SG88819A1 - Method and apparatus for detecting the thickness of copper oxide - Google Patents

Method and apparatus for detecting the thickness of copper oxide

Info

Publication number
SG88819A1
SG88819A1 SG200102456A SG200102456A SG88819A1 SG 88819 A1 SG88819 A1 SG 88819A1 SG 200102456 A SG200102456 A SG 200102456A SG 200102456 A SG200102456 A SG 200102456A SG 88819 A1 SG88819 A1 SG 88819A1
Authority
SG
Singapore
Prior art keywords
detecting
thickness
copper oxide
copper
oxide
Prior art date
Application number
SG200102456A
Other languages
English (en)
Inventor
Subrahmanyan Suchitra
V Samoilov Arkadii
C Mosely Roderick
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG88819A1 publication Critical patent/SG88819A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
    • G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
SG200102456A 2000-04-06 2001-04-06 Method and apparatus for detecting the thickness of copper oxide SG88819A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54435300A 2000-04-06 2000-04-06

Publications (1)

Publication Number Publication Date
SG88819A1 true SG88819A1 (en) 2002-05-21

Family

ID=24171829

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200102456A SG88819A1 (en) 2000-04-06 2001-04-06 Method and apparatus for detecting the thickness of copper oxide

Country Status (5)

Country Link
US (1) US20020186381A1 (de)
EP (1) EP1143222A3 (de)
JP (1) JP2002062115A (de)
KR (1) KR20010098462A (de)
SG (1) SG88819A1 (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6934032B1 (en) * 2002-09-30 2005-08-23 Advanced Micro Devices, Inc. Copper oxide monitoring by scatterometry/ellipsometry during nitride or BLOK removal in damascene process
TWI240326B (en) * 2002-10-31 2005-09-21 Tokyo Electron Ltd Method and apparatus for determining an etch property using an endpoint signal
US7299151B2 (en) * 2004-02-04 2007-11-20 Hewlett-Packard Development Company, L.P. Microdevice processing systems and methods
DE502004006191D1 (de) * 2004-06-01 2008-03-27 Applied Materials Gmbh & Co Kg Messvorrichtung für die Messung des Transmissionsgrads einer Beschichtung
US7388667B2 (en) * 2005-09-30 2008-06-17 Infineon Technologies Ag Optical determination of resistivity of phase change materials
JP5555908B2 (ja) * 2007-08-08 2014-07-23 独立行政法人産業技術総合研究所 光学的測定室
US20100007363A1 (en) * 2007-12-03 2010-01-14 Micrel, Inc. System and method for determining in-line interfacial oxide contact resistance
CN101769713B (zh) * 2008-12-29 2013-05-01 天津普林电路股份有限公司 多层印刷电路板内层线路层铜厚的内阻检测方法
US20120276817A1 (en) * 2011-04-27 2012-11-01 Iravani Hassan G Eddy current monitoring of metal residue or metal pillars
EP3028295B1 (de) * 2013-09-25 2020-10-21 Ev Group E. Thallner GmbH Verfahren zum bonden von substraten
CN105097427A (zh) * 2014-04-23 2015-11-25 中芯国际集成电路制造(上海)有限公司 一种监控晶片键合前金属中间层预清洗工艺的方法
CN105277598A (zh) * 2014-07-18 2016-01-27 上海电缆研究所 电工用铜杆氧化膜厚度测试装置及测试方法
CN105136880B (zh) * 2015-09-02 2018-08-17 武汉康捷科技发展有限公司 铜氧化膜厚度测量仪及测量方法
CN109579686A (zh) * 2019-01-22 2019-04-05 科瑞工业自动化系统（苏州）有限公司 一种采用电涡流传感器测量金属厚度的方法及系统
KR20220103154A (ko) 2019-12-02 2022-07-21 어플라이드 머티어리얼스, 인코포레이티드 인-시튜 챔버 모니터링을 위한 방법들
CN112038250A (zh) * 2020-08-27 2020-12-04 上海华力集成电路制造有限公司 离线监控介电层沉积工艺对铜电阻的影响的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4899055A (en) * 1988-05-12 1990-02-06 Tencor Instruments Thin film thickness measuring method
US4957370A (en) * 1984-06-21 1990-09-18 Kabushiki Kaisha Toshiba Method and apparatus for determining the degree of oxidation of an oxide coating
US5633121A (en) * 1993-04-21 1997-05-27 Fujitsu Limited Method for examining surface of copper layer in circuit board and process for producing circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5958148A (en) * 1996-07-26 1999-09-28 Speedfam-Ipec Corporation Method for cleaning workpiece surfaces and monitoring probes during workpiece processing

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4957370A (en) * 1984-06-21 1990-09-18 Kabushiki Kaisha Toshiba Method and apparatus for determining the degree of oxidation of an oxide coating
US4899055A (en) * 1988-05-12 1990-02-06 Tencor Instruments Thin film thickness measuring method
US5633121A (en) * 1993-04-21 1997-05-27 Fujitsu Limited Method for examining surface of copper layer in circuit board and process for producing circuit board

Also Published As

Publication number Publication date
EP1143222A1 (de) 2001-10-10
KR20010098462A (ko) 2001-11-08
JP2002062115A (ja) 2002-02-28
EP1143222A8 (de) 2002-01-02
EP1143222A3 (de) 2002-01-02
US20020186381A1 (en) 2002-12-12

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