SG88819A1 - Method and apparatus for detecting the thickness of copper oxide - Google Patents
Method and apparatus for detecting the thickness of copper oxideInfo
- Publication number
- SG88819A1 SG88819A1 SG200102456A SG200102456A SG88819A1 SG 88819 A1 SG88819 A1 SG 88819A1 SG 200102456 A SG200102456 A SG 200102456A SG 200102456 A SG200102456 A SG 200102456A SG 88819 A1 SG88819 A1 SG 88819A1
- Authority
- SG
- Singapore
- Prior art keywords
- detecting
- thickness
- copper oxide
- copper
- oxide
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating with measurement of absorption or reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US54435300A | 2000-04-06 | 2000-04-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG88819A1 true SG88819A1 (en) | 2002-05-21 |
Family
ID=24171829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200102456A SG88819A1 (en) | 2000-04-06 | 2001-04-06 | Method and apparatus for detecting the thickness of copper oxide |
Country Status (5)
Country | Link |
---|---|
US (1) | US20020186381A1 (de) |
EP (1) | EP1143222A3 (de) |
JP (1) | JP2002062115A (de) |
KR (1) | KR20010098462A (de) |
SG (1) | SG88819A1 (de) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6934032B1 (en) * | 2002-09-30 | 2005-08-23 | Advanced Micro Devices, Inc. | Copper oxide monitoring by scatterometry/ellipsometry during nitride or BLOK removal in damascene process |
TWI240326B (en) * | 2002-10-31 | 2005-09-21 | Tokyo Electron Ltd | Method and apparatus for determining an etch property using an endpoint signal |
US7299151B2 (en) * | 2004-02-04 | 2007-11-20 | Hewlett-Packard Development Company, L.P. | Microdevice processing systems and methods |
DE502004006191D1 (de) * | 2004-06-01 | 2008-03-27 | Applied Materials Gmbh & Co Kg | Messvorrichtung für die Messung des Transmissionsgrads einer Beschichtung |
US7388667B2 (en) * | 2005-09-30 | 2008-06-17 | Infineon Technologies Ag | Optical determination of resistivity of phase change materials |
JP5555908B2 (ja) * | 2007-08-08 | 2014-07-23 | 独立行政法人産業技術総合研究所 | 光学的測定室 |
US20100007363A1 (en) * | 2007-12-03 | 2010-01-14 | Micrel, Inc. | System and method for determining in-line interfacial oxide contact resistance |
CN101769713B (zh) * | 2008-12-29 | 2013-05-01 | 天津普林电路股份有限公司 | 多层印刷电路板内层线路层铜厚的内阻检测方法 |
US20120276817A1 (en) * | 2011-04-27 | 2012-11-01 | Iravani Hassan G | Eddy current monitoring of metal residue or metal pillars |
EP3028295B1 (de) * | 2013-09-25 | 2020-10-21 | Ev Group E. Thallner GmbH | Verfahren zum bonden von substraten |
CN105097427A (zh) * | 2014-04-23 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | 一种监控晶片键合前金属中间层预清洗工艺的方法 |
CN105277598A (zh) * | 2014-07-18 | 2016-01-27 | 上海电缆研究所 | 电工用铜杆氧化膜厚度测试装置及测试方法 |
CN105136880B (zh) * | 2015-09-02 | 2018-08-17 | 武汉康捷科技发展有限公司 | 铜氧化膜厚度测量仪及测量方法 |
CN109579686A (zh) * | 2019-01-22 | 2019-04-05 | 科瑞工业自动化系统(苏州)有限公司 | 一种采用电涡流传感器测量金属厚度的方法及系统 |
KR20220103154A (ko) | 2019-12-02 | 2022-07-21 | 어플라이드 머티어리얼스, 인코포레이티드 | 인-시튜 챔버 모니터링을 위한 방법들 |
CN112038250A (zh) * | 2020-08-27 | 2020-12-04 | 上海华力集成电路制造有限公司 | 离线监控介电层沉积工艺对铜电阻的影响的方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4899055A (en) * | 1988-05-12 | 1990-02-06 | Tencor Instruments | Thin film thickness measuring method |
US4957370A (en) * | 1984-06-21 | 1990-09-18 | Kabushiki Kaisha Toshiba | Method and apparatus for determining the degree of oxidation of an oxide coating |
US5633121A (en) * | 1993-04-21 | 1997-05-27 | Fujitsu Limited | Method for examining surface of copper layer in circuit board and process for producing circuit board |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5958148A (en) * | 1996-07-26 | 1999-09-28 | Speedfam-Ipec Corporation | Method for cleaning workpiece surfaces and monitoring probes during workpiece processing |
-
2001
- 2001-04-03 EP EP01107757A patent/EP1143222A3/de not_active Withdrawn
- 2001-04-06 KR KR1020010018208A patent/KR20010098462A/ko not_active Application Discontinuation
- 2001-04-06 JP JP2001145637A patent/JP2002062115A/ja not_active Withdrawn
- 2001-04-06 SG SG200102456A patent/SG88819A1/en unknown
-
2002
- 2002-07-19 US US10/199,878 patent/US20020186381A1/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4957370A (en) * | 1984-06-21 | 1990-09-18 | Kabushiki Kaisha Toshiba | Method and apparatus for determining the degree of oxidation of an oxide coating |
US4899055A (en) * | 1988-05-12 | 1990-02-06 | Tencor Instruments | Thin film thickness measuring method |
US5633121A (en) * | 1993-04-21 | 1997-05-27 | Fujitsu Limited | Method for examining surface of copper layer in circuit board and process for producing circuit board |
Also Published As
Publication number | Publication date |
---|---|
EP1143222A1 (de) | 2001-10-10 |
KR20010098462A (ko) | 2001-11-08 |
JP2002062115A (ja) | 2002-02-28 |
EP1143222A8 (de) | 2002-01-02 |
EP1143222A3 (de) | 2002-01-02 |
US20020186381A1 (en) | 2002-12-12 |
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