SG87801A1 - Method for measuring the depth of a trench in the surface of a semiconductor wafer - Google Patents

Method for measuring the depth of a trench in the surface of a semiconductor wafer

Info

Publication number
SG87801A1
SG87801A1 SG9901617A SG1999001617A SG87801A1 SG 87801 A1 SG87801 A1 SG 87801A1 SG 9901617 A SG9901617 A SG 9901617A SG 1999001617 A SG1999001617 A SG 1999001617A SG 87801 A1 SG87801 A1 SG 87801A1
Authority
SG
Singapore
Prior art keywords
trench
depth
measuring
semiconductor wafer
wafer
Prior art date
Application number
SG9901617A
Inventor
Qinghua Zhong
Mei Sheng Zhou
Xiao Ping Liu
Original Assignee
Chartered Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chartered Semiconductor Mfg filed Critical Chartered Semiconductor Mfg
Publication of SG87801A1 publication Critical patent/SG87801A1/en

Links

SG9901617A 1998-12-10 1999-03-31 Method for measuring the depth of a trench in the surface of a semiconductor wafer SG87801A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20891998A 1998-12-10 1998-12-10

Publications (1)

Publication Number Publication Date
SG87801A1 true SG87801A1 (en) 2002-04-16

Family

ID=22776595

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9901617A SG87801A1 (en) 1998-12-10 1999-03-31 Method for measuring the depth of a trench in the surface of a semiconductor wafer

Country Status (1)

Country Link
SG (1) SG87801A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62269004A (en) * 1986-05-16 1987-11-21 Mitsubishi Electric Corp Measuring apparatus for machined groove depth
US5023188A (en) * 1988-07-13 1991-06-11 Mitsubishi Denki Kabushiki Kaisha Method of determining the depth of trenches formed in a semiconductor wafer
EP0511448A1 (en) * 1991-04-30 1992-11-04 International Business Machines Corporation Method and apparatus for in-situ and on-line monitoring of a trench formation process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62269004A (en) * 1986-05-16 1987-11-21 Mitsubishi Electric Corp Measuring apparatus for machined groove depth
US5023188A (en) * 1988-07-13 1991-06-11 Mitsubishi Denki Kabushiki Kaisha Method of determining the depth of trenches formed in a semiconductor wafer
EP0511448A1 (en) * 1991-04-30 1992-11-04 International Business Machines Corporation Method and apparatus for in-situ and on-line monitoring of a trench formation process

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