SG80600A1 - Thin stacked integrated circuit device - Google Patents
Thin stacked integrated circuit deviceInfo
- Publication number
- SG80600A1 SG80600A1 SG9803203A SG1998003203A SG80600A1 SG 80600 A1 SG80600 A1 SG 80600A1 SG 9803203 A SG9803203 A SG 9803203A SG 1998003203 A SG1998003203 A SG 1998003203A SG 80600 A1 SG80600 A1 SG 80600A1
- Authority
- SG
- Singapore
- Prior art keywords
- integrated circuit
- circuit device
- stacked integrated
- thin stacked
- thin
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG9803203A SG80600A1 (en) | 1998-09-29 | 1998-09-29 | Thin stacked integrated circuit device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG9803203A SG80600A1 (en) | 1998-09-29 | 1998-09-29 | Thin stacked integrated circuit device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG80600A1 true SG80600A1 (en) | 2001-05-22 |
Family
ID=20430070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG9803203A SG80600A1 (en) | 1998-09-29 | 1998-09-29 | Thin stacked integrated circuit device |
Country Status (1)
Country | Link |
---|---|
SG (1) | SG80600A1 (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4999699A (en) * | 1990-03-14 | 1991-03-12 | International Business Machines Corporation | Solder interconnection structure and process for making |
US5438224A (en) * | 1992-04-23 | 1995-08-01 | Motorola, Inc. | Integrated circuit package having a face-to-face IC chip arrangement |
GB2287123A (en) * | 1994-02-28 | 1995-09-06 | Mitsubishi Electric Corp | Semiconductor device substrate and test substrate |
US5578869A (en) * | 1994-03-29 | 1996-11-26 | Olin Corporation | Components for housing an integrated circuit device |
-
1998
- 1998-09-29 SG SG9803203A patent/SG80600A1/en unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4999699A (en) * | 1990-03-14 | 1991-03-12 | International Business Machines Corporation | Solder interconnection structure and process for making |
US5438224A (en) * | 1992-04-23 | 1995-08-01 | Motorola, Inc. | Integrated circuit package having a face-to-face IC chip arrangement |
GB2287123A (en) * | 1994-02-28 | 1995-09-06 | Mitsubishi Electric Corp | Semiconductor device substrate and test substrate |
US5578869A (en) * | 1994-03-29 | 1996-11-26 | Olin Corporation | Components for housing an integrated circuit device |
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