SG97759A1 - Mehtod for assembling an integrated circuit package - Google Patents

Mehtod for assembling an integrated circuit package

Info

Publication number
SG97759A1
SG97759A1 SG9800262A SG1998000262A SG97759A1 SG 97759 A1 SG97759 A1 SG 97759A1 SG 9800262 A SG9800262 A SG 9800262A SG 1998000262 A SG1998000262 A SG 1998000262A SG 97759 A1 SG97759 A1 SG 97759A1
Authority
SG
Singapore
Prior art keywords
mehtod
assembling
integrated circuit
circuit package
package
Prior art date
Application number
SG9800262A
Inventor
Teng Eng Kian
Kiang Yew Chee
Original Assignee
Texas Instr Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instr Singapore Pte Ltd filed Critical Texas Instr Singapore Pte Ltd
Priority to SG9800262A priority Critical patent/SG97759A1/en
Publication of SG97759A1 publication Critical patent/SG97759A1/en

Links

SG9800262A 1998-02-06 1998-02-06 Mehtod for assembling an integrated circuit package SG97759A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG9800262A SG97759A1 (en) 1998-02-06 1998-02-06 Mehtod for assembling an integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9800262A SG97759A1 (en) 1998-02-06 1998-02-06 Mehtod for assembling an integrated circuit package

Publications (1)

Publication Number Publication Date
SG97759A1 true SG97759A1 (en) 2003-08-20

Family

ID=29707939

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9800262A SG97759A1 (en) 1998-02-06 1998-02-06 Mehtod for assembling an integrated circuit package

Country Status (1)

Country Link
SG (1) SG97759A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0387066A1 (en) * 1989-03-09 1990-09-12 Hitachi Chemical Co., Ltd. Process for connecting circuits and adhesive film used therefor
JPH0438859A (en) * 1990-06-04 1992-02-10 Hitachi Ltd Electronic component assembly structure and assembly method
JPH06188281A (en) * 1992-08-19 1994-07-08 Samsung Electron Co Ltd Preparation of semiconductor package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0387066A1 (en) * 1989-03-09 1990-09-12 Hitachi Chemical Co., Ltd. Process for connecting circuits and adhesive film used therefor
JPH0438859A (en) * 1990-06-04 1992-02-10 Hitachi Ltd Electronic component assembly structure and assembly method
JPH06188281A (en) * 1992-08-19 1994-07-08 Samsung Electron Co Ltd Preparation of semiconductor package

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