SG770003A1 - System and method for locating dies cut from a silicon wafer on a wafer table - Google Patents

System and method for locating dies cut from a silicon wafer on a wafer table

Info

Publication number
SG770003A1
SG770003A1 SG1997001109A SG1997001109A SG770003A1 SG 770003 A1 SG770003 A1 SG 770003A1 SG 1997001109 A SG1997001109 A SG 1997001109A SG 1997001109 A SG1997001109 A SG 1997001109A SG 770003 A1 SG770003 A1 SG 770003A1
Authority
SG
Singapore
Prior art keywords
wafer
silicon wafer
dies cut
locating
wafer table
Prior art date
Application number
SG1997001109A
Inventor
Subramanian Balamurugan
Original Assignee
Texas Instr Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instr Singapore Pte Ltd filed Critical Texas Instr Singapore Pte Ltd
Priority to SG1997001109A priority Critical patent/SG770003A1/en
Publication of SG770003A1 publication Critical patent/SG770003A1/en

Links

SG1997001109A 1997-04-09 1997-04-09 System and method for locating dies cut from a silicon wafer on a wafer table SG770003A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG1997001109A SG770003A1 (en) 1997-04-09 1997-04-09 System and method for locating dies cut from a silicon wafer on a wafer table

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG1997001109A SG770003A1 (en) 1997-04-09 1997-04-09 System and method for locating dies cut from a silicon wafer on a wafer table

Publications (1)

Publication Number Publication Date
SG770003A1 true SG770003A1 (en) 2000-01-25

Family

ID=20429612

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1997001109A SG770003A1 (en) 1997-04-09 1997-04-09 System and method for locating dies cut from a silicon wafer on a wafer table

Country Status (1)

Country Link
SG (1) SG770003A1 (en)

Similar Documents

Publication Publication Date Title
AU6971898A (en) Method and apparatus for cooling a semiconductor die
GB9709659D0 (en) Method and apparatus for etching a workpiece
SG54995A1 (en) Method and apparatus for aligning the position of die on a wafer table
GB2303095B (en) Method and apparatus for dicing a substrate
EP0681186A3 (en) Method for probing a semiconductor wafer.
AU7596698A (en) A system and method for packaging integrated circuits
AU7758998A (en) Tool and method for processing perforations
AU3875899A (en) A system and method for inspecting semiconductor wafers
EP0603514A3 (en) Method for thinning a semiconductor wafer.
AU5823399A (en) An apparatus for holding a semiconductor wafer
AU3521700A (en) Method and apparatus for processing a wafer
AU7970398A (en) Method and apparatus for chip placement
EP0665580A3 (en) Method and apparatus for global planarisation of a surface of a semiconductor wafer.
WO2002013237A3 (en) Method and apparatus for a wafer carrier having an insert
HK1046660A1 (en) An apparatus and a method for cleaning a wafer carrier.
AU3005597A (en) Method and apparatus for manufacturing side-terminated chips
GB2297426B (en) Method and device for polishing a wafer
SG74007A1 (en) Apparatus and method for dicing semiconductor wafers
AU9129298A (en) Chip removal apparatus for machine tool
EP0847078A4 (en) Method for manufacturing semiconductor device
EP1034082A4 (en) A method for minimizing the critical dimension growth of a feature on a semiconductor wafer
GB9523733D0 (en) A chamfer grinding system for wafers
GB2326282B (en) Method for producing a semiconductor device
AU6120898A (en) Wiring forming method for semiconductor device and semiconductor device
AU1451500A (en) Apparatus for and method of manufacturing a semiconductor die carrier