SU1037360A1 - Accumulator - Google Patents

Abstract

The DRIVE, mainly for integrated circuits, contains a base with sockets for integrated circuits made in the form of longitudinal axes: it consists of protrusions, fixators ff for integrated circuits, a spring, integrated circuit sensors mounted above each longitudinal direction of the protrusion, and a mechanism overloading integrated circuits, characterized in that, in order to improve operational capabilities, in each of the longitudinal guides of the base sockets, longitudinal grooves are made to accommodate the leads-integrated lnyh schemes, as integrated circuits overload mechanism is formed as a strap with a recess in which the comb is installed, the number of teeth of the comb contributes chAslu guide projections nest base 22 .m if oo SLE 01. f

Description

The invention relates to microelectronics and can be used in the manufacture of semiconductor products, in particular, in the manufacture of integrated circuits (ICs and large integrated circuits (.SIs) in DIP cases with different widths, lengths, and body heights. The drive is known A metal plate with rectangular protrusions, the distance between which corresponds to the pitch of the rows of the transport cassette.When this width of the protrusion is made equal to the width of the IC in the case of the DIP, and the height is sufficient for laying the IC without touching CIJ plate leads The disadvantage of this device is the impossibility of working with the cores themselves of different widths due to a strictly defined size of the protrusion.In addition, the device’s performance is low because overloading products from the drive into the transport cassette results in downtime. devices for removal and installation of the storage device. The storage capacity is limited, since it must be equal to the capacity of the transport cassette, and an increase in the capacity of the latter causes an increase its size and the associated additional difficulties during transportation. Closest to the proposed is a drive containing a base with sockets for integrated circuits made in the form of longitudinal guides, clamps for integrated circuits, a cover, sensors for integrated circuits installed under each longitudinal guide protrusion, and an overload mechanism for integral schemes .2. However, a known drive does not allow working on different integrated circuit sizes. The purpose of the invention is to improve operational capabilities. This goal is achieved by the fact that in the accumulator, mainly for integrated circuits, comprising a base with sockets for integrated circuits made in the form of longitudinal guides, clamps for integrated circuits, a cover, sensors for the presence of integrated circuits mounted above each profile guide protrusion, and the overload mechanism of integrated circuits, in each of the longitudinal guide protrusions of the base are made of longitudinal grooves for placement of conclusions, integrated circuits, and the overload mechanism of integrated circuits the diagrams are made in the form of a bar with a groove in which a comb is installed, the number of teeth of the comb corresponding to the number of guides of the base sockets. FIG. 1 shows a drive., General view, top view; in fig. 2 is a front view of the drive, section A-A in FIG. 1 / in FIG. 3 is an interworking scheme; microswitch cross section bb in fig. one; in fig. 4 —the scheme of overloading parts into a foam box. Section BB of FIG. 3. The accumulator comprises a base 1 with guides 2, each of which is made in the form of a protrusion with grooves between them, the width of one of the protrusions being equal to the width of the smallest body, and the width of the protrusion with the adjacent groove and the other protrusion being equal to the width of the next frame DIP.-Over the guides 2 on the four columns 3 there is a cover 4, which forms a closed channel for the IC 5 with the projections, varying in height due to the fact that cylindrical compression springs are installed between the base 1 and the cover 4. The lid is held on the columns with the help of nuts 7. Leave or tighten the nuts, you can change the gap between the lid and the protrusions of the guides depending on the height of the IC case. At the exit of the rails opposite the protrusion of each rail there is a spring-loaded stopper 8 mounted on axis 9. Microswitches 10 are located under each stopper 10. At the bottom of the drive base there is a me- The overload of the IC from the accumulator to the transport cassette, made in the form of a strip 11 with a groove 12, in which the comb 13 is located with a possibility of moving along the groove, the number of teeth 14 of which is equal to the number of guides, and their spacing is equal to the step of the guides. The tooth 14 serves to install the transport cassette 15 and to transfer the IC from the store- and-pit into the cassette. Together with the stopper, the teeth serve as a mounting element for the cassette, wherein the distance between the stopper and the tooth corresponds to the total width of the protrusions and pits of one guide and varies depending on the width of the IC case. In the lead-in part of the accumulator, on each of the protrusions (Fig. 2) and on the lid 4, through slots 1b are coaxially formed. Over each groove 16, strips 17 are installed with light sources 18, and under base 1, photosensors 20 are installed under each groove 16 in bar 19. Strips with photosensors and light sources are rigidly interconnected by means of, for example, racks 21 and can be moved from along the guides within the grooves 22, are made at the base 1 and are commensurate with the grooves 16, the spacing of the light sources and the photosensors is equal to the pitch of the guides. The drive works as follows. ; From the transport tray (not shown) of the IC 5 one by one or several pieces are fed to the input of an obliquely mounted drive. Due to the presence of protrusions and depressions between them, along one guideline 2, ICs with shells of different widths can pass through, retaining their orientation. The passage through the guide 2 of the accumulator, the IC 5 stops at the stopper 8, the subsequent ICs gradually accumulate in the channel. The IC count and the filling directions are controlled by the photosensors 20. Depending on the length of the IC case, the strips with the light sources 18 and the photosensors 20 can move along the through grooves 22, providing the largest number of ICs in the accumulator. When one rail 2 is fully loaded, the next one starts loading. Before unloading the IC 5 from the drive into the transport cassette 15, the comb 13 moves along the groove 12 and is set in accordance with the width of the IC case (Fig. 3 d, e). The transport cassette 15, when docked with the guide 2 of the accumulator, is based on one of the teeth 14 of the comb 13 and the stopper 8 and presses the stopper; and the IC 5 with the guide 2 is moved to the cassette 15. In this case, the stopper presses the corresponding microswitch 10, which gives a signal that prohibits the IC from being fed into this K51nal. After disconnection from the transport cassette, the stopper returns to its original position, again closing the channel. Microswitch 10 generates a signal to the control device (not shown to be able to load into the empty channel. The proposed drive, due to the presence of protrusions of different widths and depressions on the guide, makes it possible to work with ICs that have shells of different widths due to the possibility of moving the cover in height relative to the direction with housings of various heights (a) movement of sensors for the presence of products along guides — with housings of equal length. All this expands the technological capabilities of the storage device, allows to carry out operations with schemes having different frame sizes. The drive can be used in a set of equipment consisting of a punching and stacking machine, a labeling machine, a pass-through chamber and a sorter with one drive used in each piece of equipment.

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Claims (1)

STORAGE, mainly for integrated circuits, containing a base with sockets for integrated circuits, made in the form of longitudinal guide protrusions, latches F"./ ιφ · φ ··-φ-Ф- · -Ф- 4 -Ф -Ф- ^ <p -φ φ- φ- -φ -φ -φ - ((φ)) L • for integrated circuits, a cover, sensors for the presence of integrated circuits installed above each longitudinal guide protrusion, and an overload mechanism for integrated circuits, characterized in that, in order to improve operational capabilities, longitudinal grooves are made in each of the longitudinal guide protrusions of the base sockets for placing the terminals integrated circuits, and the overload mechanism of integrated circuits is made in the form of a strap with a groove in which the comb is installed, while the number of teeth of the comb contributes to the number of guide rails Stand base sockets. @