the known stabilizer does not provide high quality copper precipitation. Copper recovered from a known solution is dark, porous, rapidly oxidized in air, has insufficient adhesion to the foil and to the adhesive. A multicomponent stabilizer of solutions for chemical copper plating is known, containing a compound of divalent sulfur, potassium ferrocyanide and alkylene amine f2J. The solution with this stabilizer provides high quality coatings at a high copper deposition rate (up to 100 µm / h). The purpose of the invention is to find stabilizers that allow Qadim not only to stabilize the solution for chemical copper plating, but also to simplify its composition and to obtain dense crystalline coatings, not oxidized in time. This goal is achieved by using diazoline {3-methyl-U-basyl -1,2-3,4 tetrahydrocarboline-naphtha, ling-1.5 disulfate) of the general formula (V-CHj, H) .l solution stabilizer for chemical plating. Diazolin is a well-known substance and is used in medicine as an antiallergic drug 13. The stabilizer tests are carried out in a solution for chemical copper plating. The proposed stabilizer is tested in the following solutions for chemical copper plating. Composition J. contains: Copper salt (sulfuric acid or nitric acid) 100 Sodium hydroxide 80 Potassium-sodium tartrate 200 Trilon B30 Potassium rhodanate 0.4 Diazoline (3-methyl-9benzyl-1, 2,3,4-tetrahydrocarbolino naphthalene-1, 5- disulfate) 0.08 Formalin 37%, 40 ml pH of the solution 13.0-13.5, operating temperature 18-25 C. Composition I contains: Copper salt (sulfuric acid or nitric acid) 30 Sodium hydroxide 30 Potassium-sodium tartrate 120 Trilon B15 Potassium rhodium 0.1 Diazolin (Z-methyl-9benzyl-1, 2,3,4-tetrahydrocarbolino-naphthalene-1, 5-disulfate) 0.03 .., Formalin 37%, ml of pH 15.4 12.4-13.0 working tempera cheers 18-25 C. When a copper plating solution composition of speed reduction copper 1416 .mu.m / h, the solution stability of 10-12 hours, the precipitate is dense, intense pink, not oxidized over time. During the copper plating in the composition solution, the recovery rate of copper is 23 µm / h, the stability of the solution is 20–25 h, the precipitate is bright, intensely pink, fine-crystalline, dense. Optimal results on speed, stability and quality of the precipitate are obtained in the following ratio of components (composition ttO: Copper salt (sulfuric acid or nitric acid) g g / l 50 Sodium hydroxide 60 Potassium-sodium tartrate170 Trilon B20 Potassium is rhodanous .0,2 Diazolin (Z-methyl -9ben zil-1,2,3,4-tetra hydrocarbolino naphthalene 1, 5-disulfate) 0.06 Formalin 37%, ml 20 pH of solution 12.4-13.2, temperature 18-25 sec. Copper reduction rate 8-12 µm / h, stability in operation for 2-D weeks in. depending on the load. Loading density of 3-4 dm per 1 liter of solution. concentrate is prepared. To prepare the solution, these components, with the exception of Trilon B, are dissolved separately in small amounts of water in the calculated amount. Trilon B is dissolved in sodium hydroxide solution, potassium tartrate solution is poured into it, then salt solutions are added with stirring copper, potassium rhodanate (or iron-synergistic) and stabilizer (diazolin). Bring it with water to the desired volume. Formalin is added before starting work, the induction period is 0.5-1

min In the work process, the solution is corrected by analyzing the main components with a concentrate, which is prepared in the same way as the main solution, but the concentration of the components in it is increased four times. Formalin is added during the course of the work.

Due to the use of the anti-allergic drug diaeolin, which is well-known in medicine, as a solution stabilizer for chemical copper plating, the resulting coatings are intensely pink in color, glossy, fine-grained, solid and irregular in thickness (the uniformity coefficient is close to unity). The elasticity of the sludge is determined by the number of bends and is 4-5 bends.

The copper content in the sediment is 99.12-99.75%.

The conductivity depends on the thickness of the sediment. The thickness of the copper in the holes of the printed circuit boards is determined by the thin section method. The deposition rate on the copper foil is determined by the gravimetric method. The adhesion of the coating to the dielectric is determined on a tensile testing machine of the MIP-10 type; it is 1,502,000 g / cm. With copper foil, the coating cannot be separated; no fracture is observed at the fracture.

The diazoline solution is stable in operation, provides high quality copper precipitation and can be used for

The metallization of printed circuit boards, dielectrics and plastics, makes it possible to avoid galvanic copper plating.

Claims (1)

The use of diazolin general ^: formulas as a stabilizer of solutions for chemical copper plating.