SG81217A1 - Leadframe for integrated circuit package and method of manufacturing the same - Google Patents

Leadframe for integrated circuit package and method of manufacturing the same

Info

Publication number
SG81217A1
SG81217A1 SG9702092A SG1997002092A SG81217A1 SG 81217 A1 SG81217 A1 SG 81217A1 SG 9702092 A SG9702092 A SG 9702092A SG 1997002092 A SG1997002092 A SG 1997002092A SG 81217 A1 SG81217 A1 SG 81217A1
Authority
SG
Singapore
Prior art keywords
leadframe
manufacturing
same
integrated circuit
circuit package
Prior art date
Application number
SG9702092A
Inventor
Huang Chih-Kung
Lai Wei-Jen
Original Assignee
Sitron Prec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sitron Prec Co Ltd filed Critical Sitron Prec Co Ltd
Priority to SG9702092A priority Critical patent/SG81217A1/en
Publication of SG81217A1 publication Critical patent/SG81217A1/en

Links

SG9702092A 1997-06-19 1997-06-19 Leadframe for integrated circuit package and method of manufacturing the same SG81217A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG9702092A SG81217A1 (en) 1997-06-19 1997-06-19 Leadframe for integrated circuit package and method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9702092A SG81217A1 (en) 1997-06-19 1997-06-19 Leadframe for integrated circuit package and method of manufacturing the same

Publications (1)

Publication Number Publication Date
SG81217A1 true SG81217A1 (en) 2001-06-19

Family

ID=20429671

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9702092A SG81217A1 (en) 1997-06-19 1997-06-19 Leadframe for integrated circuit package and method of manufacturing the same

Country Status (1)

Country Link
SG (1) SG81217A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995018464A1 (en) * 1993-12-27 1995-07-06 National Semiconductor Corporation Protective coating combination for lead frames
WO1996034412A1 (en) * 1995-04-27 1996-10-31 National Semiconductor Corporation Protective coating combination for lead frames

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1995018464A1 (en) * 1993-12-27 1995-07-06 National Semiconductor Corporation Protective coating combination for lead frames
WO1996034412A1 (en) * 1995-04-27 1996-10-31 National Semiconductor Corporation Protective coating combination for lead frames

Similar Documents

Publication Publication Date Title
KR100244835B1 (en) Semiconductor chip and manufacturing methdo thereof
GB2345383B (en) Semiconductor package and method of fabricating the same
GB2304231B (en) Semiconductor integrated circuit device and method of manufacturing the same
SG79292A1 (en) Semiconductor integrated circuit and its manufacturing method
HK1109248A1 (en) Semiconductor integrated circuit and method for designing semiconductor integrated circuit
SG68658A1 (en) Semiconductor substrate and method of manufacturing the same
GB2344222B (en) Chip type electronic part and method for the manufacture thereof
EP0685878A3 (en) Semiconductor package and method of forming the same.
HK1018983A1 (en) Semiconductor substrate and strackable semiconductor package and fabrication method thereof.
GB2324411B (en) Lead frame and semiconductor package using same and fabrication method thereof
SG76592A1 (en) Semiconductor integrated circuit device and process for manufacturing the same
EP1014453A4 (en) Semiconductor device and method for manufacturing the same
EP0921542A4 (en) Chip inductor and method for manufacturing the same
GB2287326B (en) Semiconductor integrated circuit
GB2336469B (en) Semiconductor device and manufacturing method of the same
GB2322005B (en) Semiconductor device and manufacturing method of the same
EP0691679A3 (en) Process for manufacturing an integrated circuit package assembly
SG54398A1 (en) Semiconductor integrated circuit device and method for manufacturing the same
SG60044A1 (en) Semiconductor integrated circuit device and method for manufacturing the same
GB9814540D0 (en) Method of manufacturing semiconductor devices
SG68032A1 (en) Semiconductor device and method of manufacturing the same
GB2324198B (en) Tape-fixed leadframe and fabrication method thereof
SG70082A1 (en) Semiconductor integrated circuit device and process for manufacturing the same
GB9824430D0 (en) Method of manufacturing semiconductor device
SG83107A1 (en) Semiconductor memory device and method of fabricating the same