SU1035656A1 - Method of producing laquer film capacitor dielectric - Google Patents

Description

The invention relates to an electronic technique and can be used to produce a lacquer capacitor dielectric with an interlayer metallization. A known method of manufacturing a lacquer capacitor dielectric with a thickness of 1-3 µm. A disadvantage of the known solution is the penetration of metal by defects in a thin lacquer layer of a dielectric. The closest to the proposed technical result and the achieved result is a method for producing a lacquer capacitor dielectric, which includes the sequential application of itajiOK (Spoon sublayer, lacquer layer, metal layer, outer lacquer layer, and dividing the dielectric from the substrate with sublayer 2. However The inadequate stability of the electrical characteristics of a varnish-film dielectric is achieved. The purpose of the invention is to improve the stability of the electrical characteristics of a varnished film dielectric. Lena goal is achieved by the fact that according to the method of producing a lacquer capacitor dielectric, which includes the sequential deposition on the substrate of a sublayer, a lacquer layer, a metal layer, an outer layer and the separation of the dielectric from the substrate with a sublayer on the additional substrate, sequentially depositing the sublayer, varnish layer and the lacquer layer, then after deposition of the metal layer on the main substrate, twinning of both substrates is performed, the double substrates are heat treated at 120-130C for 5-6 hours before they stick together and separate A cover on both sides of the dielectric. Figure 1 shows a diagram of the preparation of a lacquer capacitor dielectric with interlayer metallization, according to the prototype; figure 2 is the same, the proposed method. In Figures 1 and 2, the following is marked: I - substrate ka, 2 - sublayer, 3 - first lacquer layer, 4 - metal layer, 5 - second lacquer layer, 6 - additional layer. Example l.Ha paper substrate with a polyethylene wax undercoat is applied with a lacquer layer of cellulose triacetate, the thickness of which after drying is 0.50, 6 microns, and a layer of polyvinyl chloride with a thickness of 0.1-0.2 microns on it. The total thickness of the layer obtained is 0.7 µm. To obtain cellulose triacetate and polyvinylbutyral solutions, the same solvent uses a mixture of dichloroethane and ethyl alcohol. A lacquer capacitor dielectric is made in the form of rolls. The surface of the lacquer layer of one of two identical rolls is metallized with an alkyne in vacuum. Next, the rolls are cut into strips with a width of 15-20 mm, after which the metallized and non-metallized strips are wound into one, or roll, and the lacquer layers are arranged opposite to each other. Adhesion of layers of a lacquer capacitor dielectric is achieved by heat treatment of the roll at 120-130 ° C for 5-6 hours. After separating the paper backing from both sides, a lacquer dielectric is obtained. interlayer metallization. The thickness of the dielectric is 1.4-0.1 microns. Example 2 A lacquer layer of cellulose triacetate, the thickness of which after drying is 1, 1 µm, is applied to a paper backing with a sublayer of polyethylene wax. The surface of this lacquer layer is metallized with aluminum under vacuum. A lacquer layer of cellulose triacetate with a thickness of l, 3FO, l µm is applied to another roll with a paper substrate and a base layer of polyethylene wax, and a layer of polyvinyl butyral with a thickness of 0.1-0.2 µm is applied to it. Then both rolls are wound into one roll, and the lacquer layers are arranged towards each other. The adhesion of the layers of the lacquer dielectric is achieved by heat treatment of the roll with sdvlennymi layers at 120-130 s for 5-6 h, after which the roll is cut into strips 35 + 0.1 mm wide and the paper substrate is separated with a sublayer on both sides of each strip. Get lakoplenogo dielectric interbubbling metallization. Thickness of dielectric. Microns. Using the proposed method for producing a lacquer capacitor dielectric with interlayer metallization provides, in comparison with the known method, it is possible to obtain both dielectric layers from the same polymer solutions without degrading the quality of these layers and the metal layer. This simplifies the technology of producing a varnished film dielectric with an interlayer metallization, since it eliminates the need to use different polymers and solvents for the first and second layer and improves the stability of the electrical characteristics of the dielectric. For a dielectric with a thickness of less than 2 microns, the proposed method also allows a higher yield when separating the dielectric from the substrate.

eliminating the curl effect of the film, which is a consequence of the symmetrical arrangement of the paper substrate on both sides of the dielectric.

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Claims (1)

METHOD FOR PRODUCING A VARNISH-FILMED CONDENSER DIELECTRIC, comprising sequentially applying a sublayer, a lacquer. Layer, a metal layer, an outer lacquer layer and separating the dielectric from the substrate with a sublayer, characterized in that, in order to increase the stability of the electrical characteristics of the varnish-film dielectric when receiving the varnish films polymer solutions, a sublayer, a varnish layer and an additional varnish layer are successively applied to the additional substrate, then after applying the metal layer on the base hydrochloric substrate produce twinning both substrates, heat treatment is dual substrates at 120-130 ° C for 5-6 hours prior to their coalescence, and separation of the substrates on both sides of the dielectric. SU .... 1035656>