SG80600A1 - Thin stacked integrated circuit device - Google Patents

Thin stacked integrated circuit device

Info

Publication number
SG80600A1
SG80600A1 SG9803203A SG1998003203A SG80600A1 SG 80600 A1 SG80600 A1 SG 80600A1 SG 9803203 A SG9803203 A SG 9803203A SG 1998003203 A SG1998003203 A SG 1998003203A SG 80600 A1 SG80600 A1 SG 80600A1
Authority
SG
Singapore
Prior art keywords
integrated circuit
circuit device
stacked integrated
thin stacked
thin
Prior art date
Application number
SG9803203A
Inventor
Kiang Yew Chee
Waf Low Siu
Yu Chan Mun
Original Assignee
Texas Instr Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instr Singapore Pte Ltd filed Critical Texas Instr Singapore Pte Ltd
Priority to SG9803203A priority Critical patent/SG80600A1/en
Publication of SG80600A1 publication Critical patent/SG80600A1/en

Links

SG9803203A 1998-09-29 1998-09-29 Thin stacked integrated circuit device SG80600A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG9803203A SG80600A1 (en) 1998-09-29 1998-09-29 Thin stacked integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9803203A SG80600A1 (en) 1998-09-29 1998-09-29 Thin stacked integrated circuit device

Publications (1)

Publication Number Publication Date
SG80600A1 true SG80600A1 (en) 2001-05-22

Family

ID=20430070

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9803203A SG80600A1 (en) 1998-09-29 1998-09-29 Thin stacked integrated circuit device

Country Status (1)

Country Link
SG (1) SG80600A1 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
US5438224A (en) * 1992-04-23 1995-08-01 Motorola, Inc. Integrated circuit package having a face-to-face IC chip arrangement
GB2287123A (en) * 1994-02-28 1995-09-06 Mitsubishi Electric Corp Semiconductor device substrate and test substrate
US5578869A (en) * 1994-03-29 1996-11-26 Olin Corporation Components for housing an integrated circuit device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999699A (en) * 1990-03-14 1991-03-12 International Business Machines Corporation Solder interconnection structure and process for making
US5438224A (en) * 1992-04-23 1995-08-01 Motorola, Inc. Integrated circuit package having a face-to-face IC chip arrangement
GB2287123A (en) * 1994-02-28 1995-09-06 Mitsubishi Electric Corp Semiconductor device substrate and test substrate
US5578869A (en) * 1994-03-29 1996-11-26 Olin Corporation Components for housing an integrated circuit device

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