SG77680A1 - An epoxy-resin composition and use thereof - Google Patents

An epoxy-resin composition and use thereof

Info

Publication number
SG77680A1
SG77680A1 SG1999001954A SG1999001954A SG77680A1 SG 77680 A1 SG77680 A1 SG 77680A1 SG 1999001954 A SG1999001954 A SG 1999001954A SG 1999001954 A SG1999001954 A SG 1999001954A SG 77680 A1 SG77680 A1 SG 77680A1
Authority
SG
Singapore
Prior art keywords
epoxy
resin composition
resin
composition
Prior art date
Application number
SG1999001954A
Inventor
Urakami Tatsuhiro
Sugimoto Kenichi
Takuma Keisuke
Nobori Tadahito
Takaki Usaji
Original Assignee
Mitsui Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Publication of SG77680A1 publication Critical patent/SG77680A1/en

Links

SG1999001954A 1998-04-28 1999-04-27 An epoxy-resin composition and use thereof SG77680A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11957298 1998-04-28
JP11956998 1998-04-28
JP11957398 1998-04-28

Publications (1)

Publication Number Publication Date
SG77680A1 true SG77680A1 (en) 2001-01-16

Family

ID=27313851

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1999001954A SG77680A1 (en) 1998-04-28 1999-04-27 An epoxy-resin composition and use thereof

Country Status (1)

Country Link
SG (1) SG77680A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11384268B2 (en) 2017-06-26 2022-07-12 Dupont Toray Specialty Materials Kabushiki Kaisha Curable silicone composition for die bonding use

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11384268B2 (en) 2017-06-26 2022-07-12 Dupont Toray Specialty Materials Kabushiki Kaisha Curable silicone composition for die bonding use

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