SG93794G - Hybrid interconect lead frame for thermal ink jet printhead and methods of manufacture and connection - Google Patents

Hybrid interconect lead frame for thermal ink jet printhead and methods of manufacture and connection

Info

Publication number
SG93794G
SG93794G SG93794A SG93794A SG93794G SG 93794 G SG93794 G SG 93794G SG 93794 A SG93794 A SG 93794A SG 93794 A SG93794 A SG 93794A SG 93794 G SG93794 G SG 93794G
Authority
SG
Singapore
Prior art keywords
interconect
hybrid
manufacture
methods
connection
Prior art date
Application number
SG93794A
Inventor
Janet E Mebane
Lawrence W Chan
Duong Ton La
Ruben Nevarez
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/037,289 external-priority patent/US4806106A/en
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Priority to SG93794A priority Critical patent/SG93794G/en
Publication of SG93794G publication Critical patent/SG93794G/en

Links

SG93794A 1987-04-09 1994-07-14 Hybrid interconect lead frame for thermal ink jet printhead and methods of manufacture and connection SG93794G (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG93794A SG93794G (en) 1987-04-09 1994-07-14 Hybrid interconect lead frame for thermal ink jet printhead and methods of manufacture and connection

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/037,289 US4806106A (en) 1987-04-09 1987-04-09 Interconnect lead frame for thermal ink jet printhead and methods of manufacture
SG93794A SG93794G (en) 1987-04-09 1994-07-14 Hybrid interconect lead frame for thermal ink jet printhead and methods of manufacture and connection

Publications (1)

Publication Number Publication Date
SG93794G true SG93794G (en) 1994-10-28

Family

ID=26664103

Family Applications (1)

Application Number Title Priority Date Filing Date
SG93794A SG93794G (en) 1987-04-09 1994-07-14 Hybrid interconect lead frame for thermal ink jet printhead and methods of manufacture and connection

Country Status (1)

Country Link
SG (1) SG93794G (en)

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