SG81847A1 - Molding method and apparatus - Google Patents
Molding method and apparatusInfo
- Publication number
- SG81847A1 SG81847A1 SG9501843A SG1995001843A SG81847A1 SG 81847 A1 SG81847 A1 SG 81847A1 SG 9501843 A SG9501843 A SG 9501843A SG 1995001843 A SG1995001843 A SG 1995001843A SG 81847 A1 SG81847 A1 SG 81847A1
- Authority
- SG
- Singapore
- Prior art keywords
- molding method
- molding
- Prior art date
Links
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28327894 | 1994-11-17 | ||
JP28327794 | 1994-11-17 | ||
JP10183395A JPH08294919A (en) | 1995-04-26 | 1995-04-26 | Method and apparatus for molding |
Publications (1)
Publication Number | Publication Date |
---|---|
SG81847A1 true SG81847A1 (en) | 2001-07-24 |
Family
ID=27309557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9501843A SG81847A1 (en) | 1994-11-17 | 1995-11-15 | Molding method and apparatus |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG81847A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6237119A (en) * | 1985-08-10 | 1987-02-18 | Fujitsu Ltd | Molding mold and molding method |
JPS62135330A (en) * | 1985-12-09 | 1987-06-18 | Rohm Co Ltd | Transfer molding method |
JPH04129713A (en) * | 1990-09-20 | 1992-04-30 | Matsushita Electric Works Ltd | Vacuum forming metal die device |
JPH04307213A (en) * | 1991-04-05 | 1992-10-29 | Seiko Epson Corp | Transfer molding die and transfer molding device |
-
1995
- 1995-11-15 SG SG9501843A patent/SG81847A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6237119A (en) * | 1985-08-10 | 1987-02-18 | Fujitsu Ltd | Molding mold and molding method |
JPS62135330A (en) * | 1985-12-09 | 1987-06-18 | Rohm Co Ltd | Transfer molding method |
JPH04129713A (en) * | 1990-09-20 | 1992-04-30 | Matsushita Electric Works Ltd | Vacuum forming metal die device |
JPH04307213A (en) * | 1991-04-05 | 1992-10-29 | Seiko Epson Corp | Transfer molding die and transfer molding device |
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